HPE ProLiant XL260a Gen9 Istruzioni per il montaggio

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

XL260a Gen9 Compute Tray

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Trox Driver

T10

Trox Driver

T15

Phillips

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Press the latch to remove top cover from chassis.

2. Remove Air baffle from system by hand.

3. Locate the battery on the mother board, push the lock area of battery holder and remove the battery by hand

4. Loose screws with screw driver and uninstall the MEZZ bracket.

5. Loose screws of M.2 Card and remove the M.2 module.

6. Remove DIMM, Heat sink, and CPU from MB. And install dust cover.

7. Loose screws with screw driver and remove the Tail Board with MGMT Power Cable.

8. Remove all Cables from MB.

9. Loose screws with screw driver, and remove 1 pcs air baffle bracket.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1# System Board Battery

Attachment 2# system MB with CPU dust cover

Attachment 3# Air baffle bracket

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

Attachment 1#

Attachment 2#

Attachment 3#

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