HP ProLiant DL385 SAS Istruzioni per il montaggio

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HP ProLiant DL385 SAS / DL385R01O-NVP1-2.2GHz

HP ProLiant DL385 SAS / DL385R01O-NVQ1-1.8GHz

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

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Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 2

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

EL-MF877-00 Page 2

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torx Driver T-15 Bit

Philips Driver # 2

Flat Head Screw Driver Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. System Board Battery – Remove the top cover and locate the battery on the system board. With a medium flat head

screw driver remove the battery and dispose of properly.

2. Capacitors > 2.5CM – Remove the power supply(s) from the system. With #2 Philips screw driver remove the screws

securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the PCB with a medium flat

head screw driver and dispose of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1 – Disassembly Diagram

Attachment 2 – System Battery Location

Attachment 3 – Capacitors Location

Attachment 1

Attachment 2

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Attachment 3

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