MICROENER MC3V-X/10-4 Manuale utente

MC3V-X/10-4 Doc. N° MO-0355-ING

THREE PHASE

Over/Under VOLTAGE

Over/Under FREQUENCY

MICROPROCESSOR

RELAY

TYPE

MC3V-X/10-4

(I/O Boards)

OPERATION MANUAL

MC3V-X/10-4 Doc. N° MO-0355-ING

1. GENERAL UTILIZATION AND COMMISSIONING DIRECTIONS __________________________________________________________ 3

1.1 - Storage and Transportation_____________________________________________________________________________________ 3

1.2 - Installation __________________________________________________________________________________________________ 3

1.3 - Electrical Connection__________________________________________________________________________________________ 3

1.4 - Measuring Inputs and Power Supply______________________________________________________________________________ 3

1.5 - Outputs Loading _____________________________________________________________________________________________ 3

1.6 - Protection Earthing ___________________________________________________________________________________________ 3

1.7 - Setting and Calibration ________________________________________________________________________________________ 3

1.8 - Safety Protection _____________________________________________________________________________________________ 3

1.9 - Handling ___________________________________________________________________________________________________ 3

1.10 - Maintenance _______________________________________________________________________________________________ 4

1.11 - Waste Disposal of Electrical & Electronic Equipment ________________________________________________________________ 4

1.12 - Fault detection and repair _____________________________________________________________________________________ 4

2. GENERAL CHARACTERISTICS ____________________________________________________________________________________ 5

2.1 - Power Supply _______________________________________________________________________________________________ 5

2.2 - Operation and Algorithms ______________________________________________________________________________________ 6

2.2.1 - Reference Input Values ____________________________________________________________________________________ 6

2.2.2 - Input quantities___________________________________________________________________________________________ 6

2.2.2.1 - Mains Frequency (Freq) ________________________________________________________________________________ 6

2.2.2.2 - Phase Voltage inputs __________________________________________________________________________________ 6

2.2.3 - Functions and Settings (Function) ____________________________________________________________________________ 7

2.2.3.1 - V> (1F59) - First overvoltage protection level (smallest of 3 phase-to-neutral voltages) _______________________________ 7

2.2.3.2 - V>> (2F59) - Second overvoltage protection level (largest of 3 phase-to-neutral voltages) _____________________________ 7

2.2.3.3 - V< (1F27) - First undervoltage protection level (smallest of 3 phase-to-neutral voltages) ______________________________ 8

2.2.3.4 - V<< (2F27) - Second undervoltage protection level (smallest of 3 phase-to-neutral voltages) __________________________ 8

2.2.3.5 - f> (F81) - Overfrequency protection level ___________________________________________________________________ 9

2.2.3.6 - f< (F81) - Underfrequency protection level __________________________________________________________________ 9

2.2.3.7 - Vo> (F59o) – Zero sequence overvoltage protection level (Vo=3Uo) _____________________________________________ 9

2.2.3.8 – V1< (F27V1) – Positive sequence undervoltage protection level (Positive sequence ________________________________ 10

symmetrical component) ______________________________________________________________________________________ 10

2.2.3.9 – V2> (F59V2) – Negative sequence overvoltage protection level (Negative sequence _______________________________ 10

symmetrical component) ______________________________________________________________________________________ 10

2.2.3.10 - RTD - Remote Trip __________________________________________________________________________________ 11

2.2.3.11 - I.R.F. - Internal Relay Failure __________________________________________________________________________ 11

2.2.3.9 - Osc - Oscillographic Recording _________________________________________________________________________ 12

2.2.3.10 - Comm – Communication Parameters ___________________________________________________________________ 13

2.2.3.11 - LCD – Display and Buzzer operation ____________________________________________________________________ 13

3. INSTANTANEOUS OUTPUT AND BLOCKING INPUT __________________________________________________________________ 14

3.1 - Instantaneous Output ________________________________________________________________________________________ 14

3.2 – Blocking Input ______________________________________________________________________________________________ 14

4. OUTPUT RELAYS _______________________________________________________________________________________________ 14

5. DIGITAL INPUTS________________________________________________________________________________________________ 15

6. SELFDIAGNOSTIC ______________________________________________________________________________________________ 15

7. RELAY MANAGEMENT __________________________________________________________________________________________ 16

8. SIGNALIZATIONS _______________________________________________________________________________________________ 17

9. KEYBOARD BUTTONS __________________________________________________________________________________________ 17

10. Serial Communication Port ______________________________________________________________________________________ 18

10.1 - Main RS485 Serial Communication Port _________________________________________________________________________ 18

10.2 - Communication Port on Front Face Panel _______________________________________________________________________ 19

11. MENU AND VARIABLES ________________________________________________________________________________________ 20

11.1 - Real Time Measurements ____________________________________________________________________________________ 20

11.2 - Meas (Instantaneous Measurements) ___________________________________________________________________________ 20

11.3 - Counter (Operation Counters) _________________________________________________________________________________ 20

11.4 - LastTrip (Event Recording) ___________________________________________________________________________________ 21

11.5 - R/W Set (Programming / Reading the Relay Settings) ______________________________________________________________ 22

11.5.1 - CommAdd (Communication Address) _______________________________________________________________________ 22

11.5.2 - Time/Date (Time/Date)___________________________________________________________________________________ 22

11.5.3 - RatedVal (Rated Input Values) ____________________________________________________________________________ 22

11.5.4 - Function (Functions) ____________________________________________________________________________________ 23

11.6 - RelayCfg (Relay Configuration)________________________________________________________________________________ 25

11.7 - Commands _______________________________________________________________________________________________ 26

11.8 - Info&Ver (Firmware - Info&Version) ____________________________________________________________________________ 26

12. KEYBOARD OPERATIONAL DIAGRAM ____________________________________________________________________________ 27

13. PASSWORD __________________________________________________________________________________________________ 28

13.1 - MS-Com Password _________________________________________________________________________________________ 28

14. MAINTENANCE________________________________________________________________________________________________ 28

15. POWER FREQUENCY INSULATION TEST__________________________________________________________________________ 28

16. CONNECTION DIAGRAM ________________________________________________________________________________________ 29

17. OVERALL DIMENSIONS ________________________________________________________________________________________ 30

18. DIRECTION FOR PCB'S DRAW-OUT AND PLUG-IN __________________________________________________________________ 31

18.1 - Draw-Out _________________________________________________________________________________________________ 31

18.2 - Plug-In ___________________________________________________________________________________________________ 31

19. ELECTRICAL CHARACTERISTICS ________________________________________________________________________________ 32

MC3V-X/10-4 Doc. N° MO-0355-ING

1. GENERAL UTILIZATION AND COMMISSIONING DIRECTIONS

Always make reference to the specific description of the product and to the Manufacturer's instruction.

Carefully observe the following warnings.

1.1 - Storage and Transportation

must comply with the environmental conditions stated on the product's instruction or by the applicable

IEC standards.

1.2 - Installation

must be properly made and in compliance with the operational ambient conditions stated by the

Manufacturer.

1.3 - Electrical Connection

must be made strictly according to the wiring diagram supplied with the Product, to its electrical

characteristics and in compliance with the applicable standards particularly with reference to human

safety.

1.4 - Measuring Inputs and Power Supply

carefully check that the value of input quantities and power supply voltage are proper and within the

permissible variation limits.

1.5 - Outputs Loading

must be compatible with their declared performance.

1.6 - Protection Earthing

When earthing is required, carefully check its effectiveness.

1.7 - Setting and Calibration

Carefully check the proper setting of the different functions according to the configuration of the

protected system, the safety regulations and the co-ordination with other equipment.

1.8 - Safety Protection

Carefully check that all safety means are correctly mounted, apply proper seals where required and

periodically check their integrity.

1.9 - Handling

Notwithstanding the highest practicable protection means used in designing M.S. electronic circuits, the

electronic components and semiconductor devices mounted on the modules can be seriously damaged

by electrostatic voltage discharge which can be experienced when handling the modules.

The damage caused by electrostatic discharge may not be immediately apparent but the design

reliability and the long life of the product will have been reduced. The electronic circuits reduced by

M.S. are completely safe from electrostatic discharge (8 KV IEC 255.22.2) when housed in their case;

withdrawing the modules without proper cautions expose them to the risk of damage.

MC3V-X/10-4 Doc. N° MO-0355-ING

a. Before removing a module, make sure you are at the same electrostatic potential as the equipment

by touching the case.

b. Handle the module by its front-plate, frame, or edges of the printed circuit board. Avoid touching the

electronic components, printed circuit tracks or connectors.

c. Do not pass the module to any person without first ensuring that you are both at the same

electrostatic potential. Shaking hands achieves equipotential.

d. Place the module on an antistatic surface, or on a conducting surface which is at the same potential

as yourself.

e. Store or transport the module in a conductive bag.

More information on safe working procedures for all electronic equipment can be found in

BS5783 and IEC 147-OF.

1.10 - Maintenance

Make reference to the instruction manual of the Manufacturer ; maintenance must be carried-out by

specially trained people and in strict conformity with the safety regulations.

1.11 - Waste Disposal of Electrical & Electronic Equipment

(Applicable throughout the European Union and other European countries with separate collection

program).

This product should not be treated as household waste when you wish dispose of it. Instead, it should be

handed over to an applicable collection point for the recycling of electrical and electronic equipment.

By ensuring this product is disposed of correctly, you will help prevent potential negative consequence to

the environment and human health, which could otherwise be caused by inappropriate disposal of this

product. The recycling of materials will help to conserve natural resource.

1.12 - Fault detection and repair

Internal calibrations and components should not be altered or replaced.

For repair please ask the Manufacturer or its authorised Dealers.

Misapplication of the above warnings and instruction relieves the Manufacturer of any liability.

MC3V-X/10-4 Doc. N° MO-0355-ING

2. General Characteristics

The MC is a very innovative and versatile line of Protective Relays which takes advantage of the long

and successful experience coming from the M-Line.

The main features of the MC-Line relays are:

Compact draw-out execution for Flush Mounting or for assembly in 19” 3U chassis for 19” Rack systems.

User friendly front face with 2x8 characters LCD Display, four signal Leds, four keys for complete local

management and 9-pin socket for local RS232 serial communication.

Four user programmable Output Relays. On request one of the Output Relays can be replaced by a Can

Bus port for control of additional I/O modules.

Three optoisolated, self-powered Digital Inputs.

RS485 communication port (independent from the RS232 port on front panel)

Totally draw-out execution.

Input voltage is supplied to 3 internal isolated transformers.

The Measuring Ranges are:

Phase Voltage : (0.1 - 2)Un

Frequency : (40.00 - 70.00)Hz

Make electric connection in conformity with the diagram reported on relay's enclosure.

Check that input quantities are same as reported on the diagram and on the test certificate.

2.1 - Power Supply

The auxiliary power is supplied by a built-in module fully isolated an self protected.

Two options are available:

24V(-20%) / 110V(+15%) a.c. 80V(-20%) / 220V(+15%) a.c.

a) - b) - 

24V(-20%) / 125V(+20%) d.c. 90V(-20%) / 250V(+20%) d.c.

Before energising the unit check that supply voltage is within the allowed limits.

MC3V-X/10-4 Doc. N° MO-0355-ING

2.2 - Operation and Algorithms

2.2.1 - Reference Input Values

Display Description Setting Range Step Unit

V1 10 kV Rated Primary voltage of phase V.T. 0.05 - 500 0.01 kV

V2 100 V Rated Secondary voltage of phase V.T. 50 - 400 0.01 V

Freq 50 Hz System rated frequency 50 - 60 10 Hz

2.2.2 - Input quantities

2.2.2.1 - Mains Frequency (Freq)

The relay can operate either in 50Hz or 60Hz systems.

The rated Mains Frequency “ Freq “ must be set accordingly.

2.2.2.2 - Phase Voltage inputs

Input voltages are supplied to 3 internal adapting transformers; the rated input voltage (phase-to-

phase) can be programmed in the range (50 - 400)V.

The display shows the measurement of the phase-to-neutral voltages in primary volt according to

the programmed reference input values.

MC3V-X/10-4 Doc. N° MO-0355-ING

2.2.3 - Functions and Settings (Function)

2.2.3.1 - V> (1F59) - First overvoltage protection level (smallest of 3 phase-to-neutral voltages)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →V> 1.10 Vn (0.50 ÷1.50) step 0.01 Vn

Timers →tV> 1.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V> : Trip level of overvoltage protection

 tV> : Trip time delay

2.2.3.2 - V>> (2F59) - Second overvoltage protection level (largest of 3 phase-to-neutral voltages)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →V>> 1.30 Vn (0.50 ÷1.50) step 0.01 Vn

Timers →tV>> 0.30 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V>> : Trip level of overvoltage protection

 tV>> : Trip time delay

MC3V-X/10-4 Doc. N° MO-0355-ING

2.2.3.3 - V< (1F27) - First undervoltage protection level (smallest of 3 phase-to-neutral voltages)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Disable [Disable / Enable]

TripLev →V< 0.90 Vn (0.20 ÷1.20) step 0.01 Vn

Timers →tV< 1.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V< : Trip level of undervoltage protection

 tV< : Trip time delay

2.2.3.4 - V<< (2F27) - Second undervoltage protection level (smallest of 3 phase-to-neutral

voltages)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Disable [Disable / Enable]

TripLev →V<< 0.70 Vn (0.20 ÷1.20) step 0.01 Vn

Timers →tV<< 0.30 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V<< : Trip level of undervoltage protection

 tV<< : Trip time delay

MC3V-X/10-4 Doc. N° MO-0355-ING

2.2.3.5 - f> (F81) - Overfrequency protection level

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →f> 50.50 Hz (40.00 ÷70.00) step 0.01 Hz

Timers →tf> 1.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 f> : Trip level of overfrequency protection

 tf> : Trip time delay

2.2.3.6 - f< (F81) - Underfrequency protection level

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →f< 49.50 Hz (40.00 ÷70.00) step 0.01 Hz

Timers →tf< 1.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 f< : Trip level of underfrequency protection

 tf< : Trip time delay

2.2.3.7 - Vo> (F59o) – Zero sequence overvoltage protection level (Vo=3Uo)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →Vo> 1.10 Vn (0.10 ÷2.00) step 0.1 Vn

Timers →tVo> 0.30 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 Vo> : Trip level of zero sequence overvoltage protection

 tVo> : Trip time delay

MC3V-X/10-4 Doc. N° MO-0355-ING

2.2.3.8 – V1< (F27V1) – Positive sequence undervoltage protection level (Positive sequence

symmetrical component)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →V1< 0.8 Vn (0.10 ÷1.50) step 0.01 Vn

Timers →tV1< 5.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V1< : Trip level of positive sequence overvoltage protection

 tV1< : Trip time delay

2.2.3.9 – V2> (F59V2) – Negative sequence overvoltage protection level (Negative sequence

symmetrical component)

FuncEnab →Enable [Disable / Enable]

Options →BI Disable [Disable / Enable]

→Trg Enable [Disable / Enable]

TripLev →V2> 0.20 Vn (0.02 ÷1.50) step 0.01 Vn

Timers →tV2> 5.00 s (0.05 ÷60.00) step 0.01 s

 FuncEnab : If disable the function is disactivated

 BI : Operation controlled by Blocking Digital Input

 Trg : Function operation triggers the oscillographic wave form capture

(see § Oscillographic)

 V2> : Trip level of negative sequence overvoltage protection

 tV2> : Trip time delay

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