HP BladeSystem bc2200 - Blade PC Istruzioni per il montaggio

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

Name / Model #1 HP BladeSystem bc2200 Blade PC

Name / Model #2 HP bc2200 Blade PC

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm 1

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

screwdriver T15

screwdriver 451N

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Blade Card(BC)

1) Remove the Blade cards:

a) Press the Blade card handle down. (see Figure 1 as below)

b) Catch the handle and pull out the blade card(see Figure 2 as below)

2) Disassembly the Blade card

a) Remove the screws on Heat sink and pick up the heat sink from the blade card (see Figure 3&4 as below)

b) Push the clip back to the horizontal direction that holds the battery in place, and then remove the battery from the

blade card (see Figure 5 as below)

c) Remove the CPU from the blade card (see Figure 6&7 as below)

d) Pull the metal handle of the RAM slot to two side,and then take up the RAM from the blade card

(seeFigure8&9 as below)

e) Remove the HDD from the BC(see Figure 10&11 as below)

f) Remove the power light(see Figure 12 as below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1 Press the Blade card handle down Figure 2 pull out the blade card

Figure 3 Remove the screws of the heat sink Figure 4 Remove the heat sink from the BC

Figure 5 Remove the battery Figure 6 Remove the CPU

Figure 7 Take up the CPU from the BC Figure 8 Pull the metal to two side

Figure 9 Take up the RAM Figure 10 Remove the screws that holding the HDD

Figure 11 Pull out the HDD Figure 12 Remove the screw hold the power light

Indice

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