Texas Instruments MSP430F67691 Manuale utente

Errata

MSP430F67691 Microcontroller

ABSTRACT

This document describes the known exceptions to the functional specifications (advisories).

Table of Contents

1 Functional Advisories............................................................................................................................................................ 2

2 Preprogrammed Software Advisories.................................................................................................................................. 2

3 Debug Only Advisories.......................................................................................................................................................... 3

4 Fixed by Compiler Advisories............................................................................................................................................... 3

5 Nomenclature, Package Symbolization, and Revision Identification................................................................................ 4

5.1 Device Nomenclature.........................................................................................................................................................4

5.2 Package Markings..............................................................................................................................................................4

5.3 Memory-Mapped Hardware Revision (TLV Structure)....................................................................................................... 5

6 Advisory Descriptions............................................................................................................................................................6

7 Revision History................................................................................................................................................................... 26

www.ti.com Table of Contents

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1 Functional Advisories

Advisories that affect the device's operation, function, or parametrics.

✓ The check mark indicates that the issue is present in the specified revision.

Errata Number

Rev A

ADC39 ✓

ADC42 ✓

ADC69 ✓

AUXPMM1 ✓

AUXPMM2 ✓

COMP10 ✓

CPU36 ✓

CPU37 ✓

CPU46 ✓

CPU47 ✓

DMA4 ✓

DMA7 ✓

DMA9 ✓

DMA10 ✓

LCDB6 ✓

PMM11 ✓

PMM12 ✓

PMM14 ✓

PMM15 ✓

PMM18 ✓

PMM20 ✓

PMM26 ✓

PORT15 ✓

PORT19 ✓

PORT26 ✓

RTC8 ✓

SD3 ✓

SYS16 ✓

UCS11 ✓

USCI36 ✓

USCI37 ✓

USCI41 ✓

USCI42 ✓

USCI47 ✓

USCI50 ✓

2 Preprogrammed Software Advisories

Advisories that affect factory-programmed software.

✓ The check mark indicates that the issue is present in the specified revision.

Errata Number

Rev A

BSL7 ✓

Functional Advisories www.ti.com

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Errata Number

Rev A

BSL14 ✓

3 Debug Only Advisories

Advisories that affect only debug operation.

✓ The check mark indicates that the issue is present in the specified revision.

Errata Number

Rev A

EEM17 ✓

EEM19 ✓

EEM23 ✓

JTAG26 ✓

JTAG27 ✓

4 Fixed by Compiler Advisories

Advisories that are resolved by compiler workaround. Refer to each advisory for the IDE and compiler versions

with a workaround.

✓ The check mark indicates that the issue is present in the specified revision.

Errata Number

Rev A

CPU21 ✓

CPU22 ✓

CPU40 ✓

Refer to the following MSP430 compiler documentation for more details about the CPU bugs workarounds.

TI MSP430 Compiler Tools (Code Composer Studio IDE)

•MSP430 Optimizing C/C++ Compiler: Check the --silicon_errata option

•MSP430 Assembly Language Tools

MSP430 GNU Compiler (MSP430-GCC)

•MSP430 GCC Options: Check -msilicon-errata= and -msilicon-errata-warn= options

•MSP430 GCC User's Guide

IAR Embedded Workbench

•IAR workarounds for msp430 hardware issues

www.ti.com Debug Only Advisories

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5 Nomenclature, Package Symbolization, and Revision Identification

The revision of the device can be identified by the revision letter on the Package Markings or by the HW_ID

located inside the TLV structure of the device.

5.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP

MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These

prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully

qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated

fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.

TI recommends that these devices not be used in any production system because their expected end-use failure

rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature

range, package type, and distribution format.

5.2 Package Markings

PEU128 QFP (PEU), 128 Pin

PZ100 LQFP (PZ) 100 Pin

Nomenclature, Package Symbolization, and Revision Identification www.ti.com

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5.3 Memory-Mapped Hardware Revision (TLV Structure)

Die Revision TLV Hardware Revision

Rev A 10h

Further guidance on how to locate the TLV structure and read out the HW_ID can be found in the device User's

Guide.

www.ti.com Nomenclature, Package Symbolization, and Revision Identification

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6 Advisory Descriptions

ADC39 ADC Module

Category Functional

Function Erroneous ADC10 results in extended sample mode

Description If the extended sample mode is selected (ADC10SHP = 0) and the ADC10CLK is

asynchronous to the SHI signal, the ADC10 may generate erroneous results.

Workaround 1) Use the pulse sample mode (ADC10SHP=1)

2) Use a synchronous clock for ADC10 and the SHI signal.

ADC42 ADC Module

Category Functional

Function ADC stops converting when successive ADC is triggered before the previous conversion

ends

Description Subsequent ADC conversions are halted if a new ADC conversion is triggered while ADC

is busy. ADC conversions are triggered manually or by a timer. The affected ADC modes

are:

- sequence-of-channels

- repeat-single-channel

- repeat-sequence-of-channels (ADC12CTL1.ADC12CONSEQx)

In addition, the timer overflow flag cannot be used to detect an overflow

(ADC12IFGR2.ADC12TOVIFG).

Workaround 1. For manual trigger mode (ADC12CTL0.ADC12SC), ensure each ADC conversion

is completed by first checking ADC12CTL1.ADC12BUSY bit before starting a new

conversion.

2. For timer trigger mode (ADC12CTL1.ADC12SHP), ensure the timer period is greater

than the ADC sample and conversion time.

To recover the conversion halt:

1. Disable ADC module (ADC12CTL0.ADC12ENC = 0 and ADC12CTL0.ADC12ON = 0)

2. Re-enable ADC module (ADC12CTL0.ADC12ON = 1 and ADC12CTL0.ADC12ENC =

3. Re-enable conversion

ADC69 ADC Module

Category Functional

Function ADC stops operating if ADC clock source is changed from SMCLK to another source

while SMCLKOFF = 1.

Advisory Descriptions www.ti.com

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Description When SMCLK is used as the clock source for the ADC (ADC12CTL1.ADC12SSELx =

11) and CSCTL4.SMCLKOFF = 1, the ADC will stop operating if the ADC clock source is

changed by user software (e.g. in the ISR) from SMCLK to a different clock source. This

issue appears only for the ADC12CTL1.ADC12DIVx settings /3/5/7. The hang state can

be recovered by PUC/POR/BOR/Power cycle.

Workaround 1. Set CSCTL4.SMCLKOFF = 0 before switch ADC clock source.

2. Only use ADC12CTL1.ADC12DIVx as /1, /2, /4, /6, /8

AUXPMM1 AUXPMM Module

Category Functional

Function AUXVCC1/AUXVCC2 can not be switched back to DVCC

Description When the system is running with the AUXVCC1 supply after DVCC/AVCC is lost, if the

AUXVCC1 voltage goes lower than SVSH setting for POR and above BORH level, the

system can not switch back to DVCC after DVCC ramps back up again.

Similarly, when the system is running with the AUXVCC2 supply after DVCC/AVCC is lost,

if the AUXVCC2 voltage goes lower than SVSH setting for POR and above BORH level,

the system can not switch back to DVCC after DVCC ramps back up again.

Workaround When the system is running with the AUXVCC1 supply, use SVMH to monitor AUXVCC1

voltage. When AUXVCC1 is lower than the SVMH setting, the program drives the chip

into LPMx.5. After DVCC ramps up back again, trigger one of the wake up pins. The

power supply could be switched back to DVCC again.

When the system is running with the AUXVCC2 supply, use SVMH to monitor AUXVCC2

voltage. When AUXVCC2 is lower than the SVMH setting, the program drives the chip

into LPMx.5. After DVCC ramps up back again, trigger one of the wake up pins. The

power supply could be switched back to DVCC again.

AUXPMM2 AUXPMM Module

Category Functional

Function Latch-up in AUXPMM

Description Latch-up current can appear at the AUXPMM module supply pins in the following two

scenarios:

Scenario 1: When the AUXPMM is configured for hardware- or software-controlled

switching and the module switches from DVCC to AUXVCC2, latch-up current can

appear at AUXVCC2 at the switching point defined by SVSMHCTL.SVSMHRRL (or

AUXCTL2.AUX0LVLx). The probability for this event to occur depends on:

a) Operating temperature (higher temperatures increase probability)

b) External AUXVCC2 voltage level (higher voltages increase probability)

c) SVSMHRRL level (lower levels increase probability) defining the switching level in

hardware-controlled mode

d) AUX0LVLx level (lower levels increase probability) defining the switching level in

software-controlled mode (applicable to DVCC only)

Scenario 2: When a battery is connected to DVCC, AUXVCC1 or AUXVCC2 as the first

voltage supply, due to the low internal resistance of the battery a very fast rise time is

www.ti.com Advisory Descriptions

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seen by the AUXPMM and latch-up current can appear at the connected supply if:

a) Rise times are in the range of 140 kV/s (faster rise times increase probability)

b) Device operates at temperatures of 75 deg C and above (higher temperatures increase

probability)

The latch-up current disappears after complete power cycles of all supply sources.

Workaround For scenario 1:

- Increase SVSMRRL to a level above maximum external voltage expected on AUXVCC2.

SVSMRRL = 6 or 7 (requires VCORE level of 3) is applicable for AUXVCC2 of up to

maximum voltage, 3.58V, while a lower SVSMRRL setting can be selected if a lower

voltage (e.g. 3.3V) is expected on AUXVCC2.

- Connect all 3 supplies via 3 external diodes to DVCC and realize the switching externally

without using the internal AUXPMM switches. See application report "Implementation of a

Three-Phase Electronic Watt-Hour Meter Using the MSP430F471xx" for details.

- Use AUXVCC1 instead of AUXVCC2 for backup supply

For scenario 2:

Limit the supply voltage ramp up time through a series resistor (e.g. 10 Ohm) in the critical

supply path. Side effects such as voltage dips due to high current consumption of the

device need to be considered.

BSL7 BSL Module

Category Software in ROM

Function BSL does not start after waking up from LPMx.5

Description When waking up from LPMx.5 mode, the BSL does not start as it does not clear the Lock

I/O bit (LOCKLPM5 bit in PM5CTL0 register) on start-up.

Workaround 1. Upgrade the device BSL to the latest version (see Creating a Custom Flash-Based

Bootstrap Loader (BSL) Application Note - SLAA450 for more details)

2. Do not use LOCKLPM5 bit (LPMx.5) if the BSL is used but cannot be upgraded.

BSL14 BSL Module

Category Software in ROM

Function BSL request to unlock the JTAG

Description The feature in the BSL to keep the JTAG unlocked by setting the bit

BSL_REQ_JTAG_OPEN in the return value has been disabled in this device.

Workaround None

COMP10 COMP Module

Category Functional

Advisory Descriptions www.ti.com

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Function Comparator port output toggles when entering or leaving LPM3/LPM4

Description The comparator port pin output (CECTL1.CEOUT) erroneously toggles when device

enters or leaves LPM3/LPM4 modes under the following conditions:

1) Comparator is disabled (CECTL1.CEON = 0)

AND

2) Output polarity is enabled (CECTL1.CEOUTPOL = 1)

AND

3) The port pin is configured to have CEOUT functionality.

For example, if the CEOUT pin is high when the device is in Active Mode, CEOUT pin

becomes low when the device enters LPM3/LPM4 modes.

Workaround When the comparator is disabled, ensure at least one of the following:

1) Output inversion is disabled (CECTL.CEOUTPOL = 0)

2) Change pin configuration from CEOUT to GPIO with output low.

CPU21 CPU Module

Category Compiler-Fixed

Function Using POPM instruction on Status register may result in device hang up

Description When an active interrupt service request is pending and the POPM instruction is used to

set the Status Register (SR) and initiate entry into a low power mode , the device may

hang up.

Workaround None. It is recommended not to use POPM instruction on the Status Register.

Refer to the table below for compiler-specific fix implementation information.

IDE/Compiler Version Number Notes

IAR Embedded Workbench Not affected

TI MSP430 Compiler Tools (Code

Composer Studio) v4.0.x or later

User is required to add the compiler

or assembler flag option below. --

silicon_errata=CPU21

MSP430 GNU Compiler (MSP430-

GCC) MSP430-GCC 4.9 build 167 or later

CPU22 CPU Module

Category Compiler-Fixed

Function Indirect addressing mode with the Program Counter as the source register may produce

unexpected results

www.ti.com Advisory Descriptions

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Description When using the indirect addressing mode in an instruction with the Program Counter (PC)

as the source operand, the instruction that follows immediately does not get executed.

For example in the code below, the ADD instruction does not get executed.

mov @PC, R7

add #1h, R4

Workaround Refer to the table below for compiler-specific fix implementation information.

IDE/Compiler Version Number Notes

IAR Embedded Workbench Not affected

TI MSP430 Compiler Tools (Code

Composer Studio) v4.0.x or later

User is required to add the compiler

or assembler flag option below. --

silicon_errata=CPU22

MSP430 GNU Compiler (MSP430-

GCC) MSP430-GCC 4.9 build 167 or later

CPU36 CPU Module

Category Functional

Function PC corruption when single-stepping through flash erase

Description When single-stepping over code that initiates an INFOD Flash memory erase, the

program counter is corrupted.

Workaround None.

NOTE: This erratum applies to debug mode only.

CPU37 CPU Module

Category Functional

Function Wrong program trace display in the debugger while using conditional jump instructions

Description The state storage window displays an incorrect sequence of instructions when:

1. Conditional jump instructions are used to form a software loop

AND

2. A false condition on the jump breaks out of the loop

In such cases the trace buffer incorrectly displays the first instruction of the loop as the

instruction that is executed immediately after exiting the loop.

Example:

Actual Code:

mov #4,R4

LABEL mov #1,R5

dec R4

jnz LABEL

Advisory Descriptions www.ti.com

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