XFusion Digital Technologies FusionServer 1288H V5 Guida di riferimento rapido

FusionServer 1288H V5 Server

Technical White Paper

Issue

Date

2023-02-28

xFusion Digital Technologies Co., Ltd.

2023-02-28

No part of this document may be reproduced or transmitted in any form or by any means without prior written

consent of xFusion Digital Technologies Co., Ltd.

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and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise

description and easy understanding, which does not mean that "xFusion" may have any othermeaning.Any

"xFusion" mentioned or described hereof may not be understood as any meaning other than "xFusion Digital

Technologies Co., Ltd.", and xFusion Digital Technology Co., Ltd. shall not bear any liability resulting from

the use of "xFusion".

The purchased products, services and features are stipulated by the contract made between xFusion and

the customer. All or part of the products, services and features described in this document may not bewithin

the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,

information, and recommendations in this document are provided "AS IS" without warranties, guarantees or

representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

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recommendations in this document do not constitute a warranty of any kind, express or implied.

xFusion Digital Technologies Co., Ltd.

Address:

9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island

Zhengdong New District 450046

Zhengzhou, Henan Province

People's Republic of China

Website:

https://www.xfusion.com

FusionServer 1288H V5 Server 
Technical White Paper 
Contents 
 
2023-02-28 
iii 
 
Contents 
About This Document........................................................................................................v 
Product Introduction ......................................................................................................7 
Features...........................................................................................................................8 
Physical Structure ........................................................................................................11 
Logical Structure ..........................................................................................................12 
Hardware Description...................................................................................................14 
1 Front Panel...........................................................................................................................................14 
1.1 Appearance .......................................................................................................................................14 
1.2 Indicators and Buttons........................................................................................................................15 
1.3 Ports..................................................................................................................................................18 
2 Rear Panel............................................................................................................................................20 
2.1 Appearance .......................................................................................................................................20 
2.2 Indicators...........................................................................................................................................20 
2.3 Ports..................................................................................................................................................22 
3 Processor .............................................................................................................................................23 
4 Memory.................................................................................................................................................24 
4.1 DDR4 Memory...................................................................................................................................24 
4.1.1 Memory Identifier ............................................................................................................................24 
4.1.2 Memory Subsystem Architecture .....................................................................................................26 
4.1.3 Memory Compatibility......................................................................................................................27 
4.1.4 DIMM Installation Rules...................................................................................................................28 
4.1.5 Memory Installation Positions..........................................................................................................29 
4.1.6 Memory Protection Technologies.....................................................................................................30 
4.2 DCPMM.............................................................................................................................................31 
4.2.1 Memory Identifier ............................................................................................................................31 
4.2.2 Memory Subsystem Architecture .....................................................................................................32 
4.2.3 Memory Compatibility......................................................................................................................33 
4.2.4 DIMM Installation Rules...................................................................................................................34 
4.2.5 Memory Installation Positions..........................................................................................................35 
4.2.6 Memory Protection Technologies.....................................................................................................36 
5 Storage.................................................................................................................................................37 

FusionServer 1288H V5 Server

Technical White Paper

Contents

2023-02-28

5.5.1 Drive Configurations...........................................................................................................................37

5.5.2 Drive Numbering................................................................................................................................38

5.5.3 Drive Indicators..................................................................................................................................39

5.5.4 RAID Controller Card .........................................................................................................................41

5.6 Network ................................................................................................................................................42

5.6.1 LOMs.................................................................................................................................................42

5.6.2 FlexIO Cards......................................................................................................................................44

5.7 I/O Expansion .......................................................................................................................................48

5.7.1 PCIe Cards........................................................................................................................................48

5.7.2 PCIe Slots..........................................................................................................................................48

5.7.3 PCIe Slot Description.........................................................................................................................49

5.8 PSUs....................................................................................................................................................50

5.9 Fans .....................................................................................................................................................51

5.10 Boards................................................................................................................................................52

5.10.1 Mainboard........................................................................................................................................52

5.10.2 Drive Backplane...............................................................................................................................55

6 Product Specifications.................................................................................................57

6.1 Technical Specifications ........................................................................................................................57

6.2 Environmental Specifications.................................................................................................................61

6.3 Physical Specifications..........................................................................................................................63

7 Software and Hardware Compatibility.........................................................................65

8 Safety Instructions........................................................................................................66

8.1 Security.................................................................................................................................................66

8.2 Maintenance and Warranty....................................................................................................................69

9 System Management ....................................................................................................70

10 Certifications...............................................................................................................72

AAppendix.......................................................................................................................74

B Glossary........................................................................................................................88

C Acronyms and Abbreviations......................................................................................91

FusionServer 1288H V5 Server

Technical White Paper

About This Document

2023-02-28

About This Document

Purpose

This document describes the FusionServer 1288H V5 rack server in terms of features,

structure, specifications, and component hardware and software compatibility.

Intended Audience

This document is intended for pre-sales engineers.

Symbol Conventions

The symbols that may be found in this document are defined as follows.

Symbol

Description

Indicates a hazard with a high level of risk which, if not

avoided, will result in death or serious injury.

Indicates a hazard with a medium level of risk which, if

not avoided, could result in death or serious injury.

Indicates a hazard with a low level of risk which, if not

avoided, could result in minor or moderate injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in equipment damage, data loss,

performance deterioration, or unanticipated results.

NOTICE is used to address practices not related to

personal injury.

Supplements the important information in the main text.

NOTE is used to address information not related to

personal injury, equipment damage, and environment

deterioration.

FusionServer 1288H V5 Server

Technical White Paper

About This Document

2023-02-28

Change History

Issue

Date

Description

2023-02-28

Updated 5.7.2 PCIe Slots.

2022-11-30

Updated A.4 Nameplate .

2022-11-11

⚫Updated 6.3 Physical Specifications .

⚫Updated 8.1 Security.

2022-09-08

Updated 5.1.2 Indicators and Buttons.

2022-08-12

Optimized 6.3 Physical Specifications .

2022-06-25

⚫Added a figure that shows how to measure

dimensions.

⚫Added the description of the enhanced

management chip (VB) and normal

management chip.

⚫Updated 6.1 Technical Specifications and

claimed support for U.2 drives.

⚫Updated CE, UKCA, and CCC certification

standards in 10 Certifications.

⚫Added A.1 Chassis Label.

2022-03-18

Added 10 Certifications.

2021-12-20

This issue is the first official release.

FusionServer 1288H V5 Server

Technical White Paper

1 Product Introduction

2023-02-28

1 Product Introduction

FusionServer 1288H V5 (1288H V5) is a new-generation 1U 2-socket rack server

designed for Internet, Internet Data Center (IDC), cloud computing, enterprise, and

telecom applications.

The 1288H V5 is ideal for IT core services, cloud computing, high-performance

computing, distributed storage, big data processing, enterprise or telecom

applications, and other complex workloads.

The compact and reliable 1288H V5 features low power consumption, high scalability,

easy deployment, and simplified management.

For details about the 1288H V5 nameplate information, see A.4 Nameplate .

Figure 1-1 1288H V5 (with 8 drives)

FusionServer 1288H V5 Server

Technical White Paper

2 Features

2023-02-28

2 Features

Performance and Scalability

⚫Powered by two Intel®Xeon®Scalable Skylake or Cascade Lake processors, the

server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and two

10.4 GT/s UPI links between the processors, which deliver supreme processing

performance.

−It supports up to two processors with 56 cores and 112 threads to maximize

the concurrent execution of multithreaded applications.

−An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and

at least 1.375 MB of L3 cache.

−Intel Turbo Boost Technology 2.0 allows processor cores to run faster than

the frequency specified in the Thermal Design Power (TDP) configuration if

they are operating below power, current, and temperature specification

limits.

−Intel Hyper-Threading Technology enables each processor core to run up to

two threads, improving parallel computation capability.

−The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows

operating system (OS) vendors to better use hardware to address

virtualization workloads.

−Intel®Advanced Vector Extensions 512 (IntelAVX-512) significantly

accelerates floating-point performance for computing-intensive applications.

−The Cascade Lake processors support Intel® Deep Learning Boost vector

neural network instructions (VNNI) to improve the performance of deep

learning applications.

⚫The server supports double data rate 4 (DDR4) registered dual in-line memory

modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error checking

and correcting (ECC). Aserver fully configured with twenty-four 2933 MT/s

memory modules (only available with Cascade Lake processors) provides 3072

GB memory space and the maximum theoretical memory bandwidth of 249.9375

GB/s.

⚫A server supports a maximum of 12 Intel®OptaneTM DC persistent memory

modules (DCPMMs for short). When the DDR4 memory modules are used

together, the server supports a maximum of 7.5 TB memory capacity (calculated

based on a maximum of 128 GB capacity per DDR4 memory module and a

maximum of 512 GB capacity per DCPMM).

⚫Flexible drive configurations cater to a variety of business requirements and

ensure high elasticity and scalability of storage resources.

FusionServer 1288H V5 Server

Technical White Paper

2 Features

2023-02-28

⚫The use of all solid-state drives (SSDs) is supported. An SSD supports up to 100

times more I/O operations per second (IOPS) than a typical hard disk drive (HDD).

The use of all SSDs provides higher I/O performance than the use of all HDDs or

a combination of HDDs and SSDs.

⚫The LANs on motherboard (LOMs) and FlexIO cards provide a variety of ports to

meet different networking requirements.

⚫With Intel integrated I/O, the Intel®Xeon®Scalable processors integrate the PCIe

3.0 controller to shortens I/O latency and improve overall system performance.

⚫The server supports up to three PCIe 3.0 slots.

Availability and Serviceability

⚫Carrier-class components with process expertise ensure high system reliability

and availability.

⚫The server uses hot-swappable SAS/SATA/NVMe drives. It supports RAID 0, 1,

1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also uses

a supercapacitor to protect the RAID cache data against power failures.

⚫The SSDs offer better reliability than HDDs, ensuring continued system

performance.

⚫The server provides simplified O&M and efficient troubleshooting through the

UID/HLYLED indicators on the front panel, fault diagnosis LED, and iBMC

WebUI.

⚫The iBMC monitors system parameters in real time, triggers alarms, and

performs recovery actions in case of failures, minimizing system downtime.

⚫For more information about the warranty in the Chinese market, see Warranty.

Manageability and Security

⚫The built-in iBMC monitors server operating status and provides remote

management.

⚫A password is required for accessing the BIOS, ensuring system boot and

management security.

⚫The Network Controller Sideband Interface (NC-SI) allows a network port to

serve as a management port and a service port for maximized return on

investment (ROI) for customers. The NC-SI feature is disabled by default and can

be enabled through the iBMC or BIOS.

⚫The integrated Unified Extensible Firmware Interface (UEFI) improves setup,

configuration, and update efficiency and simplifies fault handling.

⚫Lockable server chassis panel ensures security of local data and supports

checking upon opening the cover.

⚫The Advanced Encryption Standard–New Instruction (AES NI) algorithm allows

faster and stronger encryption.

⚫Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer

overflow attacks when working with a supported OS.

⚫Intel Trusted Execution Technology enhances security using hardware-based

defense against malicious software attacks, allowing applications to run

independently.

⚫The trusted platform module (TPM) and trusted cryptography module (TCM)

provide advanced encryption functions, such as digital signatures and remote

authentication.

FusionServer 1288H V5 Server

Technical White Paper

2 Features

2023-02-28

⚫The following requirements in NIST SP 800-147B are met:

−The BIOS firmware digital signature update mechanism is supported. During

the upgrade, the digital signature is verified to prevent unauthorized BIOS

firmware upgrade.

−The flash security protection mechanism is supported to prevent

unauthorized modification of the flash memory in the OS.

The service port with NC-SI enabled supports the following configuration:

⚫Configuring any port on the FlexIO card or PCIe NIC as the service port with NC-SI enabled.

Host port 1 is configured by default.

⚫Enabling, disabling, and setting avirtual local area network (VLAN) ID for this port. The VLAN

ID is 0and disabled by default.

⚫Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses

(IPv6 address, prefix length, and gateway) for this port.

Energy Efficiency

⚫The 80 Plus Platinum power supply units (PSUs) of multiple power ratings

provide 94% power efficiency at 50% load.

⚫The server supports active/standby power supplies and high-voltage DC (HVDC)

for improved power supply efficiency.

⚫Efficient voltage regulator-down (VRD) power supplies for boards minimize the

energy loss from DC/DC power conversion.

⚫Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed

adjustment and intelligent CPU frequency scaling optimize heat dissipation and

reduce overall system power consumption.

⚫The improved thermal design with energy-efficient fans ensures optimal heat

dissipation and reduces system power consumption.

⚫The server is protected with power capping and power control measures.

⚫Staggered spin-up for drives reduces the server boot power consumption.

⚫Intel® Intelligent Power Capability allows a processor to be powered on or off

based on requirements.

⚫Low-voltage Intel®Xeon®Scalable processors consume less energy, ideally

suited for data centers and telecommunications environments constrained by

power and thermal limitations.

⚫SSDs consume 80% less power than HDDs.

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