Panasonic TY-FB8HM Manuale utente

1 Safety Precautions 2

1.1. General Guidelines 2

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 3

3 About lead free solder (PbF) 4

4 Replacement 5

5 Connection 6

6 Circuit Board Layout 7

6.1. HH-Board 7

7 Block and Schematic Diagram 9

rights reserved. Unauthorized copying and

distribution is a violation of law.

TY-FB8HM

7.1. Schematic Diagram Notes 9

7.2. HH-Board Block Diagram 10

7.3. HH-Board (1 of 2) Schematic Diagram 11

7.4. HH-Board (2 of 2) Schematic Diagram 12

8 Replacement Parts List 13

8.1. Replacement Parts List Notes 13

8.2. Electrical Replacement Parts List 14

8.3. Mechanical Replacement Parts List 17

8.4. Parts Location 18

HDMITerminalBoard

CONTENTS

Page Page

ORDER NO. ITD0507046CE

D10

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1 Safety Precautions

1.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MWand 5.2MW.

When the exposed metal does not have a return path to the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to

the customer.

TY-FB8HM

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2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum

foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

TY-FB8HM

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3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.

In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).

That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.

Caution

· ·

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· ·

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb

solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· ·

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TY-FB8HM

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4 Replacement

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5 Connection

TY-FB8HM

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6 Circuit Board Layout

6.1. HH-Board

ABCDEFGH I

R418

R419

R422

R423

R424

R427

R428

R429

L311

L312

L314

R432

R433

R434

R435

R436

R437

R438

R439

R440

R441

R446

R447

R448

R449

R451

R452

R453

R454

R455

R456

R457

R458

R459

R460

R461

R462

R464

R466

R468

R469

R470

R471

R472

R473

R474

JK301

R475

R476

R477

R478

R479

R480R481R482

R483R484R485

R486R487R488

R489

R490

R491

R492

R493

R494

R495

R496

R497

Q303

C310

C311

C312

C313

C314

C315

Q311

C316

Q312

C317

Q313

C318

Q314

C319

Q315

Q316Q317Q318

SW301

C327

C330

C332

C333

IC304

IC307

IC308

R504

R505

R506

D317

IC310

C340

IC311

IC312

C342

IC314

IC317

C348

IC318

IC319

R517

R518

R327

R329

C351

C352

R524

R526

R332

R527

R333

R528

R334

R529

R335

R336

R337

R338

HQ1

R339

C361

R530

C364

R531

C365

R532

R533 R534

C368

R340

R535

C369

R341

R343

R344

R345

R346

R347

R348

R349

C373

C374

C375

C376

R350

C379

R352

R353

R354

R355

R356

C380

R358

C381

R359

C382

C387

C388

R360

R361

R364

R366

R367

C390

R368

C391

FL301

R369

FL302

C393

FL303

C394

FL304

C395

FL305

C396

FL306FL307

TP2

R372

TP3

R373

TP4

R374

TP5

R375

R376

R377

R378

R379

R380

R381 R386

R387

R391

R392

R393

C400

C401

C406

C407

C408C409C410

C414

C415 C416

C420

R400

C428

R401

C429

R409

C431

C433

R410

R412

R414

R415

R416

R417

CR NO.3

TNPA3677

SLOT

12 3

PbF

ORDER NO.

A40

A39

B39

B40

TY-FB8HM

HH-BOARD TXNHA10ZYS

HH-BOARD (FOIL SIDE)

TXNHA10ZYS

TY-FB8HM

HH-BOARD TXNHA10ZYS

Parts Location

HH-BOARD (FOIL SIDE)

TRANSISTORIC

IC3304 D-4

IC3307 B-4

IC3308 D-1

IC3310 C-3

IC3311 B-2

IC3312 C-1

IC3314 D-2

IC3317 B-2

IC3318 D-3

IC3319 B-4

Q3303 C-4

Q3311 E-5

Q3312 D-4

Q3313 F-2

Q3314 F-2

Q3315 F-2

Q3316 F-1

Q3317 E-1

Q3318 E-1

TP2 E-4

TP3 F-4

TP4 D-2

TP5 D-3

TY-FB8HM

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ABCDEFGH I

L301

L302

L303

L304

L305

L306

L307 L308

L309

L310

L313

R430

R431

L315

L316

L317

R442

R443

R444

R445

R450

R463

R465

R467

JK301

R498

R499

C301

C302

C303

C304

Q301

C305

C306

Q302

C307

Q304

C308

C309

Q305

Q306

Q307

Q308

Q309

Q310

SW301

C320

C321

C322

C323 C324

D301

C325

D302

C326

D303

D304

C328

R301

D305

D306

R302

D307

R303

D308

R304

D309

R305

R306

R307

R308

IC301

C331

R309

IC302

IC303

D310

C334

R500

IC305

D311

C335

R501

D312

C336

IC306

R502

D313

R503

D314

R310

C338

IC309

D315

R311

D316

R312

R313

R507

R314

D318

R508

R315

D319

R509

R316

R318

R319

C341

IC313

C343

D320

R510

C344

D321

IC315

R511

C345

IC316

C346

R512

C347

R513

R320

R514

R321

C349

R515

R322

R516

R323

R324

R325

R519

R326

R328

C350

C353

R520

C354

C355

R521

C356

R522

C357

R523

R330

C358

R331

R525

C359

C360

HQ1

HQ2

C362

HQ3

C363

C366

C367

R342

C370

C371

C372

C377

C378

R351

R357

C383

C384

C385

C386

C389

R362

R363

R365

C392

C397

C398

R370

C399

R371

TP1

TP6

R382

R383

R384

R385

R388

R389

R390

R394

R395

R396

R397

R398

R399

X301

C402

C403

C404

C405

ZA301ZA302

ZA303

ZA304

C411 C412C413

C417

C418

C419

C421

C422

C423

C424

C425

C426

C427

R402

R403

R404

R405

R407

R408

C430

C432

R413

TNPA3677

CR NO.3

THERMAL

PAD

OFF

PbF

SEE REVERSE FOR ORDER NO.

125

100

22 42

6484

B1 B2

A39

A40

B39 B40

NP NP

TY-FB8HM

HH-BOARD TXNHA10ZYS

HH-BOARD (COMPONENT SIDE)

TXNHA10ZYS

TY-FB8HM

HH-BOARD TXNHA10ZYS

Parts Location

HH-BOARD (COMPONENT SIDE)

TRANSISTORIC

IC3301 C-6

IC3302 A-5

IC3303 B-4

IC3305 C-4

IC3306 E-4

IC3309 D-5

IC3313 D-6

IC3315 F-2

IC3316 F-1

Q3301 E-3

Q3302 E-3

Q3304 C-5

Q3305 C-4

Q3306 D-4

Q3307 C-4

Q3308 C-5

Q3309 D-5

Q3310 D-4

TP1 B-5

TP6 B-4

TY-FB8HM

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7 Block and Schematic Diagram

7.1. Schematic Diagram Notes

TY-FB8HM

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7.2. HH-Board Block Diagram

AUD_L

AUD_R

D_FA

D_SCL

D_SDA

H_SCL

H_SDA

K_B

J_G

J_B

J_R

G_SCL

G_SDA

G_SRQ

B_SDA

B_SCL

K_R

K_G

K_B

D_FA

D_SCL

D_SDA

B_SCL

B_SDA

K_R

C_SCL

C_SDA

C_WP

H_SDA G_SDA

G_SCL

C_WP

5V_STB

3.3V

H_SCL

H_SDA

G_SRQ

C_SCL

C_SDA

H_SCL

K_G

J_R

J_B

J_G

E_SCL

E_SDA

H_SCL

H_SDA

Q3312

Q3316

Q3313

Q3311

Q3318

Q3315

Q3317

Q3309

Q3308

Q3314

Q3301

Q3310

A19

A28

B21

B19

B25

A22

A26

B17

B15

A21

A17

B14

B24

B11

B12

A34

A36

A38

B23

5V_PLUG

Q3302

B39

HDMI RESET

CONFIG ROM

for HP mode

SCL

DDC EEPROM

IC3302

SDA

RESET

IC3304

VOUT

HQ2

D-SDA

D-SCL

D-FA

SDA

SCL

IC3312

EX. I/O

IC3311

SDA

Hot plug

Q3304,Q3305

Q3306,Q3307

AUDIO MUTE CIRCUIT

DV_S_MUTE

3.3V

G-SDA

TX1-

TX2-

3.3V

5V_STB

TXC-

HQ1

TX3+

TX3-

TX0-

TXC+

G-SCL

TX1+

TX0+

TX2+

J_R

J_B

J_G

G-SRQ

TX3-

TXC+

TX0-

TTL PARALLELTO LYDS

TX2-

CLK IN

CLOCK

R07

TX1-

TX2+

R00

PLL

TXC-

TX1+

G00

TX0+

18 B00

B07

IC3310

TX3+

G07

LVDS TRANSMITTER

DATA(LVDS)

PWRDWN

R07

BLOCK

RESET#

SLAVE

CONTROL

SIGNALS

HDCP

KEYS

IC3305

CONTROL

SIGNALS

HDMI I/F RECEIVER

DECODE

AUX DATA

LOGIC

G00

DATA

AUDI O

BLOCK

G07

CONTROL

MODE

EEPROM

MASK

XOR

LOGIC

CORE

DIGITAL

TMDS

PANEL LINK

SAMPLING

ODCK

VSYNC

DECRYPTION

VIDEO

B00

B07

SPACE

HDCP

62 61

COLOR 8

HSYNC

SDO

ENGINE

REGISTERS

CONFIGURATION

---------

UP/DOWN

SCK

MCLKIN

CONVERTER

MCLK

CSCL

CSDA

INT

CLK-

LOGIC BLOCK

IIC

GEN

R00

SLAVE

MLCK

IIC

AnRPr

AnGY

AnBPb

D0G

D1-

CLK+

CLKG

N.C.

DDCG

D2+

D2-

HPDT

D0+

CLK-

DDC DATA

D1G

+5V

SCL

D1+

D0-

D2G

CEC

D-SDA

MICON

D-SCL

E-SCL

E-SDA

B-SDA

B-SCL

HDMI_INT

HDMI_RST

DV_S_MUTE

D_FA

IC3306

MODE INPUT

LVDS PD#

SCL

SDA

IC3303

A=3.3V, B=5V

EX. I/O

SCL

IC3308

SW0

AUDIO MUTE

DAC4

SDA

DAC1

SW1

SW2

SW3

DSDA

H_SDA

C-SDA

C-SCL

H_SCL

G-SRQ

HQ3

SCL

C_WP

IC3315

SCL

SDA

SCL

IC3316

SDA

SCL

IC3314

CABLE OUT -> Low : Mute

CABLE IN -> Hi : Norm

Hi : MUTE

Audio Mute when cable is not connected

IC3318

VIDEO AMP

IC3313

AOUT R

AUDIO AMP L

IC3301

MCLK

SMUTE/CSN

AUDIO AMP R

D/A

BICK

LRCK

SDTI

AOUT L

IC3309

AUDIO DAC

PDN

JK3301

J-BOARD

detect control

OUT

(LVDS)

DDC EEPROM

CONFING ROM,

FOR

LOADER

MICON

FOR

HDMI

INPUT

A=PANEL, B=BOARD

CONFIG ROM

for HP mode

SCL

/OE1

INVERTER

IC3317

SW3301

MODE SW

INVERTER

IC3319

/OE2

/0E2

TY-FB8HM HH-Board Block Diagram TY-FB8HM HH-Board Block Diagram

TY-FB8HM

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