Huawei MU609T Manuale utente

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without prior written consent of Huawei Technologies Co., Ltd.

The product described in this manual may include copyrighted software of Huawei

Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce,

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, , and are trademarks or registered trademarks of Huawei

Technologies Co., Ltd.

Other trademarks, product, service and company names mentioned are the property of their

respective owners.

Notice

Some features of the product and its accessories described herein rely on the software

installed, capacities and settings of local network, and may not be activated or may be

limited by local network operators or network service providers, thus the descriptions herein

may not exactly match the product or its accessories you purchase.

Huawei Technologies Co., Ltd reserves the right to change or modify any information or

specifications contained in this manual without prior notice or obligation.

NO WARRANTY

THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY

APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,

INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND

FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY,

RELIABILITY OR CONTENTS OF THIS MANUAL.

TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI

TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR

CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR

ANTICIPATED SAVINGS.

Import and Export Regulations

Customers shall comply with all applicable export or import laws and regulations and will

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import the product mentioned in this manual including the software and technical data

therein.

Contents

Getting to Know the MU609T ........................................................................................................................1

PCB Design............................................................................................................................................................3

Assembly................................................................................................................................................................5

Thank you for purchasing HUAWEI MU609T HSPA LGA

Module (hereinafter referred to as the MU609T)

Note:

This manual briefly describes the preparation, the process for PCB Design, Assembly

and safety precautions.

You are recommended to read the manual before using the MU609T.

Getting to Know the MU609T

The package of the LGA module is 140 pin LGA with a dimension of 40 mm × 40 mm ×

4.0 mm. It is applied to the user interface board, and can be used as a wireless terminal

in a network environment.

35.56

29.26

18.54

30.14

3.25 7 .32

2.44

4X2 .0

4X2.0

35X3.0

35X 3.0

3.0

135!

2.0

3X0 .6

3X1.0

97X 1.8

97X1.2

5:1 B

5:1

Bottom view

PCB Design

PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows: the sizes of the solder pads on customers'

PCBs are the same as those of the module's solder pads for the high production

efficiency and high reliability of solder joints. For details, see the following figure:

Top view (PCB pad is recommended)

No.

mil

36.65

1442.8

35.56

1400

30.14

1186.8

29.26

1152

2.44

3.71

146

18.54

730

24.38

960

3.25

128

7.32

288

9.76

384

14.64

576

3.05

120

2.03

1.22

1.83

1.02

0.61

Requirements on PCB Layout

The thickness of PCB is more than 1.0 mm (1.2 mm recommended) to reduce the

deformation caused by high temperature welding.

The minimum distance between the LGA module and the PCB edge is 1.5 mm. Other

devices must be located more than 1 mm away from the LGA module (more than 3 mm

recommended if rework is considered).

When the PCB layout is double sided, it is recommended that the LGA module be

placed on the second side for assembly.

Design of Solder Mask

The PCB pad design can be solder mask defined (SMD), or non-solder mask defined

(NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design

is larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

Assembly

Stencil Design

It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the

stencil design, see the following figure：

35.61

35.56

29.26

18.54

30.09

3.30

7.32

2.44

4X2.03

4X2.08

35X3 .05

35X3.05

3.05

2.05

3X0.65

3X1.00

97X1.88

97X1.22

5:1

5:1 E

5:1

3.71

9.76

14.64

36.70

29.26

24.38

2.44

3.71

36.70

30.09

4X0 .2

3X0.2

97X0.2

0.3

0.2

135

1.27

Item

Description

Figure

Elongate the stencil opening 0.05 mm

with the direction reverse the center of

the module and add an isolation

bridge with 0.2 mm width at the X axis

direction.

B&C

0.3 mm width stencil opening and 0.2

mm space to divide the pad with the

angle of 45.

Elongate the stencil opening 0.05 mm

with the reverse direction for the

adjacent pad, but will not reduce the

air gap, and add an isolation bridge

with 0.2 mm width at the X axis

direction.

Elongate the stencil opening 0.05 mm

with the X+ direction and add an

isolation bridge with 0.2 mm width at

the axis direction.

Reflow Profile

For the soldering temperature of the LGA module, see the following figure:

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