Texas Instruments TS3USB221 Manuale utente
User's Guide
SCDU001A–July 2009–Revised October 2009
TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2
Multiplexer/Demultiplexer Switch Evaluation Module
Contents
1 Preface ....................................................................................................................... 2
2 Introduction .................................................................................................................. 3
3 EVM Configuration and Description ...................................................................................... 5
4 Related Documentation ................................................................................................... 14
List of Figures
1 TS3USB221/A/E EVM Block Diagram ................................................................................... 3
2 Quick Start Evaluation...................................................................................................... 4
3 Jumpers J6, J7, and J8 Configuration ................................................................................... 5
4 EVM Schematic ............................................................................................................. 7
5 Top Silkscreen/Assembly .................................................................................................. 9
6 Top Metal (High-Speed Differential) .................................................................................... 10
7 Internal Ground Plane .................................................................................................... 11
8 Internal Power Plane...................................................................................................... 12
9 Bottom Metal (Low-Speed Single-Ended).............................................................................. 13
10 Bottom Silkscreen/Assembly............................................................................................. 13
List of Tables
1 EVM Jumper Description................................................................................................... 5
2 EVM Connector Description............................................................................................... 5
3 Board Stack-Up ............................................................................................................. 6
4 Bill of Materials............................................................................................................. 14
1
SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
Switch Evaluation Module
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ATTENTION
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
STATIC SENSITIVE DEVICES
Preface
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1 Preface
1.1 About This Manual
This user’s guide describes the TS3USB221/A/E Evaluation Module (EVM). This guide contains the EVM
schematics, bill of materials, assembly drawings, and top and bottom board layouts.
1.2 How to Use This Manual
This document contains the following chapters:
• Chapter 1 – Preface
• Chapter 2 – Introduction and Quick Start
• Chapter 2 – EVM Configuration and Description
• Chapter 3 – Related Documents
1.2.1 Information about Cautions and Warnings
CAUTION
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in its supplied ESD
bag when not in use. Handle using an antistatic wristband. Operate on an
antistatic work surface. For more information on proper handling, see the
Electrostatic Discharge (ESD) application note (SSYA008).
The information in a caution or a warning is provided for your protection. Please read each caution and
warning carefully.
1.2.2 FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his/her own expense will be
required to take whatever measures may be required to correct this interference.
2TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009
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TS3USB221/A/E EVM
TS3USB221/A/E
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Introduction
2 Introduction
The TS3USB221/A/E EVM is an evaluation module for the Texas Instruments (TI) 1:2
multiplexer/demultiplexer high-bandwidth USB switches. It is specially designed for high-speed USB 2.0
signals, supports bidirectional signaling, and offers high-bandwidth (1.1 GHz). When interfacing other USB
devices with this EVM, the switch allows signals to pass with minimum edge and phase distortion as well
as little or no signal attenuation.
This evaluation module is designed to demonstrate the small printed circuit board (PCB) areas that can be
achieved when designing with the TS3USB221/A/E USB switches. It is powered from the 5-V rail of the
USB input. Additionally, the TS3USB221/A/E provides an output enable input and an output select input
for flexible configuration of the USB. See Figure 1 for the EVM block diagram.
Figure 1. TS3USB221/A/E EVM Block Diagram
2.1 List of Hardware Items for Operation
The following items are required for EVM evaluation:
• The TS3USB221/A/E EVM
• USB cables with connector type depending on the surrounding system
The following items are optional for EVM evaluation:
• USB type A or type B connectors to change connectors J1 through J5 for optimal system interface
configuration
• IBM compatible PC with USB 2.0 ports for quick start evaluation
3
SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
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TS3USB221/A/E EVM
TS3USB221/A/E
Introduction
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2.2 Quick Start
Figure 2. Quick Start Evaluation
1. Connect the PC to the USB connector J3 through a USB cable.
2. Make sure the 3.3-V LDO output is enabled by opening J8 without a jumper.
3. Make sure the TS3USB221/A/E IC is enabled by shunting J7 with a jumper.
4. Connect two USB downstream devices (for example, mouse, keyboard, USB memory stick, etc) to J4
and J5 on the EVM.
5. To select USB downstream device 1 connected to J4, make sure J6 is shunted with a jumper. To
select USB downstream device 2 connected to J5, make sure J6 is open without a jumper.
6. Connector J1 and J2 are connected together without a USB switch. This through-path can serve as a
reference to compare with the TS3USB221/A/E path.
4TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009
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TS3USB221/A/E
Output Select or
Ouput Enable
3.3-V LDO
Ouput Enable
10 kW10 kW
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EVM Configuration and Description
3 EVM Configuration and Description
3.1 EVM Description
To conform to the USB 2.0 specification, the differential traces D+ and D- lines on the board are
impedance matched to 90-Ωdifferential. The trace length of the through-path and the trace length through
the TS3USB221/A/E switch are also matched for comparison purpose. The PCB is a simple four-layer
top-side populated board (see the schematic and PCB layout in Section 3.4 and Section 3.5). The major
features of the hardware design are detailed in the following sections.
3.2 Jumper Configuration (J6 to J8)
The EVM has jumper J6 through J8 (see Figure 3) to provide configuration to the TS3USB221/A/E and the
3.3-V LDO. J6 allows switch output channel select, J7 provides switch enable control, and J8 provides
3.3-V LDO enable control. Table 1 lists all of the jumpers in the EVM and their respective functionality (all
default settings are in bold).
Figure 3. Jumpers J6, J7, and J8 Configuration
Table 1. EVM Jumper Description
Jumper Functionality Configuration
Shunt J6 to select output 1
J6 TS3USB221/A/E Select Open J6 to select output 2
Shunt J7 to enable the switch
J7 TS3USB221/A/E Enable Open J7 to disable the switch
Shunt J8 to disable the LDO
J8 3.3V LDO Enable Open J8 to enable the LDO
The EVM provides USB connectors J1 through J5 to interface with other USB devices. Depending on the
application need, the connectors can be de-soldered and changed to either type A or type B connector.
See Table 2 for the default connectors on the EVM.
Table 2. EVM Connector Description
Connector Functionality Configuration
Default as type B connector
J1 USB Connector Can be replaced with type A connector
Default as type A connector
J2 USB Connector Can be replaced with type B connector
Default as type B connector
J3 USB Connector Can be replaced with type A connector
Default as type B connector
J4 USB Connector Can be replaced with type A connector
Default as type B connector
J5 USB Connector Can be replaced with type A connector
5
SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
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EVM Configuration and Description
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3.3 Board Stack-Up
Table 3 shows the board stack-up.
Table 3. Board Stack-Up
Subclass Thickness Dielectric Loss Width Impedance Coupling Spacing Diff Zo
Type Shield
Name (mils) Constant Tangent (mils) (Ω) Type (mils) (Ω)
1 SURFACE
2 TOP CONDUCTOR 2.4 1 0 7.5 47.72 EDGE 7.5 85.004
3 DIELECTRIC 4 4.1 0.035
4 GND PLANE 1.2 1 0 YES
5 DIELECTRIC 48 4.1 0.035
6 VCC PLANE 1.2 1 0 YES
7 DIELECTRIC 4 4.1 0.035 7.5 47.72 EDGE 7.5 85.004
8 BOTTOM CONDUCTOR 2.4 1 0
9 SURFACE
6TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009
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EVM Configuration and Description
3.4 Schematics
Figure 4. EVM Schematic
7
SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
Switch Evaluation Module
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EVM Configuration and Description
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3.5 PCB Layout
Figure 5. Top Silkscreen/Assembly
8TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A–July 2009–Revised October 2009
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EVM Configuration and Description
Figure 6. Top Metal (High-Speed Differential)
9
SCDU001A–July 2009–Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
Switch Evaluation Module
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EVM Configuration and Description
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Figure 7. Internal Ground Plane
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