HPE ProLiant XL260a Gen9 Istruzioni per il montaggio
MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
XL260a Gen9 Compute Tray
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Trox Driver
T10
Trox Driver
T15
Phillips
P1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press the latch to remove top cover from chassis.
2. Remove Air baffle from system by hand.
3. Locate the battery on the mother board, push the lock area of battery holder and remove the battery by hand
4. Loose screws with screw driver and uninstall the MEZZ bracket.
5. Loose screws of M.2 Card and remove the M.2 module.
6. Remove DIMM, Heat sink, and CPU from MB. And install dust cover.
7. Loose screws with screw driver and remove the Tail Board with MGMT Power Cable.
8. Remove all Cables from MB.
9. Loose screws with screw driver, and remove 1 pcs air baffle bracket.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1# System Board Battery
Attachment 2# system MB with CPU dust cover
Attachment 3# Air baffle bracket
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