Texas Instruments THS7002 Manuale utente

THS7002

ProgrammableĆGain Amplifier

Evaluation Module

July 1999 Mixed-Signal Products

User’s Guide

SLOU037

IMPORTANT NOTICE

TexasInstruments andits subsidiaries(TI) reservethe rightto makechanges totheir productsor todiscontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TIdeemsnecessarytosupport thiswarranty.Specific testingofallparametersof eachdeviceis notnecessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

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CRITICALAPPLICATIONS.INCLUSIONOFTIPRODUCTSINSUCHAPPLICATIONSISUNDERSTOODTO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TIassumes noliabilityforapplicationsassistance orcustomer productdesign. TIdoes notwarrantorrepresent

thatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orother

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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

iii

Chapter Title—Attribute Reference

Preface

Related Documentation From Texas Instruments

THS7002 PROGRAMMABLE-GAIN AMPLIFIER

(literature

number SLOS214) This is the data sheet for the THS7002

amplifier integrated circuit used on the EVM.

THS4001 HIGH-SPEED LOW-POWER OPERATIONAL

AMPLIFIER

(literature number SLOS206) This is the data sheet

for the THS4001 amplifier integrated circuit used on the EVM.

PowerPAD



Thermally Enhanced Package

(literature number

SLMA002) This is the technical brief for the special PowerPAD

package in which the THS7002 amplifier IC is supplied.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

testedforcompliancewiththelimitsofcomputingdevicespursuanttosubpart

Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications, in which

case the user at his own expense will be required to take whatever measures

may be required to correct this interference.

Trademarks

TI is a trademark of Texas Instruments Incorporated.

PowerPAD is a trademark of Texas Instruments Incorporated.

Running Title—Attribute Reference

Chapter Title—Attribute Reference

Contents

1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 Programmable Gain Amplifier Gain Control 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 EVM Circuit Configuration 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 Using the THS7002 EVM 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.7 THS7002 EVM Performance 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.8 General High-Speed Amplifier Design Considerations 1-16. . . . . . . . . . . . . . . . . . . . . . . . . .

1.9 General PowerPAD

Design Considerations 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.10 THS7002 EVM Specifications 1-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . .

2.2 THS7002 EVM Board Layouts 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Running Title—Attribute Reference

Figures

1–1 THS7002 Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2 THS7002 EVM Power Conditioning Schematic Diagram 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–3 THS7002 EVM Schematic Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4 Simplified PGA Section of the THS7002 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–5 THS7002 Evaluation Module Block Diagram 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–6 THS7002 EVM Preamplifier Frequency Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–7 THS7002 EVM Preamplifier Phase Response 1-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–8 THS7002 EVM PGA Frequency Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–9 THS7002 EVM PGA Phase Response 1-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–10 THS7002 EVM Preamplifier + PGA Frequency Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . .

1–11 THS7002 EVM Preamplifier + PGA Phase Response 1-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–12 PowerPAD PCB Etch and Via Pattern 1-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–13 Maximum Power Dissipation vs Free-Air Temperature 1-18. . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–1 THS7002 EVM Component Placement Silkscreen and Solder Pads 2-3. . . . . . . . . . . . . . . . .

2–2 THS7002 EVM PC Board: Top Assembly 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–3 THS7002 EVM PC Board: Top Layer 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–4 THS7002 EVM PC Board: Bottom Layer 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

1–1 THS7002 EVM PGA Nominal Gain/Attenuation 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2 EVM DIP Switch Functionality 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–3 THS7002 EVM Jumper Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4 THS7002 EVM DIP Switch Settings 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–1 THS7002 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

General Information

General

Information

This chapter details the Texas Instruments (TI) THS7002

programmable-gainamplifierevaluationmodule(EVM),SLOP136.Itincludes

alistof EVMfeatures,abriefdescriptionofthemoduleillustratedwithpictorial

and schematic diagrams, EVM specifications, details on configuring,

connecting,andusingtheEVM,andadiscussiononhigh-speedamplifier and

PowerPAD package design considerations.

Topic Page

1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 Programmable Gain Amplifier Gain Control 1–7. . . . . . . . . . . . . . . . . . . . .

1.4 EVM DIP Switch Functionality 1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 EVM CIrcuit Configuration 1–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 Using The THS7002 EVM 1–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.7 THS7002 EVM Performance 1–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.8 General High-Speed Amplifier Design Considerations 1–16. . . . . . . . .

1.9 General PowerPADDesign Considerations 1–17. . . . . . . . . . . . . . . . . .

1.10 THS7002 EVM Specifications 1–20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Features

1-2

General Information

1.1 Features

THS7002 programmable-gain amplifier EVM features include:

Multiple Input Configurations Set Via On-board Jumpers

DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down,

Reference Voltage, and Output Clamping

Includes a THS4001 High-Speed Amplifier as an Inverter

Standard BNC Connectors Inputs and Outputs

±5-V to ±15-V Operation with 5-V Reference Input

Nominal 50-ΩImpedance Inputs and Outputs

Includes Test Points for Easy Digital Control of EVM Circuit Gain and

Operating Parameters

Good Example of PowerPAD Package and High-Speed Amplifier

Design and Layout

1.2 Description

The TI THS7002 programmable-gain amplifier evaluation module (EVM) is a

complete dual-channel low-noise receiver and a highly configurable

programmable-gain amplifier circuit. It consists of the TI THS7002

Programmable-Gain Amplifier IC, a TI THS4001 high-speed, low-power

operational amplifier IC, and a number of passive parts, all mounted on a

multilayer circuit board (Figure 1–1).

Although the THS7002 IC was developed primarily for xDSL receiver

front-ends, there are a large number of different circuits that can benefit from

the many features incorporated into the THS7002. This EVM illustrates a

universal design and can be used for numerous system configurations.

The EVM uses standard BNC connectors for inputs and outputs and also

includes test points for user connections and testing. It is completely

assembled, fully tested, and ready to use — just connect it to power, a signal

source, and a load (if desired).

Description

1-3

General Information

Figure 1–1.THS7002 Evaluation Module

PGA – A

Output

R45

PGA – B

Output

C21L2C5C4L1

+VCC GND +5 V–VCC

Pre-AmpA

Output

Pre-Amp B

Output

Input B

C20

JP5

J10

R1C1 R2 R9

InputA J6

R24

R26

R28

R30

R32

C18

C19 R34

R36

R38

R40

R42

R44

R18

AG2

(3)

AG1

(2)

AG0

(1)

(6)

BVREF

(5)

BS/D

(4)

AS/D

(4)

AVREF

(5)

(6)

BG2

(1)

BG1

(2)

BG0

(3)

JP4JP3

R16 R17

C17

JP1

R20

C11

C12

R12 C13

C10

R11

R15

R14

R13

R35

R37

R39

R41

R23

R25

R27

R29

R11

R33

R10

JP2

C14

1998

Texas Instruments

J4J3

SLOP136

Rev. B THS7002 EVM Board

+++

GND

U2 Out

InputpowerisappliedtotheEVMthroughbananajacksJ1,J2,J3, and J4. An

LC filter on each power bus isolates the EVM circuits from the external supply

(Figure 1–2). J4 provides a reference point for numerous circuit functions and

draws relatively little current. The schematic for the EVM amplifiers appears

in Figure 1–3.

Figure 1–2.THS7002 EVM Power Conditioning Schematic Diagram

–15 V

0.22 µHC4

6.8 µF

15 V

VCC

GND

–VCC

5 V

0.22 µH

6.8 µFC21

6.8 µF

TP1

Description

1-4

General Information

–

C11

0.1 µF

49.9 Ω

15 V

U1-A

THS7002

–15 V

C12, 0.1 µF

Input A

C8, TBD

7R5

49.9 ΩJ5

Pre-amp

A Out

499 Ω

–

R16

49.9 Ω

15 V

THS4001

–15 V

C1, TBD

22 Ω

1 kΩ

C2, 0.1 µF

JP1

TP12

U2-Out

Input B

JP3

JP2

–

U1-C

TBD

R13

TBD

C3, 0.1 µF

TBD

C10, TBD

R11

499 Ω

R10

499 Ω

R17

49.9 ΩJ8

Pre-amp B

Output

JP4

C14, TBD

R14

0 Ω

C6, TBD

0 Ω

R20

TBD C7

TBD

R12

TBD C13

TBD

VREF

SID

–Vcc VCC

GND

VIN–

C18, 0.1 µF–15 V

R29

330 ΩR18

49.9 Ω

R30

3.3 kΩ

5 V

S1-D S1-E

AVREF

TP8

AS/D

TP7

C19, 0.1 µF

15 V

R23, 330Ω

R25, 330Ω

R27, 330Ω

R24, 3.3 kΩ

R26, 3.3 kΩ

R28, 3.3 kΩ3

S2-F

TP5

R41

49.9 ΩR42

4.7 kΩ

R31

49.9 ΩR32

4.7 kΩ

R44

100 ΩJ9

PGA-A

Output

TP6 S1-F

–15 V

5 V15 V JP5

AG2, TP3

C17, 0.1 µF

5 V

R35, 330Ω

R37, 330Ω

R39, 330Ω

VIN–

VREF

SID

GND

12 R45

100 ΩJ10

PGA-B

Output

R33

330 ΩR15

49.9 Ω

R34

3.3 kΩ

5 V

S2-D S2-E

BVREF

TP14

BS/D

TP13

R36, 3.3 kΩ

R38, 3.3 kΩ

R40, 3.3 kΩ

BG2, TP9

C20, 0.1 µF5 V

S2-A

S2-B

S2-C

BG1, TP10

BG0, TP11

TP2, AG0

TP4, AG1

U1–B

U1–D

Figure 1–3.THS7002 EVM Schematic Diagram

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