Telit Wireless Solutions LE910C1-NA Manuale di installazione

LE910Cx

Hardware User Guide

1VV0301298 Rev. 1.04 - 2017-05-25

LE910Cx Hardware User Guide

1VV0301298 Rev. 1.04 - 2017-05-25

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Applicability Table

This documentation applies to the ollowing products:

Table 1: Applicability Table

Module Na e Description

LE910C1-NA North America – AT&T with global

roaming

LE910C1-NS North America - Sprint variant

LE910C1-AP APAC variant

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable e orts have been made to assure the accuracy o this document, Telit assumes

no liability resulting rom any inaccuracies or omissions in this document, or rom use o the

in ormation obtained herein. The in ormation in this document has been care ully checked and is

believed to be entirely reliable. However, no responsibility is assumed or inaccuracies or

omissions. Telit reserves the right to make changes to any products described herein and reserves

the right to revise this document and to make changes rom time to time in the content hereo with

no obligation to noti y any person o revisions or changes. Telit does not assume any liability arising

out o the application or use o any product, so tware, or circuit described herein; neither does it

convey any license under its patent rights or the rights o others.

It is possible that this publication may contain re erences to, or in ormation about Telit products

(machines and programs), programming, or services that are not announced in your country. Such

re erences or in ormation must not be construed to mean that Telit intends to announce such Telit

products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include,

or describe copyrighted Telit material, such as computer programs stored in semiconductor

memories or other media. Laws in Italy and other countries preserve or Telit and its licensors

certain exclusive rights or copyrighted material, including the exclusive right to copy, reproduce in

any orm, distribute, and make derivative works o the copyrighted material. Accordingly, any

copyrighted material o Telit and its licensors contained herein or in the Telit products described in

this instruction manual may not be copied, reproduced, distributed, merged, or modi ied in any

manner without the express written permission o Telit. Furthermore, the purchase o Telit

products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications o Telit, as arises by operation o law

in the sale o a product.

Co puter Software Copyrights

Telit and third-party so tware (SW) products described in this instruction manual may include

copyrighted Telit and other third-party computer programs stored in semiconductor memories or

other media. Laws in Italy and other countries preserve or Telit and other third-party SW certain

exclusive rights or copyrighted computer programs, including the exclusive right to copy or

reproduce in any orm the copyrighted computer program. Accordingly, any copyrighted Telit or

other third-party SW computer programs contained in the Telit products described in this

instruction manual may not be copied (reverse engineered) or reproduced in any manner without

the express written permission o Telit or the third-party SW supplier. Furthermore, the purchase

o Telit products shall not be deemed to grant either directly or by implication, estoppel, or

otherwise, any license under the copyrights, patents or patent applications o Telit or other third-

party SW, except or the normal non-exclusive, royalty ree license to use that arises by operation

o law in the sale o a product.

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Usage and Disclosure Restrictions

License Agree ents

The so tware described in this document is the property o Telit and its licensors. It is urnished by

an express license agreement only and may be used only in accordance with the terms o such an

agreement.

Copyrighted Materials

So tware and documentation are copyrighted materials. Making unauthorized copies is prohibited

by law. No part o the so tware or documentation may be reproduced, transmitted, transcribed,

stored in a retrieval system, or translated into any language or computer language, in any orm or

by any means, without prior written permission o Telit.

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT ault-

tolerant and are NOT designed, manu actured, or intended or use as on-line control equipment in

the ollowing hazardous environments requiring ail-sa e controls: the operation o nuclear

acilities, aircra t navigation or aircra t communication systems, air tra ic control, li e support, or

weapons systems (“high risk activities"). Telit and its supplier(s) speci ically disclaim any expressed

or implied warranty o itness or such high risk activities.

Trade arks

TELIT and the stylized T logo are trademarks and/or registered trademarks o Telit Communications

S.p.A. in the Unites States and/or other countries. All other product or service names are the

property o their respective owners.

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Contents

Introduction ..................................................................................................... 13

1.1.

Scope ................................................................................................................ 13

1.2.

Audience .......................................................................................................... 13

1.3.

Contact In ormation, Support .......................................................................... 13

1.4.

Text Conventions ............................................................................................. 14

1.5.

Related Documents .......................................................................................... 15

1.6.

Abbreviations ................................................................................................... 16

General Product Description ............................................................................ 17

2.1.

Overview .......................................................................................................... 17

2.2.

Applications ..................................................................................................... 17

2.3.

General Functionality and Main Features ....................................................... 18

2.4.

Block Diagram .................................................................................................. 21

2.5.

Environmental Requirements .......................................................................... 22

2.5.1.

Temperature Range .............................................................................. 22

2.5.2.

RoHS Compliance.................................................................................. 22

2.6.

Frequency Bands .............................................................................................. 23

2.6.1.

RF Bands per Regional Variant ............................................................. 23

2.6.2.

Re erence Table o RF Bands Characteristics ....................................... 24

2.7.

Sensitivity ......................................................................................................... 26

2.8.

LE910Cx Mechanical Speci ications ................................................................. 27

2.8.1.

Dimensions ........................................................................................... 27

2.8.2.

Weight .................................................................................................. 27

LE910Cx Module Connections ........................................................................... 28

3.1.

Pin-out .............................................................................................................. 28

3.2.

LE910Cx - Signals That Must Be Connected ..................................................... 39

3.3.

LGA Pads Layout ............................................................................................... 41

3.4.

Backward Compatibility to xE910 Family ........................................................ 42

Electrical Specifications .................................................................................... 43

4.1.

Absolute Maximum Ratings – Not Operational ............................................... 43

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4.2.

Recommended Operating Conditions ............................................................. 43

4.3.

Logic Level Speci ications ................................................................................. 44

4.3.1.

1.8V Pads - Absolute Maximum Ratings ............................................... 44

4.3.2.

1.8V Standard GPIOs ............................................................................ 44

4.3.3.

1.8V SD Card Pads ................................................................................. 45

4.3.4.

1.8V SIM Card Pads ............................................................................... 45

4.3.5.

Dual Voltage Pads - Absolute Maximum Ratings ................................. 46

4.3.6.

SD Card Pads @ 2.95V .......................................................................... 46

4.3.7.

SIM Card Pads @2.95V ......................................................................... 47

Hardware Co ands ....................................................................................... 48

5.1.

Turning on the LE910Cx Module ...................................................................... 48

5.2.

Initialization and Activation State .................................................................... 48

5.3.

Turning OFF the LE910Cx Module ................................................................... 50

5.3.1.

Shutdown by So tware Command ....................................................... 50

5.3.2.

Hardware Shutdown ............................................................................. 51

5.3.4.

Unconditional Hardware Shutdown ..................................................... 52

Power Supply ................................................................................................... 53

6.1.

Power Supply Requirements............................................................................ 53

6.2.

General Design Rules ....................................................................................... 55

6.2.1.

Electrical Design Guidelines .................................................................. 55

6.2.1.1.

+ 5V Input Source Power Supply – Design Guidelines ......... 55

6.2.1.2.

+ 12V Input Source Power Supply – Design Guidelines ....... 56

6.2.1.3.

Battery Source Power Supply – Design Guidelines .............. 58

6.2.2.

Thermal Design Guidelines ................................................................... 59

6.2.3.

Power Supply PCB Layout Guidelines ................................................... 60

Antenna(s) ....................................................................................................... 61

7.1.

GSM/WCDMA/LTE Antenna Requirements ..................................................... 61

7.2.

GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 62

7.3.

GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 63

7.4.

Antenna Diversity Requirements ..................................................................... 63

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7.5.

GNSS Antenna Requirements .......................................................................... 64

7.5.1.

Combined GNSS Antenna ..................................................................... 64

7.5.2.

Linear and Patch GNSS Antenna ........................................................... 64

7.5.3.

Front End Design Considerations ......................................................... 64

7.5.4.

GNSS Antenna – PCB Line Guidelines ................................................... 65

7.5.5.

GNSS Antenna – Installation Guidelines ............................................... 66

Hardware Interfaces......................................................................................... 67

8.1.

USB Port ........................................................................................................... 68

8.2.

HSIC Inter ace .................................................................................................. 69

8.3.

SGMII Inter ace (optional) ............................................................................... 69

8.3.1.

Ethernet Control inter ace ................................................................... 69

8.4.

Serial Ports ....................................................................................................... 70

8.4.1.

Modem Serial Port 1 Signals ................................................................. 71

8.4.2.

Modem Serial Port 2 ............................................................................. 72

8.4.3.

RS232 Level Translation ........................................................................ 73

8.5.

Peripheral Ports ............................................................................................... 75

8.5.1.

SPI – Serial Peripheral Inter ace ........................................................... 75

8.5.2.

I2C - Inter-integrated Circuit ................................................................ 76

8.5.3.

SD/MMC Card Inter ace ....................................................................... 76

8.5.4.

WiFi SDIO Inter ace .............................................................................. 78

8.6.

Audio Inter ace ................................................................................................ 80

8.6.1.

Digital Audio ......................................................................................... 80

8.6.1.1.

Short Frame Timing Diagrams .............................................. 81

8.6.1.2.

Long Frame Timing Diagrams ............................................... 83

8.7.

General Purpose I/O ........................................................................................ 85

8.7.1.

Using a GPIO Pad as Input .................................................................... 87

8.7.2.

Using a GPIO Pad as an interrupt / Wakeup source ............................. 87

8.7.3.

Using a GPIO Pad as Output ................................................................. 87

Miscellaneous Functions .................................................................................. 89

9.1.

Indication o Network Service Availability ....................................................... 89

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9.2.

Indication o So tware Ready ........................................................................... 90

9.3.

RTC – Real Time Clock ...................................................................................... 90

9.4.

VAUX Power Output ........................................................................................ 90

9.5.

ADC Converter ................................................................................................. 91

9.5.1.

Description............................................................................................ 91

9.5.2.

Using the ADC Converter ...................................................................... 91

9.6.

Using the Temperature Monitor Function ...................................................... 91

9.7.

GNSS Characteristics ........................................................................................ 92

10.

Mounting the Module on your Board ............................................................... 93

10.1.

General ............................................................................................................. 93

10.2.

Finishing & Dimensions .................................................................................... 93

10.3.

Recommended Footprint or the Application ................................................. 96

10.4.

Stencil ............................................................................................................... 97

10.5.

PCB Pad Design ................................................................................................ 97

10.6.

Recommendations or PCB Pad Dimensions (mm) .......................................... 98

10.7.

Solder Paste ..................................................................................................... 99

10.7.1.

Solder Re low ........................................................................................ 99

11.

Application Guide ........................................................................................... 101

11.1.

Debug o the LE910Cx Module in Production ................................................ 101

11.2.

Bypass Capacitor on Power Supplies ............................................................. 102

11.3.

SIM Inter ace .................................................................................................. 103

11.3.1.

SIM Schematic Example ...................................................................... 103

11.4.

EMC Recommendations ................................................................................. 104

11.5.

Download and Debug Port ............................................................................. 105

11.5.1.

Fast Boot mode................................................................................... 105

11.5.2.

Recovery Boot Mode .......................................................................... 105

12.

Packing Syste ............................................................................................... 106

12.1.

Packing system – Tray .................................................................................... 106

12.2.

Tape & Reel .................................................................................................... 108

12.3.

Moisture Sensitivity ....................................................................................... 110

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13.

Safety Reco endations ................................................................................ 111

14.

Confor ity assess ent issues ......................................................................... 112

14.1.

FCC/ISED Regulatory notices ........................................................................ 112

15.

Docu ent History ........................................................................................... 115

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List of Tables

Table 1: Applicability Table ................................................................................................................. 2

Table 2: Related Documents ............................................................................................................ 15

Table 3: RF Bands per Regional Variant ............................................................................................ 23

Table 4: RF Bands Characteristics ..................................................................................................... 24

Table 5: LE910Cx Pin-out .................................................................................................................. 28

Table 6: Mandatory Signals .............................................................................................................. 39

Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43

Table 8: Recommended Operating Conditions ................................................................................ 43

Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44

Table 10: Operating Range – Inter ace Levels (1.8V CMOS) ............................................................ 44

Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45

Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45

Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46

Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46

Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47

Table 16: Power Supply Requirements ............................................................................................ 53

Table 17: LE910Cx Current Consumption ......................................................................................... 53

Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 61

Table 19: Antenna Line on PCB Requirements ................................................................................. 61

Table 20: Antenna Diversity Requirements ...................................................................................... 63

Table 21: Antenna Line on PCB Requirements ................................................................................. 65

Table 22: LE910Cx Hardware Inter aces ........................................................................................... 67

Table 23: USB Inter ace Signals ........................................................................................................ 68

Table 25: Ethernet Control Inter ace Signals .................................................................................... 69

Table 24: Modem Serial Port 1 Signals ............................................................................................. 71

Table 25 Modem Serial Port 2 Signals .............................................................................................. 72

Table 26: SPI Signals ......................................................................................................................... 75

Table 27: SD Card Signals .................................................................................................................. 77

Table 28: WiFi SDIO Inter ace Signals ............................................................................................... 78

Table 29: Digital Audio Inter ace (DVI) Signals ................................................................................. 80

Table 30: PCM_CODEC Timing Parameters ...................................................................................... 82

Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 84

Table 32: Primary GPIOs ................................................................................................................... 85

Table 33: Network Service Availability Indication ............................................................................ 89

Table 34: Operating Range – VAUX Power Supply ........................................................................... 90

Table 35: ADC Parameters ................................................................................................................ 91

The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 92

Table 37: Recommendations or PCB Pad Sur aces ......................................................................... 98

Table 38: Solder Pro ile Characteristics .......................................................................................... 100

Table 39: SIM Inter ace – C1 Range ................................................................................................ 103

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