Texas Instruments TPS6381xEVM Manuale utente

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

User's Guide

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

This user’s guide describes the operation and use of the TPS6381xEVM evaluation module (EVM). The

EVM is designed to help users easily evaluate and test the operation and functionality of the TPS6381x

buck-boost converter family. The EVM has the output voltage set to 3.3 V or 3.45 V, depending on jumper

setting. The output voltage can be programmed via I2C interface between 1.8 V and 5.2 V. The EVM

operates with an input voltage between 2.2 V and 5.5 V. The output current can go up to 2.5 A in buck

mode and up to 2 A in boost mode. This document includes setup instructions for the hardware, together

with the schematic and the PCB layout of the EVM. Throughout this document, the abbreviations EVM,

TPS6381xEVM, and the term evaluation module are synonymous with the TPS6381x, unless otherwise

noted.

Figure 1. TPS6381xEVM

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Contents

1 Introduction ................................................................................................................... 3

2 Setup .......................................................................................................................... 3

3 Board Layout ................................................................................................................. 4

4 Schematic and Bill of Materials ............................................................................................ 8

5 Software User Interface..................................................................................................... 9

6 Register Map................................................................................................................ 12

List of Figures

1 TPS6381xEVM............................................................................................................... 1

2 TPS6381xEVM PCB - Assembly Layer................................................................................... 5

3 TPS6381xEVM PCB - Top Layer.......................................................................................... 5

4 TPS6381xEVM PCB - Signal Layer 1 (Top View)....................................................................... 6

5 TPS6381xEVM PCB - Signal Layer 2 (Top View)....................................................................... 6

6 TPS6381xEVM PCB - Bottom Layer (Top View)........................................................................ 7

7 TPS6381xEVM Schematic ................................................................................................. 8

8 Quick Connection Overview .............................................................................................. 10

9 GUI Home Screen.......................................................................................................... 11

10 GUI Settings Screen....................................................................................................... 11

11 GUI Register Map Screen................................................................................................. 12

List of Tables

1 Performance Specification Summary ..................................................................................... 3

2 TPS63810EVM Bill of Materials ........................................................................................... 9

3 TPS63811EVM Bill of Materials ........................................................................................... 9

4 Device Registers ........................................................................................................... 12

5 CONTROL Register Field Descriptions ................................................................................. 13

6 STATUS Register Field Descriptions.................................................................................... 14

7 DEVID Register Field Descriptions ...................................................................................... 15

8 VOUT1 Register Field Descriptions...................................................................................... 16

9 VOUT2 Register Field Descriptions...................................................................................... 17

Trademarks

All trademarks are the property of their respective owners.

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Introduction

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

1 Introduction

The Texas Instruments TPS6381x is a highly efficient, single-inductor, internally compensated buck-boost

converter in a 15-pin, 2.3-mm × 1.4-mm WCSP package. The output voltage can be selected between two

I2C-programmable values in the range from 1.8 V to 5.2 V in 25-mV steps. There are two versions of the

EVM, depending on the device being used:

• TPS63810EVM uses the TPS63810, in which the power-up value of the ENABLE bit is 1.

• TPS63811EVM uses the TPS63811, in which the power-up value of the ENABLE bit is 0.

The ENABLE bit in the control register controls the output state of the power stage. See Section 6 for

more details.

1.1 Background

The TPS6381xEVM uses the TPS6381x integrated circuit (IC) , and is set to 3.3 V or 3.45 V output

voltage, depending on jumper setting. The EVM operates with an input voltage between 2.2 V and 5.5 V.

1.2 Performance Specification

Table 1 provides a summary of the TPS6381xEVM performance specifications. All specifications are given

for ambient temperature of 25°C.

Table 1. Performance Specification Summary

SPECIFICATION TEST CONDITIONS MIN TYP MAX UNIT

Input voltage 2.2 5.5 V

Output voltage 1.8 5.2 V

Output current VIN ≥2.5 V, VOUT = 3.3 V 2.5 A

1.3 Modifications

The printed-circuit board (PCB) for the EVM is designed to accommodate the TPS6381x. Extra positions

are available for additional input and output capacitors, EN pin voltage divider, and I2C pullup resistors.

1.3.1 IC U1 Operation

This EVM requires an appropriate I2C interface, such as the TI USB2ANY, to reconfigure the TPS6381x.

The output voltage can be chosen between two I2C-programmable values by using an on-board jumper.

See Section 6 for the available output voltage values.

2 Setup

This section describes how to properly use the TPS6381xEVM.

2.1 Input and Output Connectors, Test Points, and Headers Description

2.1.1 J1, Pin 1 and 2 – VIN

Positive input voltage connection from the input power supply for the EVM.

2.1.2 J1, Pin 3 and 4 – S+/S-

Input voltage sense connections. Measure the input voltage at this point.

2.1.3 J1, Pin 5 and 6 – GND

Input voltage GND return connection from the input power supply for the EVM, common with J2 GND

connection

Setup

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2.1.4 J2, Pin 1 and 2 – VOUT

Positive output voltage connection

2.1.5 J2, Pin 3 and 4 – S+/S-

Output voltage sense connections. Measure the output voltage at this point.

2.1.6 J2, Pin 5 and 6 – GND

Output voltage GND return connection, common with J1 GND connection

2.1.7 TP1, TP2 – L1, L2

Test points connected to L1 and L2 switch node pins of the TPS6381x

2.1.8 TP3, TP4 – GND

Test points connected to SDA and SCL pins of the TPS6381x

2.1.9 J3 – I2C

10-pin header used to connect the USB2ANY adaptor to the EVM

2.1.10 JP1 – VSEL

Placing a jumper across VSEL and VOUT1 pins sets the output voltage to the value in VOUT1 register.

Placing a jumper across VSEL and VOUT2 pins sets the output voltage to the value in VOUT2 register.

2.1.11 JP2 – ENABLE

Placing a jumper across pins EN and ON enables the device. Placing a jumper across pins EN and OFF

disables the device.

2.2 Setup

To operate the EVM, connect a power supply with the positive lead to J1 VIN pins and the negative lead

to J1 GND pins. Connect a load with the positive lead to J2 VOUT pins and the negative lead to J2 GND

pins. Place a jumper across VSEL and VOUT1 or VOUT2 pins on JP1 to select the corresponding output

voltage register. Place a jumper across EN and ON pins on JP2 to enable the device.

3 Board Layout

This section provides the TPS6381xEVM board layout and illustrations.

3.1 Layout

Figure 2 through Figure 6 show the component placement and PCB layout of the TPS6381xEVM.

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Board Layout

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

Figure 2. TPS6381xEVM PCB - Assembly Layer

Figure 3. TPS6381xEVM PCB - Top Layer

Board Layout

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Figure 4. TPS6381xEVM PCB - Signal Layer 1 (Top View)

Figure 5. TPS6381xEVM PCB - Signal Layer 2 (Top View)

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Board Layout

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

Figure 6. TPS6381xEVM PCB - Bottom Layer (Top View)

Schematic and Bill of Materials

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4 Schematic and Bill of Materials

This section provides the TPS6381xEVM schematic and bill of materials.

4.1 Schematic

Figure 7. TPS6381xEVM Schematic

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Schematic and Bill of Materials

SLVUBK9A–July 2019–Revised October 2019

TPS6381xEVM

4.2 Bill of Materials

Table 2. TPS63810EVM Bill of Materials

QTY DESIGNATO

RVALUE DESCRIPTION SIZE PART NUMBER MANUFACTURER

1 C1 10 µF CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J106ME84 Murata

1 C5 150 µF CAP, TA, 150 µF, 10 V, ±20%, 0.005 Ω7343-31 T530D157M010ATE005 Kemet

2 C6, C7 47 µF CAP, CERM, 47 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J476ME15D Murata

1 L1 470 nH Inductor, Shielded, Composite, 470 nH, 3.5A, 7.6

mΩ

4x4x1.5 mm XFL4015-471MEC Coilcraft

1 R2, R5 1.00 MΩRES, 1.00 M, 1%, 0.1 W, 0603 0603 CRCW06031M00FKEA Vishay-Dale

1 U1 N/A IC, Single Inductor Buck-Boost Converter 2.3x1.4x1 mm TPS63810YFFR TI

Table 3. TPS63811EVM Bill of Materials

QTY DESIGNATO

RVALUE DESCRIPTION SIZE PART NUMBER MANUFACTURER

1 C1 10 µF CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J106ME84 Murata

1 C5 150 µF CAP, TA, 150 µF, 10 V, 20%, 0.005 Ω7343-31 T530D157M010ATE005 Kemet

2 C6, C7 47 µF CAP, CERM, 47 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J476ME15D Murata

1 L1 470 nH Inductor, Shielded, Composite, 470 nH, 3.5 A, 7.6

mΩ

4x4x1.5 mm XFL4015-471MEC Coilcraft

1 R2, R5 1.00 MΩRES, 1.00 M, 1%, 0.1 W, 0603 0603 CRCW06031M00FKEA Vishay-Dale

1 U1 N/A IC, Single Inductor Buck-Boost Converter 2.3x1.4x1 mm TPS63811YFFR TI

5 Software User Interface

5.1 Software Setup

A graphical user interface (GUI) is available from ti.com website

(http://www.ti.com/product/TPS63810/toolssoftware) which allows simple and convenient programming of

the device through the TI USB2ANY (http://www.ti.com/tool/USB2ANY) device. Alternatively, the user can

use any I2C-standardized programming tool or I2C host to configure the device. Mind the I2C pins

specification, such as timing parameters and proper pullup resistors, provided with the High Current, High

Efficiency Single Inductor Buck-Boost Converter Data Sheet.

5.2 Interface Hardware Setup

Connect the USB2ANY adapter to your PC using the supplied USB cable. Connect the EVM connector J3

to the USB2ANY adapter using the supplied 10-pin ribbon cable. The connectors on the ribbon cable are

keyed to prevent incorrect installation.

Figure 8 shows a quick adapter connection overview.

Host

Computer

USB Cable

USB

Interface

Adapter

Green LED

Indicates

Power

10-Pin

Ribbon

Cable

EVM Board

USB Interface Adaptor Quick Connection Diagram

Software User Interface

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Figure 8. Quick Connection Overview

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