Linx Technologies RXM-900-HP3 Guida

HP SERIES-3 RECEIVER MODULE DESIGN GUIDE

APPLICATIONS INCLUDE:

€G eneral Wire E limination

€Wireless Data Transfer

€Wireless Analog / Audio

€Home / Industrial Automation

€Wireless Networks

€R emote C ontrol

€R emote Access

€R emote Monitoring / Telemetry

€Alarm / S ecurity S ys tems

€Long-R a nge R F ID

€ MIDI Links

€ Voice/Mus ic / Intercom Links

FEATURES:

€ 8P arallel/100 S erial (P S Vers ions)

Us er-S electable C hannels

€P recis ion F requency S ynthes iz ed

Architecture

€ SAW F ilter F or S uperior Out-of-B and

R ejection

€F M/F S K Demodulation F or O uts tanding

P erformance and Noise Immunity

€E xceptional S ensitivity (-100 dB m typical)

€Wide-R ange Analog C apability Including

Audio (50Hz-28kHz)

€ Trans parent S erial Data Output

(56K bps max.)

€Direct S erial Interface

€R eceive S ignal S trength (R S S I) and

P owerdown Lines

€C ost-E ffective

€P inned or S MD P ackaging

€Wide S upply R ange (2.8-13V DC )

€E xtended Temperature R ange

(-30°C to +85°C )

€No P roduction Tuning or E xternal R F

C omponents R equired (E xcept Antenna)

€C ompatible With P revious HP S eries

Modules

DE S C R IP TION:

The HP -3 R F receiver module is the third generation of the popular HP S eries and offers

complete compatibility and numerous enhancements over previous generations. Like its

predeces s ors, the HP -3 is designed for the cost-effective, high-performance wireless transfer

of analog or digital information in the popular 902-928MHz band. All HP -3 s eries modules

continue to feature eight parallel selectable channels but versions are also available which

add serial selection of 100 channels. To ensure reliable performance, the receiver employs

F M/F S K demodulation and an advanced dual-conversion microprocessor-controlled

synthesized architecture. T he receiver is pin- and footprint-compatible with all previous

generations but its overall phys ical size has been reduced. B oth S MD and pinned packages

are now available. W hen paired with an HP -3 transmitter, a reliable link is created for

transferring analog and digital information up to 1000 ft. (under optimal conditions). Like all

Linx modules, the HP -3 requires no tuning or additional R F components (except an antenna),

making integration s traightforward even for engineers without prior R F experience.

P A R T # DE S C R IP T ION

R X M-900-HP 3-P P O HP -3 R eceiver (P INNE D 8 C H only)

R X M-900-HP 3-P P S HP -3 R eceiver (P INNE D 8p /100s C H)

R XM-900-HP 3-S P O HP -3 R eceiver (S MD 8 C H only)

R XM-900-HP 3-S P S HP -3 R eceiver (S MD 8p /100s C H)

MDE V-900-HP 3-P P S Development K it 900MHz (P inned P kg.)

MDE V-900-HP 3-S P S Development K it 900MHz (S MD P kg.)

ORDERING INFORMATION

IGH

-P

ERFORMANCE

RF MODULE

RXM-900-HP3

R evised 6/10/03

Parameter Designation Min. Typical Max. Units Notes

POWER SUPPLY

Input Voltage VCC 2.8 – 13.0 VDC –

Supply Current ICC 16 19 21 mA 1

Power-Down Current IPDN –5.610

A–

RECEIVE SECTION

Receive Frequency Range FC902.62 – 927.62 MHz 4

Channel Spacing – 250 – kHz 4

Center Frequency Accuracy -50 +50 kHz

First IF Frequency – 34.7 – MHz –

Second IF Frequency – 10.7 – MHz –

Noise Bandwidth N3DB – 280 – kHz –

Data Bandwidth 100 – 56,000 Bps –

Analog/Audio Bandwidth 50 – 28,000 Hz –

Analog/Audio Output Level 0.8 1.1 2.0 Vac 5

Data output:

Logic low GND – 0.5 VDC 2

Logic high VCC-.3 – VCC VDC 2

Data Output Impedance – 17 – kOhms –

Data Output Source Current – 230 –

Receiver Sensitivity -94 -100 -107 dBm 6,7,8

RSSI:

Dynamic Range 60 70 80 dB –

Gain – 24 – mV/dB –

Voltage/No Carrier – – 1.6 V –

Spurious Emissions – -57 – dBm –

Interference Rejection:

FC±1MHz – 54 – dB –

FC±5MHz –57–dB–

ANTENNA PORT

RF input impedance RIN –50–Ohms –

TIMING

Max time between transitions T1––20mSec 10

Max Channel-ChangeTime T2––1.5mSec 10

Receiver Turn-on Time (Via PDN) T3––3mSec 10

Receiver Turn-on Time (Via Vcc)T

4––7mSec 10

ENVIRONMENTAL

Operational Temperature -30 +85 °C

Page 2

SPECIFICATIONS

1. Over entire operating voltage range

2. No load

3. With 1-volt output drop

4. Serial Mode

5. With 1kHz Sine @ 115kHz transmitter deviation

6. For 10-5 @ 9,600 BPS

7. At specified center frequency

8. Units are not rejected for better than maximum sensitivity

9. Minimum input power level to ensure that data output can hold a DC level

10. See page 14

Figure 1: Specifications Table

Notes:

ABOUT THESE MEASUREMENTS

The performance parameters listed below are based on module operation at

25°C from a 5V DC supply unless otherwise noted.

Page 3

Absolute Maximum Ratings:

Supply voltage Vcc -0.3 to 13 VDC

Voltage on any digital input pin

(regardless of supply) -0.3 to 13 VDC

Maximum RF input power +10 dB

Operating temperature -30°C to +85°C

Storage temperature -45°C to +85°C

Soldering temperature +260°C for 15 sec.

Figure 5: Worst Case RSSI Response Time

Figure 3: RX Enabled to Valid Data

Figure 6: BER vs. Input Power (typical)

10-6

10-5

10-4

10-3

-92 -93 -94 -95 -96 -97 -98 -99 -100 -101 -102

BER

PIN (dBm)

Figure 4: Receiver RSSI

TYPICAL PERFORMANCE GRAPHS

*NOTE* Exceeding any of the limits of this section may lead to permanent damage to the device.

Furthermore, extended operation at these maximum ratings may reduce the life of this device.

PON

Data Out

*CAUTION*

This product incorporates static-sensitive components. Always wear

an ESD wrist strap and observe proper ESD handling procedures

when working with this device. Failure to observe this precaution may

result in module damage or failure.

Figure 2: Maximum Ratings Table

PDN

RX Data

RX Off

RX On >-35dBm

Page 4

PIN# Name Equivalent CTK Description

50-ohm RF Input

Analog Ground

No Connection

RF Input/

Antenna Input

Gnd

RF In

Channel Select 0CS0 CS0

Channel Select 1 /

Serial Select Clock

CS1 /

SS Clock CS1

Channel Select 2 /

Serial Select Data

Received Signal

Strength Indicator

Mode Select

Voltage Input 2.8-13V

1V p-p Analog Output

Digital Data Output

N/C

Power Down

(Active Low)

CS2 /

SS Data CS2

PDN

RSSI RSSI

Gnd/Mode

VCC

Analog Out

Data Out

SMD (Only) No Connection

N/C

2-8

19-36

50Ω

4.7K

VIN

PDN

470K

VIN

25K

PIN DESCRIPTIONS

Figure 7: Pin Functions and Equivalent Circuits

It is recommended all ground pins be connected to the groundplane. Pins

marked N/C have no physical connection, and are designed only to add support.

Page 5

The receiver is available in two package styles. The pinned SIP style is designed

for through-hole application and has 18 pins spaced at 0.1" intervals. Pin 1 is on

the far left of the board when viewed from the front. The package may be

inserted at right angles or bent to lie down (with the cover facing up) on the PCB.

Avoid repeated bending of the pins as they will weaken and may break.

The surface mount version is housed in a 36-pad hybrid SMD package which

has been designed to facilitate both hand and automated assembly. Castellation

grooves have been provided for ease of hand soldering and inspection. Pin 1 is

on the lower left when viewed as shown above.

PHYSICAL PACKAGING

RECOMMENDED PAD LAYOUT

The following drawings illustrate the recommended circuit-board footprints for

the HP-3 series receiver modules. The ground plane layer is also an essential

part of good layout. Be sure to review the physical layout recommendations and

antenna guidelines contained elsewhere in this design guide.

0.750"

0.090"

0.100"

0.065"

.060" .10"

.060"

.030" Dia. Finished

Figure 9: Suggested PCB Footprint

Surface-Mount ReceiverPinned Receiver

Figure 8: Receiver Physical Package

ENCAPSULATION NOTICE

In some applications the designer may wish to encapsulate the product's

circuit board. Among the common reasons for doing so are environmental

protection and security. The dielectric constant of encapsulation and potting

materials varies and can adversely affect receiver performance. For this

reason Linx does not recommend the encapsulation of our products and doing

so will void all product warranties. It should be noted, however, that customers

have reported success with a variety of encapsulation materials and

techniques. Should you choose to encapsulate your product, careful testing

should be conducted to determine the suitability of the chosen material.

0.236"

1.94"

0.78"

LOT 10000

HP SERIES RF RECEIVER

RXM-900-HP3-PP*

0.190"

0.75"

1.95"

0.69"

LOT 10000

HP SERIES RF RECEIVER

RXM-900-HP3-SP*

Page 6

PRODUCTION CONSIDERATIONS

Pinned Receiver Hand Assembly

The SIP module pins may be hand or wave-soldered. The module should not be

subjected to reflow. Linx recommends wash-free manufacturing techniques. The

modules are wash-resistant, but are not hermetically sealed. If a wash is used,

a drying time, sufficient to allow the evaporation of any moisture which may have

migrated into the module, must be allowed prior to applying electrical power. If

the wash contains contaminants, receiver performance may be adversely

affected even after drying.

SMD Receiver Hand Assembly

The SMD version is housed in a hybrid

SMD package which has been designed

to support hand or automated reflow

techniques. The packages primary

mounting surface is 36 pads located on

the bottom of the module. Since these

pads are inaccessible during mounting,

plated castellations run up the sides of the

module to facilitate solder wicking. This

allows for very quick and efficient hand

soldering for prototyping and small

volume production.

If the recommended pad placement has been followed, the pad on the board will

extend slightly past the edge of the module. Touch both the PCB pad and the

module castellation with a fine soldering tip. Tack one module corner first, then

work around the remaining attachment points being careful not to exceed the

solder times listed below.

Care should be taken, especially when hand-soldering, not to use excessive

amounts of flux as it will wick under the module and potentially impair its function.

In many cases, no-clean solder is the best choice. The modules are wash-

resistant, but are not hermetically sealed. Linx recommends wash-free

manufacturing techniques. If a wash is used, a drying time, sufficient to allow any

moisture which may have migrated into the module to evaporate, must be

allowed prior to applying electrical power. If the wash contains contaminants,

receiver performance may be adversely affected even after drying.

Castellations

PCB Pads

Soldering Iron

Tip

Solder

Figure 10: Soldering Technique

Absolute Maximum Solder Times

Hand-Solder Temp. TX +225°C for 10 Sec.

Hand-Solder Temp. RX +225°C for 10 Sec.

Recommended Solder Melting Point +180°C

Reflow Oven: +220° Max. (See adjoining diagram)

Page 7

SMD RECEIVER AUTOMATED ASSEMBLY GUIDELINES

For high-volume assembly, most users will want to auto-place the modules. The

modules have been designed to maintain compatibility with most pick-and-place

equipment, however, due to the module's hybrid nature certain aspects of the

automated assembly process are far more critical than for other component

types.

Following are brief discussions of the three primary areas where caution must be

observed.

Reflow Temperature Profile

The single most critical stage in the automated assembly process is the reflow

process. The reflow profile below should not be exceeded since excessive

temperatures or transport times during reflow will irreparably damage the

modules. Assembly personnel will need to pay careful attention to the oven's

profile to ensure that it meets the requirements necessary to successfully reflow

all components while remaining within the limits mandated by the modules

themselves.

Shock During Reflow Transport

Since some internal module components may reflow along with the components

placed on the board being assembled, it is imperative that the module not be

subjected to shock or vibration during the time solder is liquidus.

Washability

The modules are wash-resistant, but are not hermetically sealed. Linx

recommends wash-free manufacturing techniques, however, the modules can

be subjected to a wash cycle provided that a drying time is allowed prior to

applying electrical power to the parts. The drying time should be sufficient to

allow any moisture which may have migrated into the module to evaporate, thus

eliminating the potential for shorting damage during power-up or testing. If the

wash cycle contains contaminants, receiver performance may be adversely

affected, even after drying.

Figure 11: Maximum Reflow Profile

125°C

600

100

150

200

250

300

°C

120 180 240 300

30 90 150 210 270 330 360

180°C

210°C

220°C

Temperature

Time (Seconds)

Ideal Curve

Limit Curve

Forced Air Reflow Profile

1-1.5 Minutes

2-2.3 Minutes

Ramp-up

Preheat Zone

Cooling

Soak Zone

Reflow Zone

20-40 Sec.

2 Minutes Max.

The HP-3 is a high-performance multi-channel, dual-conversion superhet receiver

capable of recovering both analog (FM) and digital (FSK) information from a

matching HP transmitter. FM/FSK modulation offers significant advantages over

AM or OOK modulation methods including increased noise immunity and the

receiver's ability to "capture" in the presence of multiple signals. This is especially

helpful in crowded bands like those in which the HP-3 operates.

Let's take a brief look at each receiver section starting with the antenna. The

single-ended RF port is matched to 50 ohms to support commonly available

antennas such as those manufactured by Linx. The RF signal coming in from the

antenna is filtered by a Surface Acoustic Wave (SAW) filter to attenuate unwanted

RF energy (i.e., not in the 902-928MHz band). A SAW filter provides significantly

higher performance than other filter types such as an LC bandpass.

Once filtered, the signal is amplified by a Low-Noise Amplifier (LNA) to increase

the receiver sensitivity and lower the overall noise figure of the receiver. After the

LNA, the signal is mixed with a synthesized local oscillator operating 34.7MHz

below the incoming transmission frequency to produce the first Intermediate

Frequency (IF).

The second conversion and FM demodulation is achieved by a high-performance

IF strip which mixes the 34.7MHz first conversion frequency with 24.0MHz from a

precision crystal oscillator. The resulting second IF of 10.7MHz is then highly

amplified in preparation for demodulation.

Aquadrature demodulator is used to recover the baseband signal from the carrier.

The demodulated waveform is filtered, after which it closely resembles the original

signal. The signal is routed to the analog output pin and the data slicer stage,

which provides squared digital output via the data output pin. A key feature of the

HP-3 is the transparency of its digital output which does not impose balancing or

duty-cycle requirements within a range of 100 bps to 56Kbps.

An on-board micro-controller manages receiver functions and greatly simplifies

user interface. The micro-controller reads the channel-selection lines and

programs the on-board synthesizer. This frees the designer from complex

programming requirements and allows for manual or software channel selection.

The micro-controller also monitors incoming signal strength and squelches the

data output when the signal is not strong enough for accurate data detection.

Channel

Select

SAW BPF

VCO

PLL

{

4MHz

Int. Osc.

MODE

CS0

CS1

CS2

LNA

34.7M

BPF

10.7MHz

BPF

24MHz

Crystal

Amp

10.7M

BPF 10.7M

Discriminator

Quad

RSSI

Digital

Data

Analog

Data

Limiter

Figure 12: HP Series-3 Receiver Block Diagram

THEORY OF OPERATION

Page 8

Page 9

BOARD LAYOUT CONSIDERATIONS

If you are familiar with RF you may be concerned about specialized layout

requirements. Fortunately, by adhering carefully to a few basic design and layout

rules, receiver integration is generally very straightforward.

Page 5 shows the suggested PCB footprint

for the HP Series-3 receiver. A

groundplane (as large as possible) should

be placed on a lower layer of your PC

board opposite the HP-3 receiver. This

groundplane can also be critical to the

performance of your antenna which will be

discussed later in the manual.

The HP-3 receiver should, as much as reasonably possible, be isolated from

other components on your PCB. Specifically, high-frequency circuitry such as

crystal oscillators should be kept as far away as possible from the HP-3 receiver.

If a pinned version of the receiver is to be mounted parallel to the board, it should

be laid over so that the plastic cover faces away from the PC board.

Do not route PCB traces directly under SMD-packaged versions. The underside

of the module has numerous signal-bearing traces and vias which could short or

couple to traces on the product's circuit board.

The trace from the receiver to the antenna should be kept as short as possible.

For runs greater than 1/4 inch use 50-ohm coax or a 50-ohm microstrip

transmission line as shown below. Handy software for calculating microstrip lines

is available on the Linx website (www.linxtechnologies.com).

Figure 14: Microstrip Formulas (Er = Dielectric constant of PCB material)

Effective

Dielectric Width/Height Dielectric Characteristic

Constant (W/d) Constant Impedance

4.8 1.8 3.59 50.0

423.07 51.0

2.55 3 2.12 48.0

Full groundplane on inner or lower board layer

Microstrip

Figure 13: Groundplane Treatment

Acommon method of reducing power consumption is to turn off the receiver via the PDN

pin and then wake it periodically to check for signal presence. During power-down the

module is completely shut down. In order to wake the receiver successfully, allowance

must be made for the start-up time requirements outlined elsewhere in this guide.

Remember the stated timing parameters assume a stable supply of 2.8 volts or

greater. They do not include the charging times of external capacitance on the

module's supply lines or the overhead of external software.

NOTE: WHEN PERIODICALLY POWERING-DOWN THE RECEIVER!

Page 10

POWER-UP SEQUENCE

As previously mentioned, the HP-3 is controlled by an on-board microprocessor.

When power is applied, the microprocessor executes the receiver start-up

sequence, after which the receiver is ready to receive valid data.

Figure 16 shows the start-up sequence. This

sequence is executed when power is applied

to the VCC pin or when the PDN pin is taken

high.

On power-up, the microprocessor reads the

external channel-selection lines and sets the

frequency synthesizer to the appropriate

channel. Once the frequency synthesizer has

stabilized, the receiver is ready to accept data.

The typical turn-on response time for an HP

Series-3 receiver is shown on page 3. The

response time was measured by connecting

the module's RF input to a signal generator

set to the proper channel frequency with an

output power of -92dBm and FM modulated

at 115kHz deviation with a 1kHz square wave.

The data output remains squelched until the

internal start-up procedure has been

executed.

POWER ON

Squelch Data

Output Pin

Determine Mode

Program Freq. Synth

To Default CH. 50

Read Channel

Selection Inputs

Crystal Oscillator

Begins to Operate

Program Frequency

Synthesizer

Ready for

Serial Data Input

Crystal Oscillator

Begins to Work

Determine Squelch

State Data Output Pin

Cycle Here Until More

Data Input

or Mode Change

Determine Squelch

State Data Output Pin

Cycle Here Until

Channel

or Mode Change

Serial ModeParallel Mode

POWER SUPPLY

The user must provide a clean source of power

to the receiver to ensure proper operation.

Supply noise will reduce receiver sensitivity.

The HP-3 incorporates a precision low-dropout

regulator on-board which allows operation over

an input voltage range of 2.8 to 13 volts DC.

Figure 15, shows a typical supply filter. This

filter should be placed close to the module's

supply lines. Its actual values will depend on the

type and frequency of noise present in the user's product.

The HP-3 can be put into an ultra-low-current (<10µA) power-down mode by

holding the PDN pin low. In power-down mode, the receiver is completely shut

down. Thus, the RSSI circuit CANNOT be used to monitor for channel activity. If

the PDN pin is left open or held high, the receiver will be fully on.

Figure 15: Typical Supply Filter

.1µF>22µF

Vcc IN

Vcc to

module

Figure 16: Start-Up Sequence

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