HP Neoware m100 Istruzioni utente

QuickSpecs

HP Neoware m100 Mobile Thin Client

Overview

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 1

HP Neoware m100 Mobile Thin Client

Front

Top cover latch

LCD panel

Keyboard

Status indicators - power, battery

Stereo speakers

Touchpad

Quick launch buttons

Back

Cable lock slot

USB connectors (three)

RJ-45 10/100 Ethernet connector

Modem connector

Vents

VGA monitor connector

AC power connector

USB connectors (two)

Audio out (headset)

10.

Audio in (microphone)

11.

Wireless LAN activity indicator

12.

PC Card slot (option)

At A Glance

Mobile thin client

Wireless* connectivity with built-in 802.11 b/g and PC Card slot for optional 3G broadband support

VPN-Ready for highly secure network access

No local storage helps prevent critical data from being lost or stolen

No moving parts increases reliability

Low power design extends battery life

*Wireless access point and Internet service required and is not included.

QuickSpecs

HP Neoware m100 Mobile Thin Client

Standard Features - Models

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 2

HP P/Ns

KH150AA to KH163AA

KH187AA to KH190AA

Neoware P/Ns

DB-A3-xx-xxx

DB-C3-xx-xxx

** Suffix varies based

on Keyboard and Power

Supply

-AHO (US)

-KHO (AUSTRALIAN)

-BKO (UK)

-DGO (GERMAN)

-DHO (US KB/EU PWR)

-DJO (FRENCH)

-DMO (SWEDISH)

Model

HP Neoware m100

Processor

VIA Eden 800 MHz

Flash

128 MB Image –1 GB

System Memory

256 MB –512 MB

Operating System

Windows XPe

Windows XPe VDI Edition

Keyboard

Integrated

Mouse

Integrated Touchpad

QuickSpecs

HP Neoware m100 Mobile Thin Client

Options

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 3

Part Number

Accessories

Extended Life Battery

KL155AA

Memory

512 MB DDR2 RAM Upgrade

KE678AA

1 GB DDR2 RAM Upgrade

KE679AA

Docking Station

Compatible with Targus Universal Docking Station

Targus

ACP50US

Security

HP/Kensington Cable Lock

PC766A

QuickSpecs

HP Neoware m100 Mobile Thin Client

Technical Specifications

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 4

Processor

VIA Eden 800 MHz

Chipsets

VN800 Chipset

Memory

Flash

128 MB Image –1 GB

System Memory

1256 MB –512 MB

Graphics

15" TFT XGA panel, 1024 x 768 resolution

Mode

Refresh rates

Color depth

8-bit

85 Hz

1600x1200

16-bit

85 Hz

1600x1200

32-bit

85 Hz

1280x1024

32 bit

60 Hz

1600x1200

Input/Output/

Peripheral Support

Keyboard

Integrated –US Int'l, UK, French, German, Swedish

Mouse

Integrated touchpad

Printer

Video

VGA display

Audio

Output

Audio Out / Mic In (left): Internal 2 Stereo Speakers

Security (hardware)

Slot for Kensington Cable Lock

ActivIdentity USB Smart Card Reader, vendor models GBURR200 & GBUR300P025

GemAlto Smart Cards (Windows XPe models only)

BioPassword (Special XPe Snap-in)

Server-based

Computing

Protocols

ICA

RDP

HP Neoware TeemTalk Terminal Emulator

Networking

Modem –56K Data/Fax (v.92)

LAN –Ethernet 10/100M, Wake on LAN, PXE

Wireless LAN –Integrated 802.11 b/g

I/O ports and

connectors

5 –(2 left, 3 rear) USB Ports-2.0

Audio Jacks: Audio Out / Mic In (left)

2 –Internal Stereo Speakers

1–(rear) Modem RJ11 Port

1 –(rear) LAN RJ45 Port

1 –(rear) VGA Port-15-pin D-Sub

1 –PC Card Type II slot

Resident Operating

System

Windows XPe (Also available in the VDI Edition)

Server OS

Compatibility /

Support

Citrix Presentation Server 4.0 including the Desktop Broker feature

Citrix Metaframe Presentation Server 3.0

Citrix Metaframe XP Presentation Server

Citrix Metaframe 1.x

Windows 2000/2003 Server Terminal Services

Windows 2000 Advance Server Terminal Services

Windows NT 4.0 Terminal Server Edition

QuickSpecs

HP Neoware m100 Mobile Thin Client

Technical Specifications

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 5

VMware Virtual Desktop Infrastructure using RDP

Linux Terminal Server Project (LTSP) *

Most mainframes and midrange servers **

* Requires bios change to PXE boot

** Requires TeemTalk (standard on most HP Neoware thin clients)

Local software

overview

Citrix ICA

RDP

Full-function Internet Explorer

TeemTalk Emulation –30+

X Windows (X11R6 / XDM) –from server

Acrobat Reader

Windows Media Player

Java Virtual Machine

RealPlayer –snap-in (add-on)

Shockwave –from server

Macromedia Flash

ELO touchscreen support

.NET Framework

Management

ezRemote Manager and ezUpdate

HP Device Manager –snap-in (add-on)

Altiris –snap-in (add-on)

Security

Read-only file system

Locked down user account and configuration

HP Neoware Write Filter, Firewall, Security

Center

VDI Support

Leostream

VDM (Propero)

Provision Networks

Citrix DDI support

Languages

English, MUI for: French, German, Italian, Spanish, Danish, Greek

Dimensions

(approximate)

318 mm (W) x 277 mm (D) x 22~36.7 mm (H)

Weight (approximate)

5.5 lbs. (2.5 kg)

Environmental

Temperature range

Operating: 41° to 95° F (5° to 35° C)

Humidity

20% to 80% non-condensing

Power*

Consumption: 60W

Supply: (8-cell Li-Ion (4800 mAh)

* The actual power consumption at your location could vary and is dependent on many factors

including but not limited to software load on the thin client, attached peripherals, and

environmental factors.

Regulatory

Compliance

Product safety

UL60950-1, CSA22.2/60950-00, IEC 60950-1:2001, AS/NZS

60950

Ergonomics

RF Interference

FCC Part 15C, I.C.: RS210, EN 300 328, FCC15.247, C-Tick: EN

300 328

Warranty

Hardware: 3 year limited warranty on base unit; 1 year battery

Software: 12 months

NOTE: Certain restrictions apply. Consult the HP Customer Support Center for details.

QuickSpecs

HP Neoware m100 Mobile Thin Client

Technical Specifications

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 6

Environment-

friendly Products

and Approach

RoHS Compliance

Hewlett-Packard is committed to compliance with all applicable

environmental laws and regulations, including the European Union

Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to

exceed compliance obligations by meeting the requirements of the RoHS

Directive on a worldwide basis. From July 1, 2006, RoHS substances will be

virtually eliminated (virtually = to levels below legal limits) for all HP

electronic products subject to the RoHS Directive, except where it is widely

recognized that there is no technically feasible alternative (as indicated by

an exemption under the EU RoHS Directive).

Material Usage

This product does not contain any of the following substances in excess of

regulatory limits (refer to the HP General Specification for the

Environment at:

http://www.hp.com/hpinfo/globalcitizenship/environment/

supplychain/gen_specifications.html):

Asbestos

Certain Azo Colorants

Certain Brominated Flame Retardants –may not be used as flame

retardants in plastics

Cadmium

Chlorinated Hydrocarbons

Chlorinated Paraffins

Formaldehyde

Halogenated Diphenyl Methanes

Lead carbonates and sulfates

Lead and Lead compounds

Mercuric Oxide Batteries

Nickel –finishes must not be used on the external surface designed

to be frequently handled or carried by the user.

Ozone Depleting Substances

Polybrominated Biphenyls (PBBs)

Polybrominated Biphenyl Ethers (PBBEs)

Polybrominated Biphenyl Oxides (PBBOs)

Polychlorinated Biphenyl (PCB)

Polychlorinated Terphenyls (PCT)

Polyvinyl Chloride (PVC) –except for wires and cables, and certain

retail packaging has been voluntarily removed from most

applications.

Radioactive Substances

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product

packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury

and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging

materials.

QuickSpecs

HP Neoware m100 Mobile Thin Client

Technical Specifications

DA –12885 Worldwide —Version 2 —December 21, 2007

Page 7

Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in

packaging materials.

Use readily recyclable packaging materials such as paper and

corrugated materials.

Reduce size and weight of packages to improve transportation fuel

efficiency.

Plastic packaging materials are marked according to ISO 11469

and DIN 6120 standards.

End-of-life

Management and

Recycling

Hewlett-Packard offers end-of-life HP product return and recycling programs

in many geographic areas. To recycle your product, please go to:

http://www.hp.com/recycle or contact your nearest HP sales office.

Products returned to HP will be recycled, recovered or disposed of in a

responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities.

This information (product disassembly instructions) is posted on the Hewlett

Packard web site at: http://www.hp.com/go/recyclers. These instructions

may be used by recyclers and other WEEE treatment facilities as well as HP

OEM customers who integrate and re-sell HP equipment.

Hewlett-Packard

Corporate

Environmental

Information

For more information about HP's commitment to the environment:

[link to new HP white paper now in progress]

Global Citizenship Report

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications

http://www.hp.com/hpinfo/globalcitizenship/environment/

productdesign/ecolabels.html

ISO 14001 certificates:

http://www.hp.com/hpinfo/globalcitizenship/environment/

operations/envmanagement.html

Microsoft, Windows, and Windows NT are trademarks and/or registered trademarks of Microsoft Corporation in the

United States and other countries.

The information contained herein is subject to change without notice and is provided "as is" without warranty of any kind.

The warranties for HP products and services are set forth in the express limited warranty statements accompanying such

products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for

technical or editorial errors or omissions contained herein.

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