Panasonic TY-FB9BD Manuale utente

1 Safety Precautions 2

1.1. General Guidelines 2

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 3

3 About lead free solder (PbF) 4

4 Replacement 5

5 Connection 6

6 Circuit Board Layout 7

6.1. HU-Board 7

7 Block and Schematic Diagram 9

rights reserved. Unauthorized copying and

distribution is a violation of law.

TY-FB9BD

7.1. Schematic Diagram Notes 9

7.2. HU-Board Block Diagram 10

7.3. HU-Board (1 of 2) Schematic Diagram 11

7.4. HU-Board (2 of 2) Schematic Diagram 12

8 Replacement Parts List 13

8.1. Replacement Parts List Notes 13

8.2. Electrical Replacement Parts List 14

8.3. Mechanical Replacement Parts List 16

8.4. Parts Location (1) 17

8.5. Parts Location (2) 18

BNC Dual Video Terminal Board

CONTENTS

Page Page

ORDER NO. ITD0605021CE

D10 Canada: B07

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1 Safety Precautions

1.1. General Guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1.Unplug the AC cord and connect a jumper between the two prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MWand 5.2MW.

When the exposed metal does not have a return path to the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to

the customer.

TY-FB9BD

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2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TY-FB9BD

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3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.

Caution

· ·

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· ·

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· ·

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TY-FB9BD

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4 Replacement

TY-FB9BD

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5 Connection

TY-FB9BD

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6 Circuit Board Layout

6.1. HU-Board

ABCDEFGH I

C446

C448

L308

L309

L319

L320

JK301 JK302

JK303

JK304

Q301

C306

Q302

C307

Q303

Q304

C308

Q305

Q306

C310

C312

C314

C317

C318

C319

C320

C321

C322

C323

C324

C325

C326

C327

C328

C329

D307

D308

D309

C330

C331

C332

D310

IC305

C335

C336

IC307

R310

R312

R314

R315

R316

R318

C340

R319

C341

C342

C345

R320

C348

R321

C349

R322

R323

R324

R325

R326

R327

R328R329

C354

C356

R330

C358

R331

C359

R332

R333

R334

R335

R336

R337

R338

C360 R339

C361

C362

C364

C365 C367

C369

R345

R346

C370

C371C373

C374

C375

R351

C379

R352

R353

R354

C380

C381

R359

C382

C384

C385

C386

C387

C388

R360

R361

R362

R363

C390

C391

C392

C393

C394

C395

R370

C398

R377

R383

R391

R392

R394

R395

R396

C400

C401

C402

C403

C404

C405

C406

C407

C408

C410

C411

C412

C413

C414

C415

C420

C423

R402

R405

R406

R409

C432

C433

C434

C435

C436

C437

C438

R410

CR NO.3

TNPA3885

PbF

ORDER NO.

A2A40

A39

B39

B40 B1

26 50

C440

C441

C442

C443

C444

C445

L301

L302

C447

L303

L304

C449

L305

L306

L307

C450

C451

L310

L311

L312

L313

L314

L315

L316

L317

L318

TP301

TP302

TP303

TP304

TP305

JK301

JK302

JK303

JK304

C301

C302

C303

C304

C305

C309

Q307

Q308

C311

C313

C315

C316

D301

D302

D303

D304

D305

R301

D306

R302

R303

R304

R305

R306

R307

R308

IC301

R309

IC302

IC303

C333

IC304

C334

D311

IC306

C337

IC308

C338

C339

IC309

R311

R313

R317

C343

C344

C346

C347

C350

C351

C352

C353

C355

C357

C363

C366

C368

R340

R341

R342

R343

R344

R347

R348

R349

C372

C376 C377

C378

R350

R355

R356

R357

R358

C383

C389

R364

R365

R366

R367 R368 R369

C396

C397

C399

R371

R372

R373

R374

R375

R376

R378R379

R380 R381

R382 R384R385

R386

R389

R390

R397

R399

X301

C409

C416

C417

C418

C419

C421

C422

C424

C425

C426

C427

R400

C428

R401

C429

R403

R404

R407

R408

C430

C431

R411

C439

R412

R413

R414

R417

TNPA3885

CR NO.3

GND

HD VD

R415

R416

PbF

SEE REVERSE FOR ORDER NO.

A1A2B1B2

A39A40B39B40

13 24

45 88

132

133

176

TY-FB9BD

HU-BOARD TXNHU10YHT TY-FB9BD

HU-BOARD TXNHU10YHT

HU-BOARD (FOIL SIDE)

TXNHU10YHT HU-BOARD (COMPONENT SIDE)

TXNHU10YHT

Parts Location

HU-BOARD

IC3301 F-2

IC3302 G-2

IC3303 G-4

IC3304 G-3

IC3305 B-3

IC3306 H-2

IC3307 B-2

IC3308 G-2

IC3309 G-2

Q3301 D-2

Q3302 D-2

Q3303 D-3

Q3304 D-3

Q3305 C-2

Q3306 C-3

Q3307 G-3

Q3308 G-3

TRANSISTOR

TP3301 I-3

TP3302 I-3

TP3303 H-2

TP3304 H-2

TP3305 H-4

TRANSISTORTP

TY-FB9BD

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NOTE

TY-FB9BD

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7 Block and Schematic Diagram

7.1. Schematic Diagram Notes

TY-FB9BD

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7.2. HU-Board Block Diagram

L-G

R-G

1.8V

3.3V

5V_STB

3.3V

HU DUAL VIDEO TERMINAL(BNC/S)

5A2

LEVEL CHANGE

SDA

SCL 6

IC3309

CONFIG ROM

5VOUT VDD

IC3303

AVR 1.8V

Q3302,Q3306

V/Y

(+6db) IN

V/CVB

(+6db)

Q3301,Q3305

CC IN 68

6db

Y IN

VOUT

COUT

YOUT

LV1

RV1

LV2

RV2

LOGIC

SCL

SDA

6db

0db

6db

0db

LOUT

ROUT

JK3301

VIDEO IN

JK3302

AUDIO IN

S-VIDEO IN

JK3304

JK3303

AUDIO IN

164

X3301

27MHz

HD VIDEO DECODER (10bit ADC)

IC3304

SDRAM

IC3305

16M bit

60 RESETX

VCCVOUT

RESET

IC3302

105

106

MPU

I/F

SCL

SDATX

SCL

SDA

IC3306

3,3V 5V

ANALOG FRONT END(MUX/CLAM/AGC)

DOUT(2)

SCL

B12

TXC+

TXC-

TO J13

SDA

B25

B24

B11

B15

B14

TX3+

TX3-

TX2+

TX2-

TX1+

TX1-

TX0+

TX0-

B28

PLUG DETECT

B23

SRQ

FACTORY

FOR

USE

SRQ

SCL

SDA

SCL(5V)

SDA(5V)

A26

A28

Q3304

Q3303

L(0dB)

R(0dB)

S2 DETECT

B36

A22

5V_STB

A21

B21

A19

3.3V

A17

B19

B17

3.3V

SDRAM

I/F

XIN

CLOCK GENE

DOUT(3)

DOUT(4)

DOUT(5)

DOUT(7)

DOUT(6)

DOUT(8)

DOUT(9)

TCLK+

TD+

TC+

TB+

TD-

TA+

TC-

TB-

TA-

TCLK-

IC3307

LVDS TX

TC4

CLK_IN

TC5

VD VD

RCLK0 27MHz

VIDEO

SIGNAL

PROCCESSOR

Synchroni-

zation

Y/C Sepa

Chroma Demo

Noise Reduce

PictureAdjust/

Enhancer

Flame TBC

OUTPUT I/F(FORMATTER/BUFFER)

AV SW

IC3301

ADC

SCL(3.3V)

SDA(3.3V)

TD2

TD3

TB0

TA6

TB2

TB1

TB4

TB3

TY-FB9BD

HU-Board Block Diagram TY-FB9BD

HU-Board Block Diagram

TY-FB9BD

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