ADLINK Technology IMB-M47 Manuale utente

IMB-M47

User’s Manual

ATX Motherboard with 12/13th Gen Intel®Core™ i9/i7/i5/i3 Processors

and Intel®Q670 Chipset

Manual Rev.: 1.0

Revision Date: Sep.20, 2023

Part Number: 50M-13016-1000

ii Preface

Preface

All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in

any form without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior notice in order to improve reliability, design, and

function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer

be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use

the product or documentation, even if advised of the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global environmental preservation

through compliance with the European Union's Restriction of Hazardous Substances (RoHS)

directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental

protection is a top priority for ADLINK. We have enforced measures to ensure that our products,

manufacturing processes, components, and raw materials have as little impact on the

environment as possible. When products are at their end of life, our customers are encouraged

to dispose of them in accordance with the product disposal and/or recovery programs

prescribed by their nation or company.

Battery Labels (for products with battery)

California Proposition 65 Warning

WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,

cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,

styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause

cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,

DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other

reproductive harm. For more information go to www.P65Warnings.ca.gov.

Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks and/or

registered trademarks of their respective companies.

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IMB-M47

Preface iii

Revision History

Revision Description Date By

1.0 Initial release 2023-09-20 CC

iv Preface

Table of Contents

Preface ................................................................................................................................ii

Table of Contents..............................................................................................................iv

List of Figures ...................................................................................................................vi

List of Tables....................................................................................................................vii

1Introduction................................................................................................................1

1.1 Packing List ................................................................................................................1

1.2 Optional Accessories ..................................................................................................1

2Specifications ............................................................................................................3

2.1 Core System ...............................................................................................................3

2.2 I/O Interface ................................................................................................................4

2.3 Video...........................................................................................................................4

2.4 Audio...........................................................................................................................4

2.5 LAN.............................................................................................................................4

2.6 Temperatures .............................................................................................................5

2.7 Humidity......................................................................................................................5

2.8 Certificate (EMC) ........................................................................................................5

2.9 Form Factor ................................................................................................................5

2.10 Operating Systems .....................................................................................................5

2.11 Functional Block Diagram...........................................................................................6

3Mechanical Layout ....................................................................................................7

3.1 Connector Locations...................................................................................................7

3.2 Mechanical Dimensions............................................................................................11

4Connector Pinouts ..................................................................................................13

4.1 Rear IO Connectors..................................................................................................13

4.2 Onboard Headers / Connectors................................................................................16

4.3 Jumper and Swtich Settings .....................................................................................22

4.4 Expansion Slots ........................................................................................................23

5Driver Installation ....................................................................................................27

6UEFI Setup ...............................................................................................................29

6.1 Menu Structure .........................................................................................................29

6.2 Main Menu ................................................................................................................30

6.3 Advanced Menu........................................................................................................31

6.4 Thunderbolt (TM) Configuration...............................................................................48

6.5 Hardware Health Event Monitoring Screen ..............................................................49

IMB-M47

Preface v

6.6 Security Screen ........................................................................................................50

6.7 Boot Screen ..............................................................................................................54

6.8 Exit Screen ...............................................................................................................55

Safety Instructions...........................................................................................................57

Getting Service.................................................................................................................58

vi Preface

List of Figures

Figure 1: Functional Block Diagram .........................................................................................................6

Figure 2: IO Panel Connector Locations ..................................................................................................7

Figure 3: Onboard Connector Locations ..................................................................................................8

Figure 4: Mechanical Dimensions ..........................................................................................................11

Figure 5: Mechanical Dimensions - IO Panel.........................................................................................12

IMB-M47

Preface vii

List of Tables

Table 1: IO Panel Connector Definitions ..................................................................................................7

Table 2: Onboard Connector Definitions ..................................................................................................9

viii Preface

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IMB-M47

Introduction 1

1 Introduction

ADLINK IMB-M47 ATX is an industrial motherboard supporting 12/13th Generation Intel® Core™ i9/i7/i5/i3 desktop

processors, an Intel® Q670 Chipset, and 7 PCIe expansion slots to provide a cost-competitive embedded

computing solution. It includes high-speed data transfer interfaces such as PCIe 5.0, USB 3.2 Gen2, and SATA 6

Gb/s (SATA III), and dual-channel DDR5 3600/4000/4800 MHz RAM for industrial automation applications. With

industrial-grade I/O port design, the IMB-M47 offers a significant competitive advantage for embedded computing

applications in terms of device compatibility, durable connectivity, and extreme environment readiness.

1.1 Packing List

•IMB-M47 ATX motherboard

•Rear I/O shield

•M.2 screw kit

1.2 Optional Accessories

•CPU cooler for 65W CPU (Part Number: 32-20976-0000-A0)

•CPU cooler for 125W CPU (available by request only)

•2-port USB 2.0 cable with bracket (Part Number: 30-25010-3010)

•2-port USB 3.0 cable with bracket (Part Number: 30-25046-0100)

•1-port LPT cable with bracket (Part Number: 30-25019-2000)

•2-port COM cable with bracket (Part Number: 30-25116-0000-A0)

2 Introduction

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