ADLINK Technology MCN-2600T Manuale utente

Leading EDGE COMPUTING
MCN-2600T
Intel® Xeon® Processor E5-2600 v3/v4 CPU Sled
User’s Manual
Manual Revision: 1.0
Revision Date: November 2, 2018
Part No.: 50-1Z268-1000

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MCN-2600T
Preface
Copyright 2018 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve
reliability, design, and function and does not represent a commitment on the part of the
manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the European
Union's Restriction of Hazardous Substances (RoHS) directive and
Waste Electrical and Electronic Equipment (WEEE) directive.
Environmental protection is a top priority for ADLINK. We have enforced
measures to ensure that our products, manufacturing processes,
components, and raw materials have as little impact on the environment
as possible. When products are at their end of life, our customers are
encouraged to dispose of them in accordance with the product disposal and/or recovery
programs prescribed by their nation or company.
Battery Labels (for products with battery)
ᑜ㔚ᳰ⺧࿁ᡴ
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide,
arsenic, benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-
Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials,
which are known to the State of California to cause cancer, and acrylamide, benzene,
cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl
materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be
trademarks and/or registered trademarks of their respective companies.

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MCN-2600T
Revision History
Revision Release Date Description of Change(s)
1.0 2018-11-02 Initial release

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MCN-2600T
Table of Contents
Preface .................................................................................................................................. 2
1 Overview .......................................................................................................................... 6
1.1 Introduction ............................................................................................................................. 6
1.2 CPU Sled Overview ................................................................................................................ 7
1.2.1 CPU Sled Specifications.................................................................................................... 7
1.2.2 CPU Sled Front Panel ....................................................................................................... 8
1.2.3 CPU Sled Layout ............................................................................................................... 9
1.2.4 DPDK Support ................................................................................................................. 10
2 Getting Started................................................................................................................11
2.1 Preparing the CPU Sled.........................................................................................................11
2.1.1 Installing the CPUs ...........................................................................................................11
2.1.2 Installing the Heatsinks.................................................................................................... 13
2.1.3 Installing Memory............................................................................................................. 14
2.1.4 Installing a SATA Drive..................................................................................................... 16
2.1.5 Installing an M.2 SSD Module ......................................................................................... 18
2.2 Front Panel Layout................................................................................................................ 19
2.3 Inserting and Removing the CPU Sled ................................................................................. 19
3 Powering Up the CPU Sled ........................................................................................... 20
3.1 Power-Up Behavior...............................................................................................................20
3.2 Health/Status Indicators........................................................................................................20
4 Using the CPU Sled ....................................................................................................... 21
4.1 Hot-Swapping the CPU Sled................................................................................................. 21
4.2 Using Serial Console ............................................................................................................21
4.3 Serial Over LAN via BMC ..................................................................................................... 23
4.3.1 Configuring the BMC IP Address ..................................................................................... 23
4.3.2 Configuring BIOS for SOL ............................................................................................... 24
4.3.3 Configuring OS for SOL................................................................................................... 24
4.3.4 Establishing SOL ............................................................................................................. 24
4.4 Firmware Upgrade ................................................................................................................25
4.4.1 Updating MCN-2600T BIOS ............................................................................................ 25
4.4.2 Updating BMC ................................................................................................................. 26
5 BIOS Setup..................................................................................................................... 27
5.1 Entering BIOS Setup.............................................................................................................27
5.2 Setup Menu........................................................................................................................... 27
5.3 Navigation............................................................................................................................. 28
5.4 Main Setup............................................................................................................................ 31
5.4.1 System & Board Info........................................................................................................ 31
5.4.2 System Date/System Time .............................................................................................. 32
5.5 Advanced BIOS Setup.......................................................................................................... 32
5.5.1 ACPI Settings .................................................................................................................. 33
5.5.2 AST1010 Super IO Configuration .................................................................................... 34
5.5.3 Serial Port Console Redirection....................................................................................... 36
5.5.4 PCI Subsystem Settings .................................................................................................. 39
5.5.5 Network Stack Configuration ........................................................................................... 40
5.5.6 CSM Configuration .......................................................................................................... 41
5.5.7 ADLINK IPMI Settings ..................................................................................................... 42
5.5.8 LAN Bypass Settings ....................................................................................................... 43

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MCN-2600T
5.6 IntelRCSetup......................................................................................................................... 45
5.6.1 Processor Configuration .................................................................................................. 45
5.6.2 Advanced Power Management Configuration ................................................................. 48
5.6.3 Common RefCode Configuration..................................................................................... 50
5.6.4 Memory Configuration ..................................................................................................... 50
5.6.5 IIO Configuration.............................................................................................................. 52
5.6.6 PCH Configuration........................................................................................................... 54
5.7 Server Mgmt ......................................................................................................................... 56
5.8 Security Setup....................................................................................................................... 58
5.9 Boot Setup ............................................................................................................................ 59
5.10 Save & Exit Menu ................................................................................................................61
Safety Instructions ............................................................................................................. 64
Consignes de Sécurité Importantes ................................................................................. 66
Getting Service ................................................................................................................... 68

6
MCN-2600T
1 Overview
1.1 Introduction
The ADLINK MCN-2600T is a high-performance CPU sled featuring dual Intel® Xeon® E5
processors, interconnected by dual redundant switch modules when installed in the CSA-
7400 Network Appliance. It is ideally suited for building next generation high-performance
firewalls and virtualized telecom elements.
The main features of the MCN-2600T are summarized as follows:
xMaximum of four MCN-2600T CPU sleds are supported in the CSA-7400
xDual redundant switch modules provide up to 2x 50G data plane links to each MCN-
2600T in the CSA-7400
xIndependent 1G control plane links that connect four MCN-2600T, two switch
management CPUs (implemented by COMe module) and two Chassis Management
Modules (CMM).
xSupports IPMI 2.0 specification, provides web-based intelligent system management
via CMM on switch sleds, and supports SOL on compute nodes
xOptionally integrates Wind River® Titanium Server or OPNFV software to provide
carrier grade NFV service

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MCN-2600T
1.2 CPU Sled Overview
1.2.1 CPU Sled Specifications
Core System
CPU Intel® Xeon® processor E5-2620 v3 (6C/12T)
Intel® Xeon® processor E5-2630 v3 (8C/16T)
Intel® Xeon® processor E5-2628L v3 (10C/20T)
Intel® Xeon® processor E5-2658 v3 (12C/24T)
Intel® Xeon® processor E5-2680 v3 (12C/24T)
Intel® Xeon® processor E5-2699 v3 (18C/36T)
Intel® Xeon® processor E5-2628L v4 (12C/24T)
Intel® Xeon® processor E5-2680 v4 (14C/28T)
L2 Cache 15MB/20MB/25MB/30MB/35MB/45MB dependent on CPU
Chipset Intel® C610 Chipset
Memory 12x DDR4-1600/1866/2133 DIMM socket, ECC, up to 192GB
BIOS AMI BIOS on SPI flash memory
Operating
Systems
Window 7 64bit, Linux Kernel 2.6 or above
I/O Interfaces
Ethernet 2x RJ-45 10/100/1000BASE-T Ethernet ports on front panel
2x 1G Ethernet ports to two switch boards via mid-plane
Console 1x RJ-45 serial port
USB 2x USB 3.0
Graphics 1x VGA socket onboard
Storage 2x 2.5’’ hot-swappable SATA drive bays & 2x M.2 SSD
Backplane 2x PCIe G3 x 8 to Switch nodes
Control Buttons and LEDs
Power 1x Power Button (front)
Reset 1x Reset Button (front)
LEDs Power, Status, Drive

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MCN-2600T
Mechanical
Form Factor 213.9mmx 40.44mm x 432.1mm (W x H x D)
Operating Temp. 0ÛC to +ÛC
Storage Temp. -40ÛC to +70ÛC
Humidity 10% to 80%, non-condensed
RoHS RoHS Compliant
1.2.2 CPU Sled Front Panel

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MCN-2600T
1.2.3 CPU Sled Layout
432 12.36
11.09
41.90
211.35
32.4
0
41.20

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MCN-2600T
1.2.4 DPDK Support
DPDK is a set of libraries and drivers for fast packet processing, and it can improve packet
processing performance by up to ten times. The MCN-2600T CPU sled is fully validated with
DPDK and can provide a high throughput for data plane packet processing.
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