Hewlett Packard Enterprise ProLiant DL20 Gen10 Plus Istruzioni per l'installazione

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE ProLiant DL20 Gen10 Plus

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Depending on Power Supply Model

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T-15/ T-10

Screw Driver Cross Type

Cross/Flat

Sharp Nose Pliers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. System Board Battery - Remove the side panel and remove the battery from the system board.

2. Capacitors in 350W power supply => Remove the power supply from the system. With a screw driver remove the

screws securing the top cover and loosen the screws securing the PCA. Then use Sharp Nose Pliers to remove the

daughter card, and electrolyte-capacitor.

3. Capacitors in 500W/800W PSU => Push latch and remove PSU from the system. With a screw driver remove the

screws securing the cover and take the PCA out. Then use Sharp Nose Pliers to remove the daughter card, and

electrolyte-capacitor. Then use Sharp Nose Pliers to remove the daughter card, and electrolyte-capacitor.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment 1 –System exploding drawing

1. NHP config

2. LFF HP

3. SFF HP

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachement2 - Remove Latch Ears and Front Panel

1. Remove latch ears from chassis by using T-15 screwdriver.

2. Use T-15 screwdriver to remove front panel from chassis

Following screw is for hot plug HDD cage (2LFF / 4SFF) only

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachement3- Remove System Fans and PCIE Fan

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachement4- Remove CPU Heatsink and CPU

1. Remove CPU Heatsink by using T15 screwdriver.

2. Remove CPU

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachement5- Remove DIMM Guard

1. Remove DIMM guard by using T-15 screwdriver.

Attachment6- Remove RTC battery

1. To remove RTC battery by pushing the latch as drawing below.

MF877-00 Page 9

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment7- Remove MB

1. Use T-15 screwdriver to remove screws to release MB from chassis

MF877-00 Page 10

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Attachment8- Remove PCIE Riser Cage and PCIE adaptor

1. Pull up the PCIE cage/Riser from MB

2. Remove PCIE cards

3. Use T-15 screwdriver to release 2 screws to remove PCIE Riser from PCIE cage

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