Fujitsu PRIMERGY CX25 0 M4 Series Istruzioni per l'installazione

Disassembly and Recycling Instructions - English

FUJITSU Server PRIMERGY

CX400 M4 Server Enclosure

CX25x0 M4/M5 Server Nodes

Disassembly and Recycling Instructions

December 2019

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CX400 M4 Disassembly and Recycling Instructions

Version history

Issue number Reason for update

1.0 / December 2019 Initial release

Disassembly and Recycling Instructions CX400 M4

CX400 M4 Disassembly and Recycling Instructions

Contents

1 Disassembly and recycling . . . . . . . . . . . . . . . . . . . 7

1.1 Recycling information . . . . . . . . . . . . . . . . . . . . . . 7

1.2 Disassembly of the server enclosure . . . . . . . . . . . . . . 9

1.2.1 Removing server nodes from the server enclosure . . . . . . . . 9

1.2.2 Removing the ID card and server cover . . . . . . . . . . . . . 12

1.2.3 Removing the hot-plug PSU . . . . . . . . . . . . . . . . . . . 16

1.2.4 Removing fan modules . . . . . . . . . . . . . . . . . . . . . 17

1.2.5 Removing the fan cage . . . . . . . . . . . . . . . . . . . . . 19

1.2.6 Removing the midplane kit . . . . . . . . . . . . . . . . . . . 20

1.2.7 Removing 2.5-inch HDD/SSD modules . . . . . . . . . . . . . 22

1.2.8 Removing 2.5-inch HDD backplanes . . . . . . . . . . . . . . 24

1.2.9 Removing the HDD/SSD bridge board . . . . . . . . . . . . . 25

1.2.10 Removing front bezels . . . . . . . . . . . . . . . . . . . . . . 26

1.2.11 Removing the front panel modules . . . . . . . . . . . . . . . 28

1.3 Disassembly of the server nodes . . . . . . . . . . . . . . . 30

1.3.1 Removing the SXM2 extension tray, SXM2 modules and LC kit 30

1.3.2 Removing the GPGPU extension tray and GPGPUs . . . . . . 42

1.3.3 Removing riser modules and expansion cards . . . . . . . . . 49

1.3.4 Removing an FBU . . . . . . . . . . . . . . . . . . . . . . . . 54

1.3.5 Removing an OCP mezzanine card . . . . . . . . . . . . . . . 56

1.3.6 Removing main memory modules . . . . . . . . . . . . . . . . 57

1.3.7 Removing the heat sink and CPU (Air cooling) . . . . . . . . . 59

1.3.8 Removing the heat sink and CPU (LC) . . . . . . . . . . . . . 61

1.3.9 Removing the iRMC microSD card . . . . . . . . . . . . . . . 69

1.3.10 Removing M.2 SSDs . . . . . . . . . . . . . . . . . . . . . . 69

1.3.11 Removing the Dual microSD 64GB Enterprise . . . . . . . . . 70

1.3.12 Removing the TPM and system board . . . . . . . . . . . . . 72

1.3.13 Removing the battery . . . . . . . . . . . . . . . . . . . . . . 76

Disassembly and Recycling Instructions CX400 M4

Contents

CX400 M4 Disassembly and Recycling Instructions 7

1 Disassembly and recycling

1.1 Recycling information

This manual provides instructions to disassembly the PRIMERGY CX400 M4

Server Enclosure and the PRIMERGY CX25x0 M4/M5 Server Nodes. All

materials can be disposed according to the regulation in the EU Directive

2012/19 / EU (Waste Electrical and Electronic Equipment (WEEE)).

Product group: Server

Model:

PRIMERGY CX400 M4 Server Enclosure and CX25x0 M4/M5 Server Nodes

Materials that must be disposed of separately

Description Part Number

Circuit boards

With a surface larger than 10 cm2

System board (on server node)

Midplane

Chassis interface board

HDD/SSD bridge board

Expansion cards (on server

node)

Power supply unit

1 - 4

several

1-2

Batteries Lithium battery CR2450 (on

server node)

1-4

Mercury-containing components

Liquid crystal displays (optionally

together with the housing) with a surface

of more than 100 cm2 and backlit displays

with gas discharge lamps

Cathode ray tubes

PCB-containing capacitors

(PCB: polychlorinated biphenyls)

Electrolytic capacitors containing

substances of concern (height> 25 mm,

diameter:> 25 mm or proportionally

similar volume)

Power supply unit

External cables

Gas discharge lamps

8 Disassembly and Recycling Instructions CX400 M4

Disassembly and recycling

Plastics containing brominated flame

retardants

Toner cartridges, liquid and pasty, and

color toner

Not included

Asbestos waste and components

containing asbestos

Components containing refractory

ceramic fibers

Components containing radioactive

substances

Components containing

Chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC),

hydrofluorocarbons (HFC) or

hydrocarbons (HC)

Materials that must be disposed of separately

Description Part Number

CX400 M4 Disassembly and Recycling Instructions 9

Disassembly and recycling

1.2 Disassembly of the server enclosure

INot all components are installed in the server enclosure depending on

the configuration.

1.2.1 Removing server nodes from the server enclosure

IFor recycling parts of the server nodes, see section "Disassembly of the

server nodes" on page 30.

Removing the CX2550 M4/M5 or CX2560 M4/M5 server node

ÊRemove all external cables from the server enclosure and server nodes.

Tools: tool-less

Recycling parts

1x - 4x server nodes

External cables

ÊOnly necessary for CX2550 M4 and

CX2560 M4 server nodes: remove the

gasket of the lower server node.

ÊUndo the locking mechanism (1) of

the release lever and pull the server

node out of the bay (2).

10 Disassembly and Recycling Instructions CX400 M4

Disassembly and recycling

Figure 1: Removing the CX2550 M4/M5 or CX2560 M4/M5 server node

VCAUTION

If the server node is difficult to pull out of the bay, push the server node

(1), and then pull the server node (4) while pushing the server node to

the left side (2, 3).

Removing the CX2570 M4/M5 server node

ÊRemove all external cables from the server enclosure and server nodes.

Figure 2: Removing the CX2570 M4/M5 server node (A)

ÊUndo the locking mechanism (1) of the release lever and pull the server

node out of the bay (2).

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