Sony HCD-GT3D Manuale utente
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-GT3D
9-890-669-03
2015H81-1
© 2015.08
Ver. 1.2 2015.08
SPECIFICATIONS
CD/DVD Section
Model Name Using Similar Mechanism HCD-GPX555
CD Mechanism Type CDM90-DVBU204//M
Optical Pick-up Name CMS-S76RFS7G
Amplifier section
The following are measured at
AC 120 V – 240 V, 50/60 Hz
Power output (rated)
Left/Right Channel: 120 W + 120 W
(at 2 ohms, 1 kHz, 1% THD)
RMS output power (reference)
Left/Right Channel: 180 W + 180 W
(per channel at 2 ohms, 1 kHz)
Subwoofer: 360 W (at 4 ohms, 100 Hz)
Speaker section
Speaker system
Subwoofer, Sound Pressure Horn
Speaker unit
200 mm, cone type
Rated impedance
4 ohms
Inputs
AUDIO IN/PARTY CHAIN IN L/R
Voltage 2 V, impedance 47 kilohms
OPTICAL IN
Supported audio signal:
2-channel Linear PCM
MIC 1, MIC 2
Sensitivity 1 mV, impedance 10 kilohms
(USB) port
Type A
Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
Voltage 2 V, impedance 1 kilohm
VIDEO OUT
Max. output level 1 Vp-p, unbalanced,
Sync. negative load impedance 75 ohms
USB section
Supported bit rate
WMA:
48 kbps – 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
Supported USB device
Mass Storage Class
Maximum current
1 A
Disc/USB section
Supported bit rate
MPEG1 Layer-3:
32 kbps – 320 kbps, VBR
Sampling frequencies
MPEG1 Layer-3:
32 kHz/44.1 kHz/48 kHz
Xvid
Video codec: Xvid
Bit rate: 4.854 Mbps (MAX)
Resolution/Frame rate:
720 × 480, 30 fps
720 × 576, 25 fps
Audio codec: MP3
MPEG4
File format: MP4 File Format
Video codec:
MPEG4 Simple Profile
(AVC is not compatible.)
Bit rate: 4 Mbps
Resolution/Frame rate:
720 × 576, 30 fps
Audio codec: AAC-LC
(HE-AAC is not compatible.)
DRM: Not compatible
Disc player section
System
Compact disc and digital audio and
video system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value
measurement at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Video color system format
NTSC and PAL
FM tuner section
System
PLL quartz-locked digital synthesizer
Antenna
FM lead antenna
Tuning range
87.5 MHz – 108.0 MHz (50 kHz step)
BLUETOOTH section
Communication system
BLUETOOTH Standard version 3.0
Output
BLUETOOTH Standard Power
Class 2
Maximum communication range
Line of sight approx. 10 m1)
Frequency band
2.4 GHz band (2.4000 GHz –
2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profiles2)
A2DP (Advanced Audio Distribution
Profile)
AVRCP (Audio Video Remote
Control Profile)
SPP (Serial Port Profile)
Supported codecs
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1) The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2) BLUETOOTH standard profiles indicate
the purpose of BLUETOOTH communica-
tion between devices.
General
Power requirements
AC 120 V – 240 V, 50/60 Hz
Power consumption
120 W
Power consumption (at the Power Saving
mode)
0.5 W
(When “BT STBY” is set to “OFF”)
6 W
(When “BT STBY” is set to “ON”)
Dimensions (w/h/d) (Approx.)
DVD Receiver (subwoofer unit):
305 mm × 636 mm × 355 mm
Mass (Approx.)
DVD Receiver (subwoofer unit):
14.5 kg
Design and specifications are subject to
change without notice.
– Continued on next page –
Russian Model
E Model
Australian Model
DVD RECEIVER
HCD-GT3D
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
License and Trademark Notice
•
is a trademark of DVD Format/Logo Licensing Corporation.
•
“DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”,
“DVD VIDEO”, and
the “CD” logos are trademarks.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of
Microsoft Corporation in the United States and/or other countries.
• This product is protected by certain intellectual property rights of
Microsoft Corporation. Use or distribution of such technology outside
of this product is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
• “WALKMAN” and “WALKMAN” logo are registered trademarks of
Sony Corporation.
• This system incorporates Dolby* Digital.
* Manufactured under license from Dolby Laboratories. Dolby and
the double-D symbol are trademarks of Dolby Laboratories.
• The BLUETOOTH®word mark and logos are registered trademarks
owned by Bluetooth SIG, Inc. and any use of such marks by Sony
Corporation is under license. Other trademarks and trade names are
those of their respective owners.
• The N Mark is a trademark or registered trademark of NFC Forum,
Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• Apple, the Apple logo, iPhone, and iPod touch are trademarks of
Apple Inc., registered in the U.S. and other countries. App Store is a
service mark of Apple Inc.
• “Made for iPod” and “Made for iPhone” mean that an electronic
accessory has been designed to connect specifically to iPod or iPhone,
respectively, and has been certified by the developer to meet Apple
performance standards. Apple is not responsible for the operation of
this device or its compliance with safety and regulatory standards.
Please note that the use of this accessory with iPod or iPhone may
affect wireless performance.
• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-4
VISUAL STANDARD (“MPEG-4 VIDEO”)
AND/OR
(ii)DECODING MPEG-4 VIDEO THAT WAS ENCODED BY
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED FROM
A VIDEO PROVIDER LICENSED TO PROVIDE MPEG-4
VIDEO.
NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR ANY
OTHER USE. ADDITIONAL INFORMATION INCLUDING THAT
RELATING TO PROMOTIONAL, INTERNAL AND COMMER-
CIAL USESAND LICENSING MAY BE OBTAINED FROM MPEG
LA, L.L.C.
HTTP://WWW.MPEGLA.COM
• All other trademarks are trademarks of their respective owners.
• In this manual, ™ and ® marks are not specified.
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
1.5 kΩ0.15 μFAC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Ver. 1.1
HCD-GT3D
3
1. SERVICING NOTES ............................................. 4
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 9
2-2. Side (L) Panel, Side (R) Panel........................................ 10
2-3. Top Panel Section ........................................................... 11
2-4. OPTICAL Board............................................................. 12
2-5. Loading Panel Assy ........................................................ 12
2-6. CDM Section .................................................................. 13
2-7. Back Panel ...................................................................... 13
2-8. DAMP Board .................................................................. 14
2-9. MOTHERBOARD Board, SPLITTER Board................ 15
2-10. Sub Chassis Section........................................................ 16
2-11. SMPS Board ................................................................... 17
2-12. Chassis............................................................................ 17
2-13. Front Panel Section......................................................... 18
2-14. Loudspeaker (20cm)-087-11........................................... 19
2-15. Service, Optical Device(7G), Wire (Flat Type) .............. 20
3. TEST MODE ............................................................ 21
4. ELECTRICAL CHECK ......................................... 26
5. TROUBLESHOOTING .......................................... 27
6. DIAGRAMS
6-1. Block Diagram - SERVO/USB/DISPLAY Section -...... 33
6-2. Block Diagram - AUDIO/VIDEO Section -................... 34
6-3. Block Diagram - AMP Section -..................................... 35
6-4. Block Diagram - POWER SUPPLY Section -................ 36
6-5. Printed Wiring Board - MOTHERBOARD Board -....... 39
6-6. Schematic Diagram
- MOTHERBOARD Board (1/10) - ............................... 40
6-7. Schematic Diagram
- MOTHERBOARD Board (2/10) - ............................... 41
6-8. Schematic Diagram
- MOTHERBOARD Board (3/10) - ............................... 42
6-9. Schematic Diagram
- MOTHERBOARD Board (4/10) - ............................... 43
6-10. Schematic Diagram
- MOTHERBOARD Board (5/10) - ............................... 44
6-11. Schematic Diagram
- MOTHERBOARD Board (6/10) - ............................... 45
6-12. Schematic Diagram
- MOTHERBOARD Board (7/10) - ............................... 46
6-13. Schematic Diagram
- MOTHERBOARD Board (8/10) - ............................... 47
6-14. Schematic Diagram
- MOTHERBOARD Board (9/10) - ............................... 48
6-15. Schematic Diagram
- MOTHERBOARD Board (10/10) - ............................. 49
6-16. Printed Wiring Board - DAMP Board -.......................... 50
6-17. Schematic Diagram - DAMP Board (1/2) -.................... 51
6-18. Schematic Diagram - DAMP Board (2/2) -.................... 52
6-19. Printed Wiring Board - BUTTON Board - ..................... 53
6-20. Schematic Diagram - BUTTON Board - ........................ 54
6-21. Printed Wiring Board - LCD Board -.............................. 55
6-22. Schematic Diagram - LCD Board -................................ 55
6-23. Printed Wiring Board - OPTICAL Board -..................... 55
6-24. Schematic Diagram - OPTICAL Board -........................ 55
6-25. Printed Wiring Board - SPK_HLED Board -.................. 56
6-26. Schematic Diagram - SPK_HLED Board -.................... 56
6-27. Printed Wiring Board - MIC Board -.............................. 56
6-28. Schematic Diagram - MIC Board -................................. 57
6-29. Printed Wiring Board - SPLITTER Board - ................... 58
TABLE OF CONTENTS
6-30. Schematic Diagram - SPLITTER Board -...................... 58
7. EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 72
7-2. Top Panel Section ........................................................... 73
7-3. Loading Panel Section.................................................... 74
7-4. MOTHERBOARD Board Section.................................. 75
7-5. Chassis Section............................................................... 76
7-6. Front Panel Section......................................................... 77
7-7. CDM Section .................................................................. 78
7-8. CD Mechanism Section
(CDM90-DVBU204//M)................................................ 79
8. ELECTRICAL PARTS LIST .............................. 80
HCD-GT3D
4
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
Part No.
Destination Code
– Rear View – MODEL NUMBER LABEL
Model Part No.
AR 4-566-431-0[]
LA9 4-567-343-0[]
TH 4-567-344-0[]
E4 4-567-347-0[]
EA 4-567-349-0[]
MY 4-567-350-0[]
RU 4-567-352-0[]
AUS 4-567-353-0[]
• Abbreviation
AR : Argentina model
AUS : Australian model
E4 : African model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
• JIG
When disassembling the set, use the following jig (for front
panel removal).
Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL
PLAYABLE DISCS
• DVD+R/DVD+RW
• AUDIO CD
• CD-R/CD-RW/DVD-R/DVD-RW
– audio data
– MP3 files that conforms to ISO9660 Level 1/Level 2, or
Joliet (expansion format).
Notes
• MP3 (MPEG 1 Audio Layer-3) is a standard format defined
by ISO (International Organization for Standardization) which
compresses audio data. MP3 files must be in MPEG 1 Audio
Layer-3 format.
• The system can only play back MP3 files that have a file
extension of “.mp3”.
This appliance is classified as
a CLASS 1 LASER product
under IEC 60825-1:2007.
This marking is located on
the rear exterior.
Ver. 1.1
HCD-GT3D
5
NOTE OF REPLACING THE IC001, IC002, IC101, IC105,
IC106, IC301, IC302AND IC303 ON THE MOTHERBOARD
BOARD
IC001, IC002, IC101, IC105, IC106, IC301, IC302 and IC303
on the MOTHERBOARD board cannot exchange with single.
When these parts on the MOTHERBOARD board are damaged,
exchange the entire mounted board.
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [\/1] button to turn the power on.
2. Press [FUNCTION] button and turn the [MULTI CONTROL]
knob to select “DVD/CD” function, then press [ENTER]
button.
3. Press the [ENTER] button and [VOCAL FADER] button
simultaneously and hold down for around 3 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED”is displayed, the slot lock is not released by
turning power on/off with the [\/1]button.
NOTE OF REPLACING THE IC1001 ON THE DAMP
BOARD AND THE COMPLETE DAMP BOARD
When IC1001 on the DAMP board and the complete DAMP board
are replaced, it is necessary to spread the compound between parts
and heat sink.
Part No. Description
7-300-009-67 THERMAL COMPOUND (TIG2000)
Spread the compound referring to the figure below.
thermal compound (TIG2000)
– DAMP Board (Component Side) –
IC1001
NOTE OF REPLACING MOTHERBOARD BOARD OR
BLUETOOTH MODULE OR RC-S730 (WW) BOARD
When the MOTHERBOARD board or BLUETOOTH module
or RC-S730 (WW) board are replaced, please execute the below
service mode.
Pairing this system with a
Bluetooth
device
1. Press the [\/1] button to turn the power on.
2. Place the Bluetooth device within 1 meter (3 feet) from the
system.
3. Press BLUETOOTH on the unit to select Bluetooth function.
“BTAUDIO” appears in the display panel.
4. Hold down BLUETOOTH on the unit for 2 seconds or more.
“PAIRING” flashes in the display panel.
5. Perform the pairing procedure on the Bluetooth device.
6. Select the model number of the unit on the display of the
Bluetooth device.
For example, select “SONY : MHC-GT3D”. If passkey is
required on the Bluetooth device, enter “0000”.
7. Perform the Bluetooth connection on the Bluetooth device.
8. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
9. To cancel pairing operation, hold down BLUETOOTH on the
unit for 2 seconds or more until “BTAUDIO” appears in the
display panel.
Connecting with a smartphone by one touch (NFC)
Note: The operation in this mode must use a NFC-compatible smartphone
(Smartphones with a built-in NFC function [OS: Android 2.3.3 or
later, excluding Android 3.x])
1. Press the [\/1] button to turn the power on.
2. Download and install the app “NFC Easy Connect”.
Download the freeAndroid app from Google Play by searching
for “NFC Easy Connect”.
3. Start the app “NFC Easy Connect” on the smartphone.
Make sure that the application screen is displayed.
4. Touch the smartphone to the N-Mark on the system until the
smartphone vibrates.
Complete the connection by following the instructions
displayed on the smartphone.
5. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
Ver. 1.1
HCD-GT3D
6
Playing music from a
Bluetooth
device
For a Bluetooth device
1. Press the [\/1] button to turn the power on.
2. Press BLUETOOTH on the unit to select Bluetooth function.
“BTAUDIO” appears in the display panel.
3. Establish connection with the Bluetooth device.
Press BLUETOOTH on the unit to connect to the last
connected Bluetooth device.
Perform the Bluetooth connection from the Bluetooth device if
the device is not connected.
Once the connection is established, the Bluetooth device name
appears in the display panel.
4. Press N.
Depending on the Bluetooth device,
– you may have to press Ntwice.
– you may need to start playback of an audio source on the
Bluetooth device.
For an NFC-compatible smartphone
1. Press the [\/1] button to turn the power on.
Touch the smartphone to the N-Mark on the system to establish
the Bluetooth connection.
Start playback of an audio source on the smartphone. For
details on playback, refer to the operating instructions of your
smartphone.
To disconnect the Bluetooth device
For a Bluetooth device
Press BLUETOOTH on the unit.
“BTAUDIO” appears in the display panel.
For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.
To erase all the pairing registration information perform
COLD RESET test mode (Refer to page 21).
SCREW TYPE DISCRIMINATION BEFORE DISASSEM-
BLE THE PANEL, SIDE
In this set, the screw type which screw between “PANEL, SIDE
and PANEL, TOP” and “PANEL, SIDE and CHASSIS” have been
changed in the midway of production.
Repair after distinguishing the screw type referring to the
following.
Type A or Type B
Type A or Type B
Type Screw P/N Screw Shape
A 4-546-397-01
B 4-162-271-01
NOTE OF DISASSEMBLE THE PANEL, SIDE
To disassemble the PANEL, SIDE, hexagon key is required to
unscrew the SCREW, TAPPING (HEX) (Type A).
hexagon key
hexagon key
BOND FIXATION OF ELECTRIC PARTS
When DAMP board is replaced or the following object parts are
replaced, it is necessary to fix parts to the boards by using a speci-
fied bond without fail.
• Object boards
Complete DAMP board
• Object parts
Board Ref. No.
DAMP C1126, C1127, C1128, C1129, C1142,
L1010, RY001
• Use bond
Part No. Description
7-600-020-70 ADHESIVE (SC608Z2) 180ML
• Parts position
Complete DAMP board (page 6)
DAMP board
– DAMP Board (Component Side) –
The portion which applies bond:
L1010 C1126 C1129
C1127 C1128
C1142
RY001
Ver. 1.2
HCD-GT3D
7
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the side panel and top panel are removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
1Remove the side (L) panel, side (R) panel, top panel section.
(Illustration of disassembly is omitted.)
2Insert the clip etc.
3
– Top view –
hole
– Left view –
8 cm or more
tray
CD/DVD mechanism deck
Insert the clip etc. processed to the
length of 8 cm or more in the hole
on the side of the chassis and push.
Note: Push after it inserts it
in this hole well.
NOTE OF REPLACING THE VOLUME KNOB ASSY OR MIC KNOB
When VOLUME knob assy or MIC knob is replaced, it is necessary to apply lubricant on the knob.
Part No. Description
7-651-000-63 Lubricant (SFL-7A)1KG
Apply the lubricant referring to the figure below.
– VOLUME KNOB ASSY – – MIC KNOB ASSY –
Lubricant (SFL-7A)1KG
Ver. 1.2
HCD-GT3D
8
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
SMPS Board (Conductor side view)
In checking the SMPS board, make 3 capacitors discharge of C914, C1003 and C1006 for eletrical shock prevention.
800 :/5 W
800 :/5 W
800 :/5 W
C1006
C1003
C914
HCD-GT3D
9
Note: Disassemble the unit in the order as shown below.
2-1. DISASSEMBLY FLOW
SECTION 2
DISASSEMBLY
2-3. TOP PANEL SECTION
(Page 11)
2-4. OPTICAL BOARD
(Page 12)
2-5. LOADING PANEL ASSY
(Page 12)
2-11. SMPS BOARD
(Page 17)
2-12.CHASSIS
(Page 17)
2-10.SUB CHASSIS SECTION
(Page 16)
2-14.LOUDSPEAKER (20CM)-087-11
(Page 19)
2-13.FRONT PANEL SECTION
(Page 18)
2-8. DAMP BOARD
(Page 14)
2-7. BACK PANEL
(Page 13)
2-6. CDM SECTION
(Page 13)
2-15.SERVICE, OPTICAL DEVICE(7G), WIRE (FLAT TYPE)
(Page 20)
2-2. SIDE (L) PANEL, SIDE (R) PANEL
(Page 10)
2-9. MOTHERBOARD BOARD,
SPLITTER BOARD
(Page 15)
SET
HCD-GT3D
10
Note: Follow the disassembly procedure in the numerical order given.
2-2. SIDE (L) PANEL, SIDE (R) PANEL
1two screws
(TAPPING (HEX)
(Type A) or TAPPING
(Type B)) 2three screws (+BVTP 3 × 8)
3three claws
3three claws
2three screws (+BVTP 3 × 8)
1two screws (TAPPING (HEX)
(Type A) or TAPPING (Type B))
4Remove the panel, side (L)
in the direction of the arrow.
5panel, side (L)
4Remove the panel, side (R)
in the direction of the arrow.
5panel, side (R)
Ver. 1.2
Note 1: The screw type which screw between “PANEL, SIDE and PANEL,
TOP” and “PANEL, SIDE and CHASSIS” for this unit have been
changed in the midway of production. About the screw type dis-
crimination, refer to “SCREW TYPE DISCRIMINATION BEFORE
DISASSEMBLE THE PANEL, SIDE” on servicing notes (page 6).
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