Texas Instruments TIDA-050038 Guida

LP873347

BUCK0 (3A)

BUCK1 (3A)

LDO0 (300mA)

LDO1 (300mA)

0.85 V

1.1 V

1.8 V

1.8V

1.2 V

3.3 V

0.9 V

1.8 V

MIPI CSI/DSI

i.MX 8M Mini, Nano

VDD_ARM

VDD_SOC, VDD_ANA_0P8, VDD_ARM_PLL_0P8,

VDD_USB_0P8, VDD_PCI_0P8

NVCC_DRAM

NVCC_SNVS_1P8

NVCC_xxx (1.8 V)

VDD_MIPI_1P2

NVCC_xxx (3.3 V)

VDD_MIPI_0P9

0.85 / 0.9 / 0.95 V

0.85 / 0.95 / 1.0 V

TPS6521825

2.8 V to 5.5 V

DCDC1 (1.8A)

DCDC2 (1.8A)

DCDC3 (1.8A)

LDO1 (400mA)

IN_BIAS

IN_DCDCx

IN_LDO

DCDC4 (1.6A)

Regulators

DCDC5 (25mA)

DCDC6 (25mA)

Backup (BU) Domain

IN_BU

Load Switches 1-3

LS2

IN_LS2

LS3

IN_LS3

NOTE: DCDC5/6 are high-efficiency bucks for RTC

VDD_VPU, VDD_DRAM, VDD_GPU,

VDD_DRAM_PLL_0P8

NVDD_ANAx_1P8, VDD_24M_XTAL_1P8,

VDD_DRAM_PLL_1P8, VDD_ARM_PLL_1P8,

VDD_USB_1P8, VDD_PCI_1P8,

VDD_MIPI_1P8

3.3V (DCDC3)

0.8 V VDD_SNVS_0P8

5 V *VDD_VPU not included in Nano

connectors

TIDUEV8A–December 2019–Revised February 2020

Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

Design Guide: TIDA-050038

Integrated Power Supply Reference Design for NXP i.MX

8M Mini Processor

Description

TIDA-050038 is a system-on-module (SoM)

development board integrating two TI PMICs,

TPS6521825 and LP873347, with the NXP™ i.MX 8M

Mini Application Processor. The hardware design also

includes LPDDR4 SDRAM (2GB, x32-bit), QSPI NOR-

Flash (32MB), 16GB eMMC 5.1, 32-kHz RTC

oscillator, WiFi + Bluetooth module, and 9-channel

current monitoring. The SoM board is compatible with

the 8MMiniLPD4-EVK base board for full system

evaluation. This design is intended for any project that

is using the i.MX 8M Mini or i.MX 8M Nano processor

and requires evaluation of alternate power solutions.

Resources

TIDA-050038 Design Folder

TPS6521825 Product Folder

LP873347 Product Folder

INA3221 Product Folder

Search Our E2E™ support forums

Features

• SoM for rapid development of NXP i.MX8M Mini

systems

• Low-power modes and DVFS supported

• 9-channel current monitoring for DC-DCs and

LDOs

• Wi-Fi®+ Bluetooth®wireless connectivity

• Display connector (DSI), Camera connector (CSI),

additional peripherals on compatible base-board

• Selectable boot options (SD, eMMC, QSPI)

Applications

•ARM-based SoM/CoM

•Intrusion control panel

•Barcode scanner

•HVAC gateway

•Thermostat

•Building security gateway

•Panel PLC (HMI)

Order from RadiumBoards.

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other

important disclaimers and information.

System Description

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2TIDUEV8A–December 2019–Revised February 2020

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Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

1 System Description

TIDA-050038 is first-and-foremost a reference design for powering the NXP i.MX 8M Mini processor from

the TPS6521825 and LP873347 PMICs. In order to show that the PMICs can power the processor, it

made the most sense to build a SoM board that is compatible with the existing base-board (8MMiniLPD4-

EVK), which includes a variety of peripheral connections to assist with development of various end

equipments. As a result, the base board contains all the large connectors for wired communication, a slot

for an SD Card containing the software image, as well as DIP switches for multiple BOOT options. The

SoM board, on the other hand, contains all the on-board memory and module for wireless communication.

Finally, to ensure the entire board is operational, we developed and tested software using the open-source

embedded Linux Yocto SDK to get started testing this design.

1.1 Key System Specifications

Table 1. Key System Specifications

PARAMETER SPECIFICATIONS DETAILS

Processor i.MX 8M Mini Dual-Core Applications Processor, MIMX8MM6DVTLZAA Section 2.2.1

PMICs

TPS6521825 PMIC for powering RTC (SNVS) domain with GPIOs to enable

external ICs, EEPROM pre-programmed with correct automatic sequencing for

i.MX 8M Mini & DVFS controlled by I2CSection 2.3.1

LP873347PMIC for delivering up to 3 A for core rails of i.MX 8M Mini processor,

OTP pre-programmed with correct sequencing for i.MX 8M Mini & DVFS

controlled by I2CSection 2.3.2

Memory 2GB x32-bit LPDDR4, 512Mb QSPI NOR-Flash (64MB), 8GB eMMC 5.0, SD

v3.0 interface Section 2.2.2

Wifi + Bluetooth Support WiFi + Bluetooth with Murata device. WiFi must support 802.11ac

standard and package size must fit in allotted board area. Section 2.2.3

Current Monitoring 3x TI INA3221 devices are used to monitor current through 9 rails in the system

(all DC-DCs and LDOs providing >100-mA of current) Section 2.3.3

USB2ANY header Debug method for PMIC separate from processor provided by USB2ANY

(standard 100-mil pitch, 10-pin header). Must be outside of 2" x 2" square and

capable of being detached from PCB. Section 2.2.5

Manufacturability The PCB must be completed without HDI (high-density interconnect)

manufacturing technologies. For example, via hole size ≥8 mil and no via-in-

pad allowed. Section 2.4

Compatibility Must be compatible with 8MMiniLPD4-EVK, using same high-density

connectors from SoM board to base-board Section 2.2.4

Size Main PCB (excluding USB2ANY header) must be same size as original

8MMiniLPD4-EVK SoM board, 2" x 2" Section 2.4.1

ESD Protection

ESD9L5.0ST5G

Boot Mode

Select

(2x 10POS)

ON/OFF

Switch

32K RTC

Oscillator

Ethernet PHY

AR8031

USB Debug

FT2232D

ESD Protection

ESD5B5.0ST1G

DAC

WM8524CGEDT

PCIe 2 (M.2)

eMMC 16GB

SDINBDG4-16G-I1

NOR Flash 32 MB

MT25QU256ABA1EW7

LPDDR4 x32 2GB

MT53D512M32D2DS-053

USB

Debug Port

Micro-B

Audio Card

(8-channel)

Expansion

Connector

I2C

Connector

PMIC

LP873347

Current &

Voltage

Monitoring

INA3221

To Processor I2C

i.MX 8M Mini

Applications

Processor

ARM CORTEX 4x A53 + M4

Power IN

WiFi + Bluetooth

LBEE5HY1MW

MIPI CSI

MINI SAS

RGMII

ON-OFF I/P

RESET I/P

RTC_XTALI

BOOT

MODE I/P

SDIO, UART

MIPI CSI

SDIO

JTAG

I2S

PCIe x 1

MMC 5.0

QSPI

LPDDR4 x32 2GB

UART

GPIO,

UART

I2C

USB2.x

Reset

Switch

GPIO,

SAI, I2C

MIPI DSI

MINI SAS

Micro-SD

Card SLot

USB OTG

TYPE-C JTAG

MIPI DSI

PMIC

TPS6521825

USB2.0

2 x USB2.0 A

SISO

ESD Protection

ESD5B5.0ST1G

On SOM Board

LEGEND:

www.ti.com

System Overview

TIDUEV8A–December 2019–Revised February 2020

Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

2 System Overview

2.1 Block Diagram

Figure 1. TIDA-050038 Block Diagram

System Overview

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4TIDUEV8A–December 2019–Revised February 2020

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Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

2.2 Design Considerations

This design is intended to show the ability of the TI power devices to provide power to the i.MX 8M Mini

processor and all of the peripheral ICs in a variety of designs. In order to verify this, we had to populate all

of these other ICs on the design, starting with the processor. All other devices necessary to build an

operational evaluation kit are included in this section. The power devices and other TI devices used in this

design are described in Section 2.3.

2.2.1 Processor - i.MX 8M Mini Applications Processor

The i.MX 8M Mini applications processor is a processor from NXP and is their first embedded multi-core

applications processor built using advanced 14LPC FinFET process technology providing more speed and

improved power efficiency. This processor specializes in optimized low power consuming state-of-the-art

media-specific features like high performance audio and video processing. The i.MX 8M Mini family of

processor features of five cores (Quad Arm® Cortex®-A53 core operating up to 1.8GHz and one Cortex®-

M4 core operating at 400MHz). It supports 32-bit/16bit LPDDR4 and DDR3L memory. This processor has

number of other interfaces like Ethernet, MIPI CSI, MIPI DSI, PCIe and also supports audio interfaces

such as I2S, AC97, TDM and S/PDIF. A detailed table listing the mapping for each pin on the iMX8MM

processor can be found in Appendix A.

DESCRIPTION MFG. PART NUMBER

IC, i.MX 8M Mini series , Quad ARM

Cortex-A53 core NXP MIMX8MM6DVTLZAA

2.2.2 i.MX 8M Mini Memory Interfaces

This project makes use of i.MX 8MM processor’s four different external memory interfaces using LPDDR4

SDRAM (2GB), 256Mb QSPI NOR-Flash (32MB), 16GB eMMC 5.1, and SD v3.0 (connector on base-

board).

2.2.2.1 LPDDR4

i.MX 8M Mini has a dedicated DDR memory controller which supports DDR3L, DDR4, and LPDDR4.

Memory speeds supported are LPDDR4 up to 1.5GHz, DDR4-2400 and DDR3L-1600. This design is

provided with two 2GB x32 LPDDR4 memory. Micron’s, MT53D512M32D2DS-053 WT:D is a 16Gb

LPDDR4 SDRAM (two die per package), currently used in this design. The memory interface comprises of

two channel of 16-bit data signals, along with separate command and address for each die.

DESCRIPTION MFG. PART NUMBER

IC, LPDDR4 SDRAM, 2GB, x32bit,

1866MHz, WFBGA-200 Micron MT53D512M32D2DS-053 WT:D

i.MX 8M Mini

DRAM_DQ[00-15]

DRAM_DM[0-1]

DRAM_DQS[0-1]_P/N

DRAM_AC04/05

DRAM_AC00

DRAM_AC02

DRAM_AC[08-13]

DRAM_DQ[16-31]

DRAM_DM[2-3]

DRAM_DQS[2-3]_P/N

DRAM_AC24/25

DRAM_AC20

DRAM_AC23

DRAM_AC[28-33]

RESET_n

MT53D512M32D2D

DQ[00-15]_B

DM[0-1]_B

DQS[0-1]_T/C_B

CK_T/C_B

CKE0_B

CS0_B

CA[0-5]_B

DQ[00-15]_A

DM[0-1]_A

DQS[0-1]_T/C_A

CK_T/C_A

CKE0_A

CS0_A

CA[0-5]_A

RESET_N

NVCC_DRAM VDD_DRAM

1V1 0V9

VDD1 VDD2 VDDQ

1V8 1V1 1V1

240E, 1%

1V1

ZQ0

VSS VSS

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System Overview

TIDUEV8A–December 2019–Revised February 2020

Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

Figure 2. LPDDR4 Interface

2.2.2.2 Quad SPI NOR Flash

i.MX 8M Mini processor supports Serial NOR Flash interface (QSPI). This project will support one Serial

NOR Flash. Micron’s, MT25QU256ABA1EW7-0SIT is a Serial NOR Flash Memory with a density 256Mb

(32MB) at clock frequency 133MHz and data through-put up to 90MB/s.

DESCRIPTION MFG. PART NUMBER

IC, NOR Flash, 32MB, 133MHz, SPI, 1.7-

2V, W-PDFN-8 Micron MT25QU256ABA1EW7-0SIT

2.2.2.3 eMMC iNAND

For this design an 8GB eMMC 5.1 compliant Memory is included. The interface diagram of eMMC with

processor is shown in . The part used here is a from Micron, P/N: MTFC8GAKAJCN- 4M IT. It supports

HS400 which is High Speed Mode supporting 400MBps @ 200MHz Dual Data Rate Bus.

SDINBDG4-16G-I1

DAT[0-7]

CLK

CMD

VSS

VCC VCCQ

3V3 1V8

i.MX 8M Mini

SD3_DATA[0-7]

SD3 CLK

SD3_STROBE

1V8

RCLK

SD3 CMD

VSS

NVCC_NAND

System Overview

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6TIDUEV8A–December 2019–Revised February 2020

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Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

For this design an 16GB eMMC 5.1 compliant Memory is included. The interface diagram of eMMC with

processor is shown in Figure 3. The part used here is from Western Digital, SDINBDG4-16G-I1. It

supports HS400 which is High Speed Mode supporting 400MBps at 200-MHz Dual Data Rate Bus with 8-

bit bus width.

DESCRIPTION MFG. PART NUMBER

IC, eMMC 16GB iNAND 7250 eMMC 5.1 Western Digital SDINBDG4-16G-I1

Figure 3. eMMC interface

2.2.2.4 Power for SD Card (connector on base-board)

In this design, there is an SD card connector on the base-board but the power supply for the SD card is

on the TIDA-050038 SoM board. The power supply to the SD Card is selectable between 1.8 V and 3.3 V

using a power multiplexer (mux), and both input voltages to the mux are provided by the TPS6521825

PMIC. The initial voltage applied to the VDD pin of the SD Card connector must always be 3.3 V and may

be lowered to 1.8 V after the SD Card confirms the allowed operating voltages. The power circuit for the

SD Card connector are shown in Figure 4.

DESCRIPTION MFG. PART NUMBER

IC, Power Switch P-Channel 2:1,

6WLCSP ON Semiconductor FPF1321UCX

VDD_3V3

TPS6521825

i.MX 8M Mini

SD2_DATA[0-3]

SD2_CLK

SD2_CD_B

SD2_WP

SD2_CMD

VDD_SD2

SD Card Voltage Mux

FPF1321

GPIO1_IO04

VINA

VINB

VOUT

VDD_1V8

VDD_SD2

SEL

to B2B connector

DCDC4

DCDC3

NVCC_SD2

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System Overview

TIDUEV8A–December 2019–Revised February 2020

Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

Figure 4. SD Card Power

2.2.3 WiFi + Bluetooth Module

This design makes use of Murata’s WiFi + Bluetooth Module, the LBEE5HY1MW device. The interface

with the processor is through UART for Bluetooth and SDIO for WLAN (WiFi). The design provides a

coaxial connection for connection to the antenna, which is on the 8MMiniLPD4-EVK base-board.

DESCRIPTION MFG. PART NUMBER

Module, WiFi-Bluetooth, 802.11a/b/g/n/ac

2.4GHz/5GHz, BLE 5.0, Shielded, Type

1MW

Murata LBEE5HY1MW-230

2.2.4 High-Density Connectors

The connections between the TIDA-050034 SoM board and 8MMiniLPD4-EVK base-board are pre-defined

and there are no deviations possible from the electrical and mechanical specifications.

The interfaces contained on the base-board are as follows:

• SD Card connector

• Audio CODEC IC and connectors

• Ethernet PHY and connector

• USB-to-UART IC and connector

• USB Type-C connectors for main power supply and data transmission

• MIPI DSI connector

• MIPI CSI connector

• mini-PCI Express connector

• JTAG header

PMIC

LP873347

GPIO

SPI:MISO

GPIO

SPI:CS

SPI:MOSI

SPI:SCLK

SCL

SDA

I2C1:SCL

I2C1:SDA

2 1

10-Pin USB2ANY Connector

PMIC

TPS6521825

SCL

SDA

System Overview

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8TIDUEV8A–December 2019–Revised February 2020

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Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

2.2.5 USB2ANY Header

USB2ANY is TI MCU-based adaptor intended to allow a computer to control an electronic evaluation

module (EVM) via a USB connection. In this design, the I2C interface of USB2ANY is used to externally

monitor, control, and/or re-program the internal registers of PMIC. The wiring of the USB2ANY header is

shown in Figure 5.

DESCRIPTION MFG. PART NUMBER

Connector, Berg strip, 2x5, 2.54mm, 3A,

RA, TH FCI 68021-210HLF

Figure 5. USB2ANY Header Connections to PMIC I2C pins

2.3 Highlighted Products

2.3.1 TPS6521825 - Power Management IC

The TPS6521825 device is a Power Management IC (PMIC) specifically designed to support Arm Cortex

processors like the i.MX 8M Mini from NXP. The PMIC is a good fit for applications powered from a 5-V

supply or a Li-Ion battery. The IC consists of three adjustable step-down (buck) converters, one buck-

boost converter, one adjustable LDO and three load switches with two selectable current limit. The PMIC

supports undervoltage lockout (UVLO), over-temperature warning and shutdown, separate power-good

output for all regulators, programmable power sequencing for all regulators, and an I2C interface for

For this project, PMIC powers NXP’s i.MX 8M Mini Processor, providing VDD_SNVS (0V8) and

NVCC_SNVS (1V8) from DCDC5 and DCDC6 respectively. It also provides VDD_SOC (0V85/0V9)

through DCDC1, NVCC_DRAM (1V1) through DCDC2 and voltages such as 3.3V, 1.8V digital, 1V8

Analog and 2V5 are also generated from this PMIC. The voltage 5V0 is send through load switches LS2

and LS3 to peripherals. However, 3V3 for PCIe, MIPI CSI, and MIPI DSI is powered through an external

buck converter located on the base-board. The power architecture and estimation can be viewed in

Section.5.3 and Section.5.1. The full power architecture of this design is shown in Figure 7.

The control pins of the TPS6521825 PMIC are shown connected to the processor in Figure 6, as well as

analog and digital input pins on the PMIC.

TPS6521825

SCL

SDA

nINIT

PFO

PWR_EN

PGOOD

i.MX 8M Mini

I2C1:SCL

I2C1:SDA

GPIO4_IO22

GPIO4_IO20

PWR_ON_REQ

POR_B

5 V

PFI

5 V

RTC_RESET_VB

RTC_XTALI

GPIO1

LP873347_PG

PGOOD_BU/

GPIO3

DC34_SEL

GND

0 Ÿ

DNI*

5 V

To Processor

GPIO

LP873347 ENABLE

LP873347

SCL

SDA

nINIT

PGOOD

i.MX 8M Mini

I2C1:SCL

I2C1:SDA

GPIO

LP873347 ENABLE

LP873347_PG

*DNI ±Do not install

AC_DET

0 Ÿ

23.2 NŸ

0 Ÿ

100 NŸ

DNI*

100 NŸ

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System Overview

TIDUEV8A–December 2019–Revised February 2020

Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

Figure 6. TPS6521825 PMIC I/O Wiring to i.MX 8M Mini Processor

NOTE: PGOOD of both PMICs will be shorted together which creates a “wire-AND” connection due

to open drain topology (as in Fig.5) to drive the Power on Reset (POR_B) input pin on the

processor. The voltage for I2C operation is 1V8, so all the open drain input-outputs (SDA &

SCL) are connected to a 4.7-kΩpull-up resistor.

2.3.2 LP873347 - Core rail power up to 3 A

Figure 7 shows the full power architecture. For this design, two of the core rails will require up to 3 A of

current and two additional LDOs are required for MIPI to meet the power needs of the i.MX 8M Mini

processor. LP873347, an OTP variant of LP8733 base part number, is a PMIC that has been programmed

specifically to meet the power requirements of this application when paired with the TPS6521825 device.

The IC has two step-down converters with both single and dual phase regulators for improved efficiency

with higher power output. It also has two linear regulators (LDOs), general purpose digital output signals

and I2C interface.

For this project LP873347 will be used to generate 0V85/0V95/1V0 (dynamic voltage/frequency scaling, or

DVFS) for VDD_VPU, VDD_GPU and VDD_DRAM with an estimated approximate current output of 2.5 A

from BUCK0. The same DVFS voltages are required for VDD_ARM with an estimated current output of

2.2 A from BUCK1. The LDOs will provide 1V2 and 0V9 for VDD_MIPI_1V2 and VDD_MIPI_0V9

respectively. The input voltage to both PMICs is 5 V in this design. The LP873347 (slave PMIC) is

enabled by a GPIO of the TPS6521825 (master PMIC), and is disabled through a combination of signals

to ensure proper power-up and power-down sequencing for the processor.

LEGEND:

LP873347

BUCK0

0V85/0V95/1V0, 3A

BUCK1

0V85/0V95/1V0, 3A

LDO0

1V2, 300 mA

LDO1

0V9V, 300 mA

TPS6521825

DCDC1

0V85/0V9, 1.8 A

DCDC2

1V1, 1.8 A

DCDC3

3V3, 1.8 A

LS1

2V5, 920 mA

LS2

5V, 920 mA

DCDC5

1V0, 20 mA

DCDC4

1V8, 1.6 A

LDO

1V8, 400 mA

DCDC6

1V8, 20 mA

LS3

5V, 900 mA

i.MX 8M Mini

VDD_VPU, VDD_GPU,

VDD_DRAM

VDD_ARM

VDD_MIPI_1V2

VDD_MIPI_0V9

VDD_SOC

NVCC_DRAM

NVCC_3V3

VDD_SNVS

NVCC_1V8

VDDA_1V8

NVCC_SNVS

NVCC_ENET

LDO

TPS7A10

R1 R2

µSD Card

MIPI

DSI

MIPI

CSI

Expansion

Connector

Ethernet PHY

LPDDR4

eMMC WiFi +

I2C

Connector

Expansion

Connector

Audio

DAC

PCIe

Clock

Generator

Audio

Card

eMMC

WiFi + BT

QSPI

MIPI

DSI

MIPI

CSI

PCIe

Clock

Generator

Ethernet

PHY

Ethernet PHY

RTC

Oscillator

DC-DC

3V3, 4A

MP2147

USB 2.0

Micro-B

USB to UART

FT2232D

USB OTG

Type-C

LOAD

SWITCH

(MOSFET)

DC-DC

5 V ±20 V, 8 A

MP8759GD

LOAD

SWITCH

(MOSFET)

USB

Type-C

3V3_PERI, 2.5 A

2V5, 0.085 A

1V8, 250 mA

3V3, 1.5 A

1V1, 1.5 A

1V0,

115 mA

3V3,

100 mA

1V8, 300 mA

0V8,

20 mA

GPIO1

GPIO3

5V0,

0.9 A

1V0,

20 mA

1V8,

3 mA

1V8, 500 mA

3V3, 100 mA

1V1, 1.5 A

0V85/0V9, 1.5 A

0V9, 300 mA

1V2, 300 mA

0V85/0V95/1V0, 2.2 A

0V85/0V95/1V0, 2.5 A

5V0

GPIO3/

PGOOD_BU

GPIO1

32.768

kHz

Component on base-board

Peripheral connector

(ex: card slot, USB port)

2V5

Ethernet PHY

AR8031

LPDDR4

Ethernet

PHY

2V5,

150 mA

3V3

0 

Audio

Card

MIPI

DSI

MIPI

CSI

PCIe (M.2)

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Integrated Power Supply Reference Design for NXP i.MX 8M Mini Processor

Figure 7. TIDA-050038 Full Power Architecture

2.3.3 INA3221 - Current Monitor

To measure the live current information, a current sense circuit is integrated to the power section of this

design. The current sensing is done with the INA3221 device. There are three devices used to monitor all

the TPS6521825 and LP873347 PMIC power rails that are sourcing greater than 100-mA of current to the

system. The wiring is shown in Figure 8. The address pin A0 of the INA3221 device needs to be

terminated according to Table 2.

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