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(n°

EBYTE

E22-900M30S

User

Manual

SX1262

868/915MHz

1W

SPI

LoRa

Module

Chengdu

Ebyte

Electronic

Technology

Co.,Ltd.

ene

Chengdu

Ebyte

Electronic

Technology

Co,

Ltd.

E22-900M30S

User

manual

Contents

Le

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2.2

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PATAIMIELET.

......eeveveeietite

seats

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teeters

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theses

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3.

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PIN

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eters

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TUPPER

6

4.1

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5

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8

5.1

Communication

range

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100

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8

5.2

Module

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€aSY

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5.3

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9

6.

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GUIAAIICE.

........c.c.viuiiiit

ities

teeter

beseech

eee

b

betes

steht

obese bees

eb

tates

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estab

et

sensei

9

6.1

Reflow

Soldering

TemMPEratUire.

............ciiiiiiiiiic

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9

6.2

RefloOW

SOIAEIING

CUTIVE

.......oiviiiciiie

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10

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11

REVISION

MISTOTY

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11

Copyright

©2012-2018,

Chengdu

Ebyte

Electronic

Technology

Co.Ltd.

1

ene

Chengdu

Ebyte

Electronic

Technology

Co,

Ltd.

E22-900M30S

User

manual

Disclaimer

EBYTE

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to

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document

and

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contained

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and

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described

herein

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in

whole

or

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to

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rights.

Reproduction,

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or

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of

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or

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strictly

prohibited.

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information

contained

herein

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provided

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of

the

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No

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or

implied,

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but not

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with

respect

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This

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For

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Copyright

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Ltd.

1

I

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E22-900M30S

User

manual

1.

Overview

1.1

Introduction

The

E22-900M30S

is

based

on

the

SX1262,

a

new

generation

of

LoRa™

RF

chip

manufactured

by

Semtech,

USA.

It is

an

ultra-small

and

self-developed

868MHz.

915MHz

SMD

LoRa™

wireless

module.

E

E22

soomzo0s

COM

Because

it

adopted

the

original

SX1262

as

main

core,

the

PA

and

-

LNA

is

built-in

also

based

on

the

previous

one,

which

makes

the

SN:

18062500001

@

maximum

transmission

power

to

1'W,

at

the

same

time,

the

receive

v

sensitivity

is

also

further

improved.

The

overall

communication

stability

is

greatly

improved

compared

to

the

products

without

power

amplifiers

and

low

noise

amplifiers.

The

anti-interference

performance

and

communication

distance

have

been

further

improved

compared

to

the

previous

generation

LoRa™

transceiver,

and

far

superior

to

the

current

FSK

and

GFSK

modulation

products.

This

products obtained

FCC, CE

and

RoHS

certification

already

so

users

do

not

need

to

worry

about

the

performance.

Adopted

industrial

grade

high

precision

32MHz

crystal,

the

product

can

cover

an

ultra-wide

frequency

range

of

850~930MHz

and

is

backward

compatible

with

SX1278

and

SX1276.

Since

the

module

is

a

RF

transceiver

module

only,

users

need

to

use

the

MCU

driver

or

use

a

dedicated

SPI

debug

tool.

1.2

Features

Communication

distance

tested

is

up

to

12km

;

Maximum

transmission

power

of

1W,

software

multi-level

adjustable

;

Support

the

global

license-free

ISM

868/915MHz

band

;

Support

air

date

rate

of

0.018-62.5kbps

in

the

LoRa™

mode

;

Support

300kpbs

in

the

FSK

mode;

Compatible

with

the

transceiver

of

SX1278/SX1276;

With

large

capacity,

FIFO

supports

256Byte

data

cache;

New

SF5

spreading

factor

to

support

dense

networks;

Support

2.5V~5.5V

power

supply,

more

than

5.0V

power

supply

can

guarantee

the

best

performance;

Industrial

grade

standard

design,

support

-40

~

85

°C

for

working

over

a

long

time

;

IPEX

and

stamp

hole

are

optional,

which

is

convenient

for

secondary

development

and

integration.

Copyright

©2012-2018,

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Ebyte

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Technology

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Ltd.

2

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E22-900M30S

User

manual

1.3

Application

Home

security

alarm

and

remote

keyless

entry

;

Smart

home

and

industrial

sensors

|

Wireless

alarm

security

system

;

Building

automation

solutions

;

Wireless

industrial-grade

remote

control

;

Health

care

products

;

Advanced

Meter

Reading

Architecture(AMI)

;

Automotive

industry

applications.

2.

Specification

and

parameter

2.1

Limit

parameter

Performance

Main

parameter

Remark

Min.

Max.

Voltage

over

5.5V

will

cause

permanent

Power

supply

(V)

0

5.5

damage

to

module

Chances

of

burn

is

slim

when

modules

Blocking

power

(dBm>

-

10

} }

are

used

in

short

distance

Operating

temperature

(°C)

-40

85

2.2

Operating parameter

.

Performance

Main

parameter

Remark

Min.

Typ.

Max.

Operating

voltage

(V)

2.5

5.0

5.5

It’s

recommended

to

use

5.0V

For

5V

TTL,

It

is

recommended

to

add

level

Communication

level

(V)

33

}

conversion

Operating

temperature

(°C)

-40

-

85

Industrial

design

Operating

frequency

(MHz)

850

868/915

930

Support

ISM

band

TX

current

(mA)

650

Instant

power

consumption

Power

}

RX

current

(mA>

14

consumption

Sleep

current

(pA)

3

Software

1s

shut

down

Max

Tx

power

(dBm)

29.5 30.0

31

Receiving

sensitivity

(dBm)

-149 -150

-151

Air

data

rate

1s

0.3kbps

0.6k

-

300k

Controlled

via

user's

programming

Air

data

rate

(bps)

0.018k

62.5k

Controlled

via

user's

programming

Copyright

©2012-2018,

Chengdu

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Technology

Co.Ltd.

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Ebyte

Electronic

Technology

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E22-900M30S

User

manual

Main parameter

Description

Remark

Test

condition

:

clear

and

open

area,

antenna

gain:

5dBi,

antenna

Distance

for

reference

12000m

height

2.5m.

air

data

rate:

0.3kbps

FIFO

256Byte

Maximum

length

of

single

transmission

Crystal

frequency

32MHz

Modulation

LoRa(recommended)

Package

SMD

Connector

2.54mm

Stamp

hole

Communication

interface

SPI

0-10Mbps

Size

38.5%

24*3.6

mm

Antenna

IPEX/TPEX

50

ohm

impedance

Copyright

©2012-2018,

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E22-900M30S

User

manual

3.

Size

and

pin

definition

240x0.1mm

3.87+0.1mm

|

2.61

12

1

[]

1"

12

u

2.54

13

10

[|

10 13

14

0

|

9

14

15

8

|

8

15

“150

16

7

|

7

16

17

5

|

s

17

£

18

5

1

5

18

=

19

4 4

1]

C—

+

B

in

ES

7.60

20

3

1

3

20[

C—

u

2.54

21

2

|

2

af

C—

22

1

|

1

nl

C(—

IPX

I

5.46

Top pad:

0.50

Bottom

pad:

=

0.80

J]

[1.50 080T"

J]

[150

Pad

quantity

:

22

Unit:

mm

No.

Name

Direction

Function

1

GND

Ground

wire,

connected

to

the

power

reference

ground

2

GND

Ground

wire,

connected

to

the

power

reference

ground

3

GND

Ground

wire,

connected

to

the

power

reference

ground

4

GND

Ground

wire,

connected

to

the

power

reference

ground

5

GND

Ground

wire,

connected

to

the

power

reference

ground

RF

switch

receiving

control

pin,

connected

to

external

microcontroller

10,

6

RXEN

Input

valid

in

high

level

RF

switch

transmitting

control

pin,

connected

to

external

microcontroller

IO

7

TXEN

Input

or

DIO2,

valid

in

high

level

8

DIO2

Input/Output

Configurable

universal

10

port

(see

SX1262

manual

for

details)

0

vee

Power

supply,

2.5~5.5V(t

is

recommended

to

add

external

ceramic

filter

capacitor)

10

VCC

Power

supply,

2.5~5.5V(t

is

recommended

to

add

external

ceramic

filter

Copyright

©2012-2018,

Chengdu

Ebyte

Electronic

Technology

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E22-900M30S

User

manual

capacitor)

11

GND

Ground

wire,

connected

to

the

power

reference

ground

12

GND

Ground

wire,

connected

to

the

power

reference

ground

13

DIOL

Input/Output

Configurable

universal

10

port

(see

SX1262

manual

for

details)

14

BUSY

Output

For

status

indication

(see

SX1262

manual

for

details)

15

NRST

Input

Chip

reset

trigger

input

pin,

valid

in

low

level

16

MISO

Output

SPI

data

output

pin

17

MOSI

Input

SPI

data

output

pin

18

SCK

Input

SPI

data

output

pin

19

NSS

Input

Module

chip

select

pin

for

starting

an

SPI

communication

20

GND

Ground

wire,

connected

to

the

power

reference

ground

21

ANT

Antenna

interface,

stamp

hole

(50

ohm

characteristic

impedance)

22

GND

Ground

wire,

connected

to

the

power

reference

ground

4.

Basic

Operation

4.1

Hardware

Design

Copyright

©2012-2018,

Chengdu

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Technology

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Chengdu

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E22-900M30S

User

manual

VCC

TT

—_—

=

|

8

—

|

vee

a

EUNO——

bl

al

I

ed

od

fee

fe]

tf

fc

fz

EINO———

(@)

000

MSO

O——mMmM—

og

a

Qk

=

x=

0

|

52623828835

sck

o—

NSS

[©

102

O&O

0s

p————

00000888830

sop—

60066

REESS

MCU

—

ha

I

cd

ed

fd

find

eo]

BC

f= fu

GND

|

8

[+

VCC

SN

Brief

Connection

between

Module

and

Single

Chip

Microcomputer

1

The

I00. 101. 102,

103

in

MCU

means

the

10

port

of

MCU.

DIOI1.

DIO2

is

the

normal

IO

port,

which

can

be

configured

to

multiple

function.

The

DIO2

can

2

connect

with

TXEN,

but

not

with

the

IO

port

of

MCU.

It’s

used

to

control

RF

switch,

see

more

details

in

SX1262

datasheet.

Also

It

can

be

floated

when

not

in

use.

3

The

DIO3

is

powered

by

a

32MHz

TCXO

crystal.

4

Ensure

the

good

grounding,

large

area

of

paving,

small

the

power

supply

ripple,

the

filter

capacitor

should

be

increased

and

as

close

as

possible

to

the

VCC

and

GND

pins

of

module.

5

It is

recommended

to

add

200R

protection

resistor

to

RXD/TXD

of

external

MCU.

Note:

It

is

recommended

to

use

DC

stabilized

power

supply

to

supply

power

to

the

module.

The

power

supply

ripple

coefficient

is

as

small

as

possible,

and

the

module

needs

to

be

reliably

grounded.

Please

pay

attention

to

the

correct

connection

of

the

positive

and

negative

poles

of

the

power

supply.

If

the

reverse

connection

is

connected,

the

module

may

be

permanently damaged.

Please

check

the

power

supply

to

ensure

that

between

the

recommended

supply

voltage,

if

exceeding

the

maximum,

the

module

will

be

permanently

damaged.

Please

check

the

stability

of

the

power

supply,

the

voltage

can

not

be

significantly

frequent.

When

designing

the

power

supply

circuit

for

the

module,

it

is

often

recommended

to

reserve

more

than

30%

of

the

margin,

and

the

whole

machine

is

beneficial

for

long-term

stable

operation.

The

module

should

be

as

far

away

as

possible

from

the

power

supply,

transformers,

high-frequency

wiring

and

other

parts

with

large

electromagnetic

interference.

High-frequency

digital

traces,

high-frequency

analog

traces,

and

power

traces

must

be

avoided

under

the

module.

If

it

is

necessary

to

pass

through

the

module,

assume

that

the

module

is

soldered

to

the

Top

Layer,

and

the

copper

is

spread

on

the

Top

Layer

of

the

module

contact

part(All

copper-covered

and

well

grounded),

and

must

be

close

to

Copyright

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E22-900M30S

User

manual

the

digital

part

of

the

module

and

routed

in

the

Bottom

Layer.

Assuming

the

module

is

soldered

or

placed

in

the

Top

Layer,

it

is

also

wrong

to

randomly

route

the

Bottom

Layer

or

other

layers,

which

will

affect

the

module's

spurs

and

receiving

sensitivity

to

varying

degrees.

Assume

that

there

are

traces

with

large

electromagnetic

interference

around

the

module

(high-frequency

digital,

high-frequency

analog,

power

trace),

which

will

greatly

affect

the

performance

of

the

module.

It

is

recommended

to

stay

away

from

the

module

according

to

the

strength

of

the

interference.

If

necessary,

appropriate

isolation

and

shielding

can

be

done;

If

the

communication

line

uses

a

5V

level,

a

1k-5.1k

resistor

must

be

connected

in

series

(not

recommended,

there

is

still

a

risk

of

damage).

Try

to

stay

away

from

some

physical

layers

and

also

have

a

2.4GHz

TTL

protocol,

for

example:

USB3.0

The

antenna

mounting

structure

has

a

great

influence

on

the

performance

of

the

module.

It

is

necessary

to

ensure

that

the

antenna

is

exposed,

preferably

vertically

upward.

When

the

module

is

mounted

inside

the

case,

use

a

good

antenna

extension

cable

to

extend

the

antenna

to

the

outside

of

the

case.

The

antenna

must

not

be

installed

inside

the

metal

case,

which

will

greatly

reduce

the

transmission

distance.

Itis

recommended

to

add

a

200R

protection

resistor

to

the

RXD/TXD

of

the

external

MCU.

4.2

Software

Programming

S.

This

module

1s

SX1268/SX1262+PA+LNA.

Its

driving

mode

is

exactly

the

same

as

SX1268/SX1262.

Users

can

operate

according

to

SX1268/SX1262

chip

datasheet.

DIO1

and

DIO2

are

general-purpose

IO

ports,

which

can

be

configured

into

multiple

functions.

DIO2

can

be

connected

to

TXEN

and

not

connected

to

the

MCU's

10

port.

It

can

be

used

to

control

the

RF

switch

transmission.

If

not

used,

you

can

hang

it.

For

details,

see the

SX1262

manual.

DIO

3 is

used

to

supply

32

MHz

TCXO

crystal

oscillator.

FAQ

5.1

Communication

range

is

too

short

The

communication

distance

will

be

affected

when

obstacle

exists.

Data

lose

rate

will

be

affected

by

temperature,

humidity

and

co-channel

interference.

The

ground

will

absorb

and

reflect

wireless

radio

wave,

so

the

performance

will

be

poor

when

testing

near

ground.

Sea

water

has

great

ability

in

absorbing

wireless

radio

wave,

so

performance

will

be

poor

when

testing

near

the

sea.

The

signal

will

be

affected

when

the

antenna

is

near

metal

object

or

put

in

a

metal

case.

Power

register

was

set

incorrectly,

air

data

rate

is

set

as

too

high

(the

higher

the

air

data

rate,

the

shorter

the

distance).

When

the

power

supply

at

room

temperature

is

lower

than

the

recommended

low

voltage,

the

lower

the

voltage

is,

the

lower

the

transmitting

power

is.

Due

to

antenna

quality

or

poor

matching

between

antenna

and

module.

5.2

Module

is

easy

to

damage

Please

check

the

power

supply

and

ensure

it

is

within

the

recommended

range.

Voltage

higher

than

the

peak

will

lead

to

a

permanent

damage

to

the

module.

Please

check

the

stability

of

power

supply

and

ensure

the

voltage

not

to

fluctuate

too

much.

Copyright

©2012-2018,

Chengdu

Ebyte

Electronic

Technology

Co.

Ltd.

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