Silicon Laboratories Si8451 Manuale utente

Not Recommended

for NewDesigns

Si8450/51/52/55

LOW POWER FIVE-CHANNEL DIGITAL ISOLATOR

Features

Applications

Safety Regulatory Approvals

Description

Silicon Lab's family of ultra-low-power digital isolators are CMOS

devices offering substantial data rate, propagation delay, power, size,

reliability, and external BOM advantages when compared to legacy

isolation technologies. The operating parameters of these products

remain stable across wide temperature ranges throughout their

service life. For ease of design, only VDD bypass capacitors are

required.

Data rates up to 150 Mbps are supported, and all devices achieve

worst-case propagation delays of less than 10 ns. All products are

safety certified by UL, CSA, and VDE and support withstand voltages

of up to 2.5 kVrms. These devices are available in a 16-pin narrow-

body SOIC package.

High-speed operation

DC to 150 Mbps

No start-up initialization required

Wide Operating Supply Voltage:

2.70–5.5 V

Ultra-low-power (typical)

5 V Operation:

< 1.6 mA per channel at 1 Mbps

< 6 mA per channel at 100 Mbps

2.70 V Operation:

< 1.4 mA per channel at 1 Mbps

< 4 mA per channel at 100 Mbps

High electromagnetic immunity

Up to 2500 VRMS isolation

60-year life at rated working

voltage

Precise timing (typical)

<10 ns worst case

1.5 ns pulse width distortion

0.5 ns channel-channel skew

2 ns propagation delay skew

6 ns minimum pulse width

Transient Immunity 25 kV/µs

Wide temperature range

–40 to 125 °C at 150 Mbps

RoHS-compliant packages

SOIC-16 narrow body

Industrial automation systems

Hybrid electric vehicles

Isolated switch mode supplies

Isolated ADC, DAC

Motor control

Power inverters

Communications systems

UL 1577 recognized

Up to 2500 VRMS for 1 minute

CSA component notice 5A

approval

IEC 60950-1, 61010-1

(reinforced insulation)

VDE certification conformity

IEC 60747-5-2

(VDE0884 Part 2)

Ordering Information:

See page 28.

Si8450/51/52/55

Rev. 1.6 2

Not Recommended

for NewDesigns

TABLE OF CONTENTS

Section Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

2.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

2.2. Eye Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

2.3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

2.4. Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

2.5. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

3. Errata and Design Migration Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

3.1. Enable Pin Causes Outputs to Go Low (Revision A Only) . . . . . . . . . . . . . . . . . . . .25

3.2. Power Supply Bypass Capacitors (Revision A and Revision B) . . . . . . . . . . . . . . . .25

3.3. Latch Up Immunity (Revision A Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4. Pin Descriptions (Si8450/51/52) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

5. Pin Descriptions (Si8455) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

7. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

8. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

9. Top Marking: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

9.1. 16-Pin Narrow Body SOIC Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

9.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Si8450/51/52/55

Rev. 1.6 3

Not Recommended

for NewDesigns

1. Electrical Specifications

Table 1. Recommended Operating Conditions

Parameter Symbol Test Condition Min Typ Max Unit

Ambient Operating Temperature* TA150 Mbps, 15 pF, 5 V –40 25 125 °C

Supply Voltage VDD1 2.70 — 5.5 V

VDD2 2.70 — 5.5 V

*Note: The maximum ambient temperature is dependent on data frequency, output loading, number of operating channels,

and supply voltage.

Table 2. Absolute Maximum Ratings1

Parameter Symbol Min Typ Max Unit

Storage Temperature2TSTG –65 — 150 °C

Ambient Temperature Under Bias TA–40 — 125 °C

Supply Voltage (Revision A)3VDD1, VDD2 –0.5 — 5.75 V

Supply Voltage (Revision B)3VDD1, VDD2 –0.5 — 6.0 V

Input Voltage VI–0.5 — VDD + 0.5 V

Output Voltage VO–0.5 — VDD + 0.5 V

Output Current Drive Channel IO——10mA

Lead Solder Temperature (10 s) — — 260 °C

Maximum Isolation Voltage (1 s) — — 3600 VRMS

Notes:

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be

restricted to conditions as specified in the operational sections of this data sheet.

2. VDE certifies storage temperature from –40 to 150 °C.

3. See "6. Ordering Guide" on page 28 for more information.

Si8450/51/52/55

4 Rev. 1.6

Not Recommended

for NewDesigns

Table 3. Electrical Characteristics

(VDD1 =5V±10%,V

DD2 =5V±10%,T

A= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

High Level Input Voltage VIH 2.0 — — V

Low Level Input Voltage VIL ——0.8V

High Level Output Voltage VOH loh = –4 mA VDD1,VDD2 –0.4 4.8 — V

Low Level Output Voltage VOL lol = 4 mA — 0.2 0.4 V

Input Leakage Current IL——±10µA

Output Impedance1ZO—85—

Enable Input High Current IENH VENx =V

IH —2.0—µA

Enable Input Low Current IENL VENx =V

IL —2.0—µA

DC Supply Current (All inputs 0 V or at Supply)

Si8450Ax, Bx, Si8455Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 DC

All inputs 1 DC

—

1.6

2.9

7.0

3.1

2.4

4.4

10.5

4.7

Si8451Ax, Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 DC

All inputs 1 DC

—

2.0

3.0

6.0

4.1

3.0

4.5

9.0

6.2

Si8452Ax, Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 DC

All inputs 1 DC

—

2.3

2.7

5.4

4.7

3.5

4.1

8.1

7.1

1 Mbps Supply Current (All inputs = 500 kHz square wave, CI = 15 pF on all outputs)

Si8450Ax, Bx, Si8455Bx

VDD1

VDD2

—

—4.3

3.5 6.5

5.3 mA

Si8451Ax, Bx

VDD1

VDD2

—

—4.1

4.0 6.2

6.0 mA

Si8452Ax, Bx

VDD1

VDD2

—

—4.1

4.0 6.2

6.0 mA

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of

the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

Si8450/51/52/55

Rev. 1.6 5

Not Recommended

for NewDesigns

10 Mbps Supply Current (All inputs = 5 MHz square wave, CI = 15 pF on all outputs)

Si8450Bx, Si8455Bx

VDD1

VDD2

—

—4.3

4.8 6.5

6.7 mA

Si8451Bx

VDD1

VDD2

—

—4.4

5.0 6.2

7.0 mA

Si8452Bx

VDD1

VDD2

—

—4.6

4.8 6.4

6.7 mA

100 Mbps Supply Current (All inputs = 50 MHz square wave, CI = 15 pF on all outputs)

Si8450Bx, Si8455Bx

VDD1

VDD2

—

—4.6

24 6.9

30 mA

Si8451Bx

VDD1

VDD2

—

—8.6

20.4 10.8

25.5 mA

Si8452Bx

VDD1

VDD2

—

—12.6

16.5 15.8

20.6 mA

Timing Characteristics

Si845xAx

Maximum Data Rate 0 — 1.0 Mbps

Minimum Pulse Width — — 250 ns

Propagation Delay tPHL, tPLH See Figure 2 — — 35 ns

Pulse Width Distortion

|tPLH -tPHL|PWD See Figure 2 — — 25 ns

Propagation Delay Skew2tPSK(P-P) — — 40 ns

Channel-Channel Skew tPSK — — 35 ns

Table 3. Electrical Characteristics (Continued)

(VDD1 =5V±10%,V

DD2 =5V±10%,T

A= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of

the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

Si8450/51/52/55

6 Rev. 1.6

Not Recommended

for NewDesigns

Si845xBx

Maximum Data Rate 0 — 150 Mbps

Minimum Pulse Width — — 6.0 ns

Propagation Delay tPHL, tPLH See Figure 2 3.0 6.0 9.5 ns

Pulse Width Distortion

|tPLH -tPHL|PWD See Figure 2 — 1.5 2.5 ns

Propagation Delay Skew2tPSK(P-P) —2.03.0ns

Channel-Channel Skew tPSK —0.51.8ns

All Models

Output Rise Time trCL=15pF

See Figure 2 —3.85.0ns

Output Fall Time tfCL=15pF

See Figure 2 —2.83.7ns

Common Mode Transient

Immunity CMTI VI=V

DD or 0 V — 25 — kV/µs

Enable to Data Valid3ten1 See Figure 1 — 5.0 8.0 ns

Enable to Data Tri-State3ten2 See Figure 1 — 7.0 9.2 ns

Start-up Time3,4 tSU —1540µs

Table 3. Electrical Characteristics (Continued)

(VDD1 =5V±10%,V

DD2 =5V±10%,T

A= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of

the value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

Si8450/51/52/55

Rev. 1.6 7

Not Recommended

for NewDesigns

Figure 1. ENABLE Timing Diagram

Figure 2. Propagation Delay Timing

ENABLE

OUTPUTS

ten1 ten2

Typical

Input tPLH tPHL

Typical

Output trtf

90%

10%

90%

10%

1.4 V

Si8450/51/52/55

8 Rev. 1.6

Not Recommended

for NewDesigns

Table 4. Electrical Characteristics

(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

High Level Input Voltage VIH 2.0 — — V

Low Level Input Voltage VIL ——0.8V

High Level Output Voltage VOH loh = –4 mA VDD1,VDD2 –0.4 3.1 — V

Low Level Output Voltage VOL lol = 4 mA — 0.2 0.4 V

Input Leakage Current IL——±10µA

Output Impedance1ZO—85—

Enable Input High Current IENH VENx = VIH —2.0—µA

Enable Input Low Current IENL VENx = VIL —2.0—µA

DC Supply Current (All inputs 0 V or at supply)

Si8450Ax, Bx, Si8455Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 dc

All inputs 1 dc

—

1.6

2.9

7.0

3.1

2.4

4.4

10.5

4.7

Si8451Ax, Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 dc

All inputs 1 dc

—

2.0

3.0

6.0

4.1

3.0

4.5

9.0

6.2

Si8452Ax, Bx

VDD1

VDD2

VDD1

VDD2

All inputs 0 DC

All inputs 1 DC

—

2.3

2.7

5.4

4.7

3.5

4.1

8.1

7.1

1 Mbps Supply Current (All inputs = 500 kHz square wave, CI = 15 pF on all outputs)

Si8450Ax, Bx, Si8455Bx

VDD1

VDD2

—

—4.3

3.5 6.5

5.3 mA

Si8451Ax, Bx

VDD1

VDD2

—

—4.1

4.0 6.2

6.0 mA

Si8452Ax, Bx

VDD1

VDD2

—

—4.1

4.0 6.2

6.0 mA

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the

value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

Si8450/51/52/55

Rev. 1.6 9

Not Recommended

for NewDesigns

10 Mbps Supply Current (All inputs = 5 MHz square wave, CI = 15 pF on all outputs)

Si8450Bx, Si8455Bx

VDD1

VDD2

—

—4.3

4.8 6.5

6.7 mA

Si8451Bx

VDD1

VDD2

—

—4.4

5.0 6.2

7.0 mA

Si8452Bx

VDD1

VDD2

—

—4.6

4.8 6.4

6.7 mA

100 Mbps Supply Current (All inputs = 50 MHz square wave, CI = 15 pF on all outputs)

Si8450Bx, Si8455Bx

VDD1

VDD2

—

—4.4

16.8 6.6

21 mA

Si8451Bx

VDD1

VDD2

—

—6.9

14.5 8.6

18.1 mA

Si8452Bx

VDD1

VDD2

—

—9.5

12 11.9

15 mA

Timing Characteristics

Si845xAx

Maximum Data Rate 0 — 1.0 Mbps

Minimum Pulse Width — — 250 ns

Propagation Delay tPHL,tPLH See Figure 2 — — 35 ns

Pulse Width Distortion

|tPLH -tPHL|PWD See Figure 2 — — 25 ns

Propagation Delay Skew2tPSK(P-P) — — 40 ns

Channel-Channel Skew tPSK — — 35 ns

Table 4. Electrical Characteristics (Continued)

(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the

value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

Si8450/51/52/55

10 Rev. 1.6

Not Recommended

for NewDesigns

Si845xBx

Maximum Data Rate 0 — 150 Mbps

Minimum Pulse Width — — 6.0 ns

Propagation Delay tPHL, tPLH See Figure 2 3.0 6.0 9.5 ns

Pulse Width Distortion

|tPLH -tPHL|PWD See Figure 2 — 1.5 2.5 ns

Propagation Delay Skew2tPSK(P-P) —2.03.0ns

Channel-Channel Skew tPSK —0.51.8ns

All Models

Output Rise Time trCL=15pF

See Figure 2 —4.36.1ns

Output Fall Time tfCL=15pF

See Figure 2 —3.04.3ns

Common Mode Transient

Immunity CMTI VI=V

DD or 0 V — 25 — kV/µs

Enable to Data Valid3ten1 See Figure 1 — 5.0 8.0 ns

Enable to Data Tri-State3ten2 See Figure 1 — 7.0 9.2 ns

Start-up Time3,4 tSU —1540µs

Table 4. Electrical Characteristics (Continued)

(VDD1 = 3.3 V±10%, VDD2 = 3.3 V±10%, TA= –40 to 125 °C)

Parameter Symbol Test Condition Min Typ Max Unit

Notes:

1. The nominal output impedance of an isolator driver channel is approximately 85 , ±40%, which is a combination of the

value of the on-chip series termination resistor and channel resistance of the output driver FET. When driving loads

where transmission line effects will be a factor, output pins should be appropriately terminated with controlled

impedance PCB traces.

2. tPSK(P-P) is the magnitude of the difference in propagation delay times measured between different units operating at

the same supply voltages, load, and ambient temperature.

3. See "3. Errata and Design Migration Guidelines" on page 25 for more details.

4. Start-up time is the time period from the application of power to valid data at the output.

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