Texas Instruments LMR36506MSCEVM Manuale utente

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

User's Guide

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

The Texas Instruments LMR36506MSCEVM evaluation module help designers evaluate the operation and

performance of the LMR36506-Q1 wide-input buck converters. The LMR36506-Q1 is an easy-to-use

synchronous step-down DC/DC converter capable of driving up to 0.6 A of load current from an input

voltage of up to 65 V. The LMR36506MSCEVM features an output voltage of 5 V and a switching

frequency of 2.2 MHz. See the LMR36506-Q1 3-V–65-V, 0.6-A Synchronous Buck Converter Optimized

for Size and Light Load Efficiency data sheet for additional features, detailed descriptions, and available

options.

Table 1. Device and Package Configurations

EVM U1 FREQUENCY SPREAD SPECTRUM CURRENT PIN 1 TRIM

LMR36506MSCEVM LMR36506MSCQRPETQ1 2200 kHz Enabled 0.6 A MODE/SYNC

Figure 1. LMR36506MSCEVM Board

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LMR36506MSCEVM User’s Guide

Contents

1 Setup .......................................................................................................................... 3

2 Operation ..................................................................................................................... 5

3 Schematic..................................................................................................................... 6

4 Board Layout ................................................................................................................. 7

5 Bill of Materials ............................................................................................................. 10

6 Test Results ................................................................................................................ 11

List of Figures

1 LMR36506MSCEVM Board ................................................................................................ 1

2 EVM Board Connections.................................................................................................... 3

3 Jumper Locations............................................................................................................ 4

4 LMR36506MSCEVM Schematic........................................................................................... 6

5 Top View of EVM ............................................................................................................ 7

6 EVM Top Copper Layer..................................................................................................... 7

7 EVM Mid Layer One......................................................................................................... 8

8 EVM Mid Layer Two......................................................................................................... 8

9 EVM Bottom Copper Layer................................................................................................. 9

10 LMR36506MSCEVM 5 VOUT Efficiency .................................................................................. 11

11 LMR36506MSCEVM 5 VOUT Load Regulation.......................................................................... 11

12 LMR36506MSCEVM Load Transient 12 VIN, 5 VOUT, IOUT = 0.3 A to 0.6 A, TR= TF= 1 µs CH1 = VOUT,

CH4 = IOUT................................................................................................................. 11

13 LMR36506MSCEVM Output Ripple 12 VIN, 5 VOUT, IOUT = 0 A........................................................ 11

14 LMR36506MSCEVM 5 VOUT Thermal Capture, 12 VIN, 0.6 A Load, 2.2 MHz ...................................... 12

15 LMR36506MSCEVM 5 VOUT Thermal Capture, 24 VIN, 0.6 A Load, 2.2 MHz ...................................... 12

16 LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and

Yellow-Peak) ............................................................................................................... 12

17 LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and

Yellow-Peak)................................................................................................................ 12

List of Tables

1 Device and Package Configurations ...................................................................................... 1

2 Bill of Materials ............................................................................................................. 10

Trademarks

All trademarks are the property of their respective owners.

Load

(+)

(-)

Input

Supply (-)

(+)

DMM

(-)

(+)

DMM

(-)

(+)

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Setup

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

1 Setup

This section describes the test points and connectors on the EVM and how to properly connect, set up,

and use the LMR36506MSCEVM.

1.1 Test Points

The test points on the top of the board can be used for connecting to the input and output of the EVM.

See Figure 2 for typical test setup. The functions of the test points connections are:

•VIN_EMI — Input supply to EVM including an EMI filter. Connect to a suitable input supply. Connect at

this point for conducted EMI test.

•GND_EMI — Ground connection for the input supply

•VIN — Input supply to the IC. Can be connected to DMM to measure input voltage after EMI filter

•VOUT — Output voltage test point of EVM. Can be connected to a desired load

•GND — Ground test points

•EN — This test point is connected to the EN pin. By default, there is a pullup resistor R2 (RENT) to

VIN to enable the IC.

•PGOOD — This test point is connected to the PGOOD pin from the IC. It is an open-drain output of the

PGOOD pin. Can be tied to external supply through a pullup resistor or left open

•SYNC — In a MODE/SYNC trim part, this test point is connected to the SYNC pin of the IC. Can be

connected to an external clock to synchronize the IC. Make sure R4 (RMODE) is installed and R5 (RT)

is not installed. In a RT trim part, this test point is connected to the RT pin of the IC when the R4

(RMODE) is installed.

Figure 2. EVM Board Connections

MODE SELECTION

JUMPER

ENABLE OFF

JUMPER

PGOOD SELECTION

JUMPER

Setup

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1.2 Jumpers

See Figure 3 for jumper locations.

•JEN - This jumper allows the ENABLE input to be connected to GND in order to disable the IC. By

default, this jumper is left open since there is a pullup resistor R2 (RENT) to VIN to enable the IC.

•JPGOOD - Use this jumper to select how the PGOOD pin can be connected. A jumper can be used to

connect pin 2 and 3. In this configuration, the PGOOD pin will be pulled up to VOUT through R9

(RPGOOD) with a value of 100 kΩ. By default, this jumper is left open.

•JMODE/RT - Use this jumper to select the mode of operation in a MODE/SYNC trim part.

Connecting a jumper between pin 1 and 2 cause the IC to operate in PFM (Pulse Frequency

Modulation) mode for a higher efficiency at light load. A jumper between pin 2 and pin 3 causes the IC

to operate in FPWM mode (Forced Pulse Width Modulation) mode. By default, the jumper is connected

between pin 1 and 2.

In an RT trim part, connecting this jumper from pin 1 and 2 sets the switching frequency to 2.2 MHz

and connecting this jumper from pin 2 and 3 sets the switching frequency to 1 MHz. See the

LMR36506-Q1 3-V–65-V, 0.6-A Synchronous Buck Converter Optimized for Size and Light Load

Efficiency data sheet for more information on switching frequency configuration.

Figure 3. Jumper Locations

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Operation

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

2 Operation

2.1 Quick Start

1. Connect the voltage supply between the VIN_EMI and GND_EMI test points.

2. Connect the load between the VOUT and GND test points.

3. Set the supply voltage at an appropriate level between 5.5 V to 65 V. Set the current limit of the supply

to an appropriate level.

4. Turn on the power supply. With the default configuration, the EVM powers up and provides VOUT = 5 V.

5. Monitor the output voltage. The maximum load current must be 0.6 A with the LMR36506 device.

0.1uF

CIN2

0.1uF

1uF

CVCC

PGOOD

TP3

GND

49.9

RINJ

TP8

GND

1uF

4.99

0.1uF

Cfilt

DNP

TP6

VIN_EMI

TP7

GND_EMI

22uF

CBulk

JMODE/RT

JPGOOD

100k

RPGOOD

PGOOD

ENVCC

GND

VOUT

GND

BOOT

GND

DNP

VCC

GND

VIN

TP4

VOUT

TP1

VOUT

TP5

VIN

JEN

100k

RENB

DNP

100k

RENT

TP10

SYNC

TP11

TP9

PGOOD

TP2

GND

VIN = 5.5V - 65V

2.2uF

CIN1

2.2uF

CIN3

0.1uF

C11

Cfilt1

0.1uF

C12

Cfilt2

VINF

100k

RFBT

24.9k

RFBB

MODE/SYNC

PGOOD

EN/UVLO

VIN

SW 5

BOOT 6

VCC

FB 8

GND 9

LMR36506MSCQRPETQ1

GND

22uF

COUT1

22uF

C10

COUT2

DNP

10pF

C13

CFF

DNP

RMODE

VOUT = 5V

6.8µH

1nF

C14

COUTHF

Schematic

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3 Schematic

Figure 4. LMR36506MSCEVM Schematic

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Board Layout

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

4 Board Layout

Figure 5. Top View of EVM

Figure 6. EVM Top Copper Layer

Board Layout

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LMR36506MSCEVM User’s Guide

Figure 7. EVM Mid Layer One

Figure 8. EVM Mid Layer Two

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Board Layout

SNVU670A–February 2020–Revised June 2020

LMR36506MSCEVM User’s Guide

Figure 9. EVM Bottom Copper Layer

Bill of Materials

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5 Bill of Materials

Table 2. Bill of Materials

DESIGNATOR COMMENT DESCRIPTION MANUFACTURER PART NUMBER QUANTITY

C1, C9 CIN1, CIN3 CAP, CERM, 2.2 uF, 100 V, +/- 10%, X7S, AEC-

Q200 Grade 1, 1206 TDK CGA5L3X7S2A225K160AB 2

C2 CIN2 CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, 0603 MuRata GRM188R72A104KA35D 1

C3 CB CAP, CERM, 0.1 uF, 25 V, +/- 20%, X7R, 0402 TDK C1005X7R1E104M050BB 1

C4 CVCC CAP, CERM, 1 uF, 16 V, +/- 10%, X7R, 0603 Wurth Elektronik 885012206052 1

C5 COUT1 CAP, CERM, 22 uF, 10 V, +/- 10%, X7R, AEC-Q200

Grade 1, 1206 MuRata GCM31CR71A226KE02 1

C6 Cd CAP, CERM, 1 uF, 100 V, +/- 10%, X7R, 1206 TDK C3216X7R2A105K160AA 1

C7 Cfilt CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, AEC-

Q200 Grade 1, 0805 TDK CGA4J2X7R2A104K125AA 0

C8 CBulk CAP, AL, 22 uF, 100 V, +/- 20%, 1.3 ohm, AEC-Q200

Grade 2, SMD Panasonic EEE-FK2A220P 1

C10 COUT2 CAP, CERM, 22 uF, 10 V, +/- 10%, X7R, AEC-Q200

Grade 1, 1206 MuRata GCM31CR71A226KE02 0

C11, C12 Cfilt1, Cfilt2 CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, AEC-

Q200 Grade 1, 0805 TDK CGA4J2X7R2A104K125AA 2

C13 CFF CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0, AEC-

Q200 Grade 1, 0402 TDK CGA2B2C0G1H100D050BA 0

C14 COUTHF CAP, CERM, 1000 pF, 100 V, +/- 10%, X7R, 0603 MuRata GRM188R72A102KA01D 1

FID1, FID2,

FID3, FID4,

FID5, FID6 Fiducial Fiducial mark. There is nothing to buy or mount. N/A N/A 0

J1, J2 JPGOOD,

JMODE/RT Header, 100mil, 3x1, Gold, TH Samtec HTSW-103-07-G-S 2

J3 JEN Header, 100mil, 2x1, Gold, TH Samtec HTSW-102-07-G-S 1

L1 74438336068 FIXED IND 6.8UH 1.6A 193 MOHM Wurth Electronics 74438336068 1

L3 FBMH3225HM601N

TFerrite Bead, 600 ohm @ 100 MHz, 3 A, 1210 Taiyo Yuden FBMH3225HM601NT 1

R1 RENB RES, 100 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW0402100KFKED 0

R2, R3 RENT, RFBT RES, 100 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW0402100KFKED 2

R4 RMODE RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW06030000Z0EA 1

R5 RT RES, 0, 0%, 0.2 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW04020000Z0EDHP 0

R6 RINJ RES, 49.9, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW040249R9FKED 1

R7 RFBB RES, 24.9 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW040224K9FKED 1

R8 Rd RES, 4.99, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW06034R99FKEA 1

R9 RPGOOD RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW0603100KFKEA 1

SH-J1 SNT-100-BK-G Shunt, 100mil, Gold plated, Black Samtec SNT-100-BK-G 1

TP1, TP5 VOUT, VIN Test Point, Miniature, SMT Keystone 5015 2

TP2 GND Test Point, Miniature, Black, TH Keystone 5001 1

TP3, TP4, TP6,

TP7, TP8 GND, VOUT,

VIN_EMI, GND_EMI Terminal, Turret, TH, Double Keystone 1502-2 5

TP9, TP10,

TP11 PGOOD, SYNC, EN Test Point, Miniature, White, TH Keystone 5002 3

U1 LMR36506MSCQR

PETQ1 LMR36503/06-Q1 Wide Input 60-V Synchronous, DC-

DC Buck Converter, RPE0009A (VQFN-9) Texas Instruments LMR36506MSCQRPETQ1 1

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