Fuji Electric P642 Series Guida utente

MT6M16534

Mounting Instruction

Small IPM (Intelligent Power Module)

P642 Series

6MBP**XT*060-50

July 2022

This Instruction contains the product specifications, characteristics, data, materials, and structures as of

July 2022. The contents are subject to change without notice for specification changes or other reason.

When using a product listed in this Instruction be sure to obtain the latest specifications.

The application examples in this note show the typical examples of using Fuji products and this note

shall neither assure to enforce the industrial property including some other rights nor grant the license.

Although Fuji Electric Co., Ltd. continually strives to enhance product quality and reliability, a small

percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor

products in your equipment, be sure to take adequate safety measures such as redundant, flame-

retardant and fail-safe design in order to prevent a semiconductor product failure from leading to a

physical injury, property damage or other problems.

The product introduced in this Application note is intended for use in the following electronic and

electrical equipment which requires ordinary reliability:

・Inverter for Compressor motor or fan motor for Room Air Conditioner

・Inverter for Compressor motor for heat pump applications.

If you need to use a semiconductor product in this application note for equipment requiring higher

reliability than normal, such as listed below, be sure to contact Fuji Electric Co., Ltd.to obtain prior

approval. When using these products, take adequate safety measures such as a backup system to

prevent the equipment from malfunctioning when a Fuji Electric’s product incorporated in the equipment

becomes faulty.

・Transportation equipment (mounted on vehicles and ships)

・Trunk communications equipment

・Traffic-signal control equipment

・Gas leakage detectors with an auto-shutoff function

・Disaster prevention / security equipment

・Safety devices, etc.

Do not use a product in this application note for equipment requiring extremely high reliability

such as:

・Space equipment ・Airborne equipment ・Atomic control equipment

・Submarine repeater equipment ・Medical equipment

Fuji Electric Co., Ltd.

If you have any question about any portion of this application note, ask Fuji Electric Co., Ltd.or its sales

agencies. Neither Fuji Electric Co., Ltd.nor its agencies shall be liable for any injury or damage caused

by any use of the products not in accordance with instructions set forth herein.

Cautions

Chapter 1 Precautions during transportation and storage 1-1

Chapter 2 Precautions in unpacking 2-1

Removing the pin from the tube

-1

Picking out the Small IPM from the stick

-3

Chapter 3 Through hole design for PCB 3-1

Chapter 4 Spacer 4-1

Chapter 5 Application of thermal grease 5-1

Chapter 6 Heat sink selection 6-1

Selection

-1

Shape

-2

Mounting

(tightening) 6

-2

Chapter 7 Soldering to Printed Circuit Board 7-1

Chapter 8 Appendix 8-1

Stencil mask drawing for thermal grease application (recommended)

-1

Isolation distance of heat sink

-2

CONTENTS

•The product should be stored at a normal temperature of 5to 35oCand relative humidity of 45 to

75%, otherwise the product might be corroded or destructed, or its lifetime. If the storage area is

very dry, a humidifier may be required. In such a case, use only deionized water or boiled water,

since the chlorine in tap water may corrode the leads.

•In case of storage environment with rapid temperature changes, condensation will be occurred on

the surface of the product. In order to avoid the condensation, the product shall be stored in steady

temperature environment if possible.

•Should not be stored or used in an environment where it is exposed to acids, organic substances, or

corrosive gas (hydrogen sulfide, sulfurous acid gas etc.) or in a dusty place.

•When stored, it is necessary to prevent external pressure to the product. Stacking that may deform

the outer box shall be avoided even when it is packed in the outer box.

•Transport the cardboard box with the appropriate side facing up. This is to prevent unexpected

stress being applied to the product, which may cause bending of the terminals or distortion in the

resin package of the product. Throwing or dropping the product can cause severe damage to the

product. Also, it is necessary to pay attention to rain and freezing to avoid wetting, as it may cause

damage or destruction. The environmental conditions such as temperature and humidity during

transportation described in the specifications shall be strictly observed.

•The product should be stored with the lead terminals remaining unprocessed. It is necessary to

avoid rusting etc.due to scratches during processing, resulting in poor soldering.

•The containers and bags for storing the product should be non-static or conductive.

•Under the above storage condition, use the product within one year.

1. Precautions during transportation and storage

This chapter describes the precautions during transportation and storage for the product.

1-1

•The products are packaged in tubes that are pinned at both ends.

•Remove the pin on one side to pick out the product from the tube.

•If the pin and the product are in contact with each other when removing the pin, a strong impact

might be applied to the product, which may cause deformation or damage to the product terminals.

Make a gap between the pin and the product when removing the pin.

•The recoil of removing the pins may cause deformation or damage to the terminals of the product,

so remove the pins with holding them.

•If the product falls out from the tube when removing the pins, it may cause a strong impact to the

product, causing the product terminals to be deformed or damaged. Remove the pin with the tube

opening facing up.

•It is recommended to use a remover (removal jig) to remove the pins. The following shows how to

remove the pins using the remover.

•Pin removing method using remover (removal jig).

1. Make a gap between the pin and the product. (See Fig. 2-1)

2. Precautions in unpacking

This chapter describes the precautions in unpacking for the product.

2-1

1Removing the pin from the tube

2. Push the pointed end of the pin with your index finger, and make a gap between the pin and the

tube to insert the remover removal part as shown in Fig. 2-2. (See Fig. 2-3)

Fig. 2-2 Example of remover (removal jig) Fig. 2-3 Gap between the pin and the tube

Fig. 2-1 Gap between the pin and the product

GAP

Removal part

Gap

3. Insert the removal part of the remover into the gap between the pin and the tube. (See Fig. 2-4)

2Removing the product from the tube

•Since the elements installed in the Small IPM are extremely weak to electrostatic discharge,

appropriate ESD countermeasures are necessary in the assembly environment within the range

described in the specifications. In particular, when removing it out from the tube, it is most likely to

cause electrical damage to the product.

•When removing the product, do not strongly collide the products with each other or touch the

product terminals to the tube. A strong impact on the product may cause deforming or damage to

the product terminals.

4. Hold the pin with your finger and remove the pin with the tube opening facing up.

(See Fig. 2-5, 2-6)

Fig. 2-5 How to hold the pin Fig. 2-6 Tube opening orientation

Fig. 2-4 Insert remover

Insert the remover to reach to the

opposite side of the pin head

3. Through hole design for PCB

This chapter describes the through hole design for PCB attaching to the product.

3-1

Figures 3-1 to 3-3 show examples of recommended through hole dimensions and through hole layout

designs.

•The through hole dimensions are the inner diameter after plating (dimension unit: mm).

•If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be

impaired. Also, if the land diameter is too large, solder bridges are likely to occur.

•The hole size and land size should be optimized as appropriate, taking into consideration the printed

circuit board processing accuracy and mounting method.

Fig. 3-1 Control side through hole dimensions Fig. 3-2 Power side through hole dimensions

Fig. 3-3 Through hole layout

Through hole

Land Through hole

Land

•When using spacer between the PCB and the product for alignment during soldering to printed

circuit board, it is recommended to support the product at the hatched area as shown in Fig. 4-1.

•Select a spacer material that does not cause contamination or corrosion.

4. Spacer

This chapter describes the spacer for PCB attaching to the product.

4-1

Fig. 4-1 Spacer installation position

5. Application of thermal grease

This chapter describes the thermal grease application for the product.

5-1

•It is recommended to apply thermal grease between the product’s aluminum base and the heat sink

to ensure heat dissipation to the heat sink. If the properties, amount, and application method of the

thermal grease is not appropriate, it may result in poor heat dissipation and lead to thermal failure.

Table 5-1 shows the recommended thermal grease properties and thickness

•Assuming that the thickness is uniform, the required amount (weight) of thermal grease can be

calculated from the following formula.

•We recommend using the stencil mask method to control the appropriate thermal grease thickness

(Fig. 5-1). The recommended stencil mask pattern is shown in appendix.

•It is recommended to check the spread of thermal grease by removing the product after mounting

and check the extent of spreading.

•In the case of liquid cooling, the temperature difference (temperature gradient) between the heat

sink temperature and the temperature inside the product becomes large. When mounting the

product to heat sink, secure a thermal grease coating amount that can absorb the distortion due to

the difference in thermal expansion when the temperature gradient is large.

•In the case of a multiple structure heat sink, the number of fastening parts increases and heat

transfer (diffusion) becomes uneven. Therefore, it is necessary to suppress the distortion, such as

securing the thermal grease coating amount in consideration of the generated distortion during

design.

Table 5-1. Recommended properties of thermal grease

Fig. 5-1 Thermal grease application

Squeegee

（for applying

thermal grease）

Thermal grease

(apply to product’s

aluminum base)

Stencil mask

fixing tool

Unit Recommended value

Penetration (typ.) -328

Thermal conductivity W/m・K0.90

Thermal grease thickness μm 100±30

Thermal grease

thickness (μm)

Thermal grease

weight (g)x 104Aluminum base area

of product (cm2)

=Density of thermal

grease (g/cm3)

x x

6. Heat sink selection

This chapter describes the heat sink selection for the product.

6-1

•The junction temperature Tvj should not exceed the maximum junction temperature rating for safe

operation. Heat sink (cooling device) should be designed to ensures that Tvj is always below the

maximum junction temperature rating.

•If the IGBT or FWD junction temperature is higher than the maximum junction temperature rating, it

might cause damage to the chips. Some types of the products have the over heating (OH)

protection function which works when the LVIC chip temperature exceeds the maximum junction

temperature rating. However, if the temperature rises too quickly, the OH protection might not work.

•When selecting a heat sink, please verify the chip temperature Tvj by measuring Tcat the position

shown in Figure 6-1, and calculating the Tvj from device power dissipation and thermal resistance.

In addition, this product has a built-in temperature sensor, and Tvj can be confirmed by the analog

voltage that is output according to the LVIC chip temperature. Please refer to it when selecting the

heat sink.

•For more detail design, please refer to “IGBT Module Application Manual (REH984e)” and “Small

IPM Application Manual (MT6M15234b)”.

1Selection

Fig. 6-1 Temperature sensing and Tcmeasurement points

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