HP ProLiant DL320G5p/X3075 Istruzioni per l'installazione
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP ProLiant DL320G5p / X3075 1GB
HP ProLiant DL320G5p / X3075 1GB
HP ProLiant DL320G5p / X3075 1GB
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision A
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm
5
Batteries All types including standard alkaline and lithium coin
or button style batteries 2
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas
discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height In Power Supply 8
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Torx Driver T-15
Flat Head Screw Driver Medium
Philips Driver # 2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the system board. With a medium flat head
screw driver remove the battery and dispose of properly.
2. BBWC Battery - Locate the BBWC inside the system then remove and dispose of properly.
3. Capacitor > 2.5cm - Remove the power supply from the system. With a #2 Philips screw driver remove the screws
securing the top cover then locate the capacitors and pry from the PCB with a flat head screw driver and dispose of
properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1 – Disassembly Diagram
Attachment 1 & 2 – System Battery Location
Attachment 3 – BBWC Location
Attachment 1, 4, 5 & 6 – Power Supply Capacitor Location
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Attachment 1
Attachment 2
EL-MF877-00 Page 3
Template Revision A
Attachment 3
Attachment 4
EL-MF877-00 Page 4
Template Revision A
Attachment 5
Attachment 6
EL-MF877-00 Page 5
Template Revision A
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