Texas Instruments THS7001 Manuale utente

THS7001

ProgrammableĆGain Amplifier

Evaluation Module

December 1999 Mixed-Signal Products

User’s Guide

SLOU057

IMPORTANT NOTICE

TexasInstruments andits subsidiaries(TI) reservethe rightto makechanges totheir productsor todiscontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TIdeemsnecessarytosupport thiswarranty.Specific testingofallparametersof eachdeviceis notnecessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER

CRITICALAPPLICATIONS.INCLUSIONOFTIPRODUCTSINSUCHAPPLICATIONSISUNDERSTOODTO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TIassumes noliabilityforapplicationsassistance orcustomer productdesign. TIdoes notwarrantorrepresent

thatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orother

intellectual property right of TI covering or relating to any combination, machine, or process in which such

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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

iii

Chapter Title—Attribute Reference

Preface

Related Documentation From Texas Instruments

THS7001 Programmable-Gain Amplifier

(literature number

SLOS214) This is the data sheet for the THS7001 amplifier

integrated circuit used on the EVM.

PowerPAD



Thermally Enhanced Package

(literature number

SLMA002) This is the technical brief for the special PowerPAD

package in which the THS7001 amplifier IC is supplied.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

testedforcompliancewiththelimitsofcomputingdevicespursuanttosubpart

Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications, in which

case the user at his own expense will be required to take whatever measures

may be required to correct this interference.

Trademarks

TI is a trademark of Texas Instruments Incorporated.

PowerPAD is a trademark of Texas Instruments Incorporated.

Running Title—Attribute Reference

Chapter Title—Attribute Reference

Contents

1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 Programmable Gain Amplifier Gain Control 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 EVM DIP Switch Functionality 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 EVM Circuit Configuration 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 Using The THS7001 EVM 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.7 THS7001 EVM Performance 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.8 General High-Speed Amplifier Design Considerations 1-14. . . . . . . . . . . . . . . . . . . . . . . . . .

1.9 General PowerPAD

Design Considerations 1-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.10 THS7001 EVM Specifications 1-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 THS7001 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . .

2.2 THS7001 EVM Board Layouts 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Running Title—Attribute Reference

Figures

1–1 THS7001 Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2 THS7001 EVM Schematic Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–3 Simplified PGA Section of the THS7001 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4 THS7001 Evaluation Module Block Diagram 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–5 THS7001 EVM Preamplifier Response, VCC = ±15 V 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–6 THS7001 EVM Preamplifier Response, VCC = ±5 V 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–7 THS7001 EVM PGA Response, VCC = ±15 V 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–8 THS7001 EVM PGA Response, VCC = ±5 V 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–9 THS7001 EVM Preamplifier + PGA Response, VCC = ±15 V 1-13. . . . . . . . . . . . . . . . . . . . . .

1–10 THS7001 EVM Preamplifier + PGA Response, VCC = ±5 V 1-13. . . . . . . . . . . . . . . . . . . . . . .

1–11 PowerPAD PCB Etch and Via Pattern 1-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–12 Maximum Power Dissipation vs. Free-Air Temperature 1-16. . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–1 THS7001 EVM PC Board: Top Assembly 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–2 THS7001 EVM PC Board: Top Layer 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–3 THS7001 EVM PC Board: Bottom Layer 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

1–1 THS7001 EVM PGA Nominal Gain/Attenuation 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2 EVM DIP Switch Functionality 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–3 THS7001 EVM Jumper Settings 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4 THS7001 EVM DIP Switch Settings 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–1 THS7001 Programmable-Gain Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

General Information

General

Information

This chapter details the Texas Instruments (TI) THS7001

programmable-gainamplifierevaluationmodule(EVM),SLOP250.Itincludes

a list of EVM features, a brief description of the module illustrated with a

pictorial and schematic diagrams, EVM specifications, details on configuring,

connecting,andusingtheEVM,andadiscussiononhigh-speedamplifier and

PowerPAD package design considerations.

Topic Page

1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 Programmable Gain Amplifier Gain Control 1–6. . . . . . . . . . . . . . . . . . . . .

1.4 EVM DIP Switch Functionality 1–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 EVM CIrcuit Configuration 1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 Using the THS7001 EVM 1–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.7 THS7001 EVM Performance 1–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.8 General High-Speed Amplifier Design Considerations 1–14. . . . . . . . .

1.9 General PowerPADDesign Considerations 1–15. . . . . . . . . . . . . . . . . .

1.10 THS7001 EVM Specifications 1–18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Features

1-2

General Information

1.1 Features

THS7001 programmable-gain amplifier EVM features include:

Multiple Input Configurations Set Via On Board Jumpers

DIP Switches Allow Quick and Easy Adjustment of Gain, Shut Down,

Reference Voltage, and Output Clamping

Standard BNC Connector Inputs and Outputs

±5-V to ±15-V Operation With 5-V Reference Input

Nominal 50-ΩImpedance Inputs and Outputs

Includes Test Points for Easy Digital Control of EVM Circuit Gain and

Operating Parameters

Good Example of PowerPAD Package and High-Speed Amplifier

Design and Layout

1.2 Description

The TI THS7001 programmable-gain amplifier evaluation module (EVM) is a

complete low-noise receiver and a highly configurable programmable-gain

amplifiercircuit.ItconsistsoftheTITHS7001programmable-gainamplifierIC

and a number of passive parts, all mounted on a multilayer circuit board

(Figure 1–1).

Although the THS7001 IC was developed primarily for xDSL receiver

front-ends, a large number of different circuits can benefit from the many

features incorporated into the THS7001. This EVM illustrates a universal

design and can be used for numerous system configurations.

The EVM uses standard BNC connectors for inputs and outputs and also

includes test points for user connections and testing. It is completely

assembled, fully tested, and ready to use—just connect it to power, a signal

source, and a load (if desired).

Description

1-3

General Information

Figure 1–1.THS7001 Evaluation Module

PGA – A

Output

C21L2C5C4L1

+VCC GND +5 V–VCC

Pre-AmpA

Output

JP3

C15

Input

R24

R26

R28

R30

R32

C18, C10

C19, C9

R42

R44

R18

(3)

(2)

(1)

S/D

(4)

AVREF

(5)

(6)

C17

JP1

R20

C12

R41

R23

R25

R27

R29

R31

JP2

1999

Texas Instruments

J4J3

SLOP250 THS7001 EVM Board

+++

GND

C13

C14

InputpowerisappliedtotheEVMthroughbananajacksJ1,J2,J3, and J4. An

LCfilteroneachpowerbusisolatestheEVMcircuitsfromtheexternalsupply.

J4 provides a reference point for numerous circuit functions and draws

relativelylittlecurrent.TheschematicfortheEVMamplifiersappearsinFigure

1–2.

Description

1-4

General Information

49.9 Ω

Input A 3

JP2

–

TBD

C8, TBD

499 Ω

49.9 ΩJ5

Pre-amp A

Output

JP1

C6, TBD

0 Ω

R20

TBD C17

TBD

VREF

SID

–Vcc VCC

GND

VIN

C18, 0.1 µF–15 V

R29

330 ΩR18

49.9 Ω

R30

3.3 kΩ

5 V

S1:D S1:E

VREF

TP8

S/D

TP7

C19, 0.1 µF

+15 V

R23, 330Ω

R25, 330Ω

R27, 330Ω

R24, 3.3 kΩ

R26, 3.3 kΩ

R28, 3.3 kΩ3

TP5

R41

49.9 ΩR42

4.7 kΩ

R31

49.9 ΩR32

4.7 kΩ

R44

100 ΩJ9

PGA-A

Output

TP6

S1:F

–15 V

5 V+15 VJP3

G2, TP3

C17, 0.1 µF

5 V

TP2, G0

TP4, G1

U1:B

Figure 1–2.THS7001 EVM Schematic Diagram

–15 V

0.22 µHC4

6.8 µF

+15 V

+VCC

GND

–VCC

+5 V

5 V

0.22 µH

6.8 µFC21

6.8 µF

TP1

C13

0.1 µFC14

0.1 µF

C11

0.1 µF

C12

0.1 µF

+15 V

–15 V

U1:A

PREAMPLIFIER

S1:A

S1:B

S1:C

C15

0.1 µF

C9, 0.1 µF

C10, 0.1 µF

PGA

Indice

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