CONTENTS
1. INTRODUCTION............................................................................................................ 6
1.1 Product Description ..................................................................................................... 6
1.2 Standard Features........................................................................................................ 6
1.3 Functional Diagram..................................................................................................... 7
1.4 Physical Layout for System .......................................................................................... 8
2. MAJOR COMPONENTS............................................................................................... 10
2.1 CN82xx/CN83xx –Processor..................................................................................... 10
2.2 DDR4 DRAM Controller............................................................................................ 11
2.3 eMMC......................................................................................................................... 12
2.4 SPI .............................................................................................................................. 13
2.5 SERDES - QLMs/DLMs ............................................................................................. 14
2.6 USB 3.0....................................................................................................................... 15
2.7 UART Interface........................................................................................................... 16
2.8 I2C Interface............................................................................................................... 17
2.9 SMI interface.............................................................................................................. 18
2.10 P Bus interface ......................................................................................................... 19
3 CPLD................................................................................................................................ 20
3.1 Access Interface.......................................................................................................... 20
3.2 LED Control............................................................................................................... 20
3.3 Boot Strap................................................................................................................... 20
3.4 Boot Devices............................................................................................................... 21
3.4.1 SPI NOR Flash..................................................................................................... 21
3.4.2 SD card ................................................................................................................ 21
3.4.3 eMMC................................................................................................................... 21
3.5 Selecting Boot Device................................................................................................. 21
4 ETHERNET PHYS............................................................................................................ 22
