YASKAWA VIPA System 300S Manuale utente
SM-DIO | | Manual
HB140 | SM-DIO | | en | Rev. 16-43
VIPA System 300S
Digital signal modules - SM 32x(S)
www.vipa.com/en/service-support/manual
300S_SM-DIO,4,GB - © 2016
VIPA GmbH
Ohmstr. 4
91074 Herzogenaurach
Telephone: 09132-744-0
Fax: 09132-744-1864
Email: [email protected]
Internet: www.vipa.com
Table of contents
1 Basics...................................................................................................................... 5
1.1 Copyright © VIPA GmbH ................................................................................. 5
1.2 About this manual............................................................................................. 6
1.3 Safety information............................................................................................. 7
2 Assembly and installation guidelines.................................................................. 8
2.1 Safety information for users.............................................................................. 8
2.2 Overview........................................................................................................... 9
2.3 Installation dimensions..................................................................................... 9
2.4 Assembly SPEED-Bus.................................................................................... 11
2.5 Assembly standard bus.................................................................................. 14
2.6 Cabling........................................................................................................... 16
2.7 Installation guidelines..................................................................................... 19
2.8 General data I/O modules.............................................................................. 21
2.8.1 General data................................................................................................ 22
3 Digital Input Modules........................................................................................... 24
3.1 321-1BH01 - DI 16xDC 24V........................................................................... 24
3.1.1 Technical data.............................................................................................. 25
3.2 321-1BL00 - DI 32xDC 24V............................................................................ 27
3.2.1 Technical data.............................................................................................. 29
3.3 321-1FH00 - DI 16xAC120/230V.................................................................... 31
3.3.1 Technical data.............................................................................................. 33
4 Digital Output Modules........................................................................................ 35
4.1 Safe shutdown of non-safe outputs................................................................ 35
4.1.1 Introduction.................................................................................................. 35
4.1.2 Safe shutdown............................................................................................. 35
4.1.3 Requirements and fault exclusions.............................................................. 36
4.2 322-1BF01 - DO 8xDC 24V 2A...................................................................... 38
4.2.1 Technical data.............................................................................................. 39
4.3 322-1BH01 - DO 16xDC 24V 1A.................................................................... 41
4.3.1 Technical data.............................................................................................. 43
4.4 322-1BH41 - DO 16xDC 24V 2A.................................................................... 45
4.4.1 Technical data.............................................................................................. 48
4.5 322-1BH60 - DO 16xDC 24V 0.5A for manual operation............................... 50
4.5.1 Deployment................................................................................................. 52
4.5.2 Technical data.............................................................................................. 52
4.6 322-1BL00 - DO 32xDC 24V 1A .................................................................... 54
4.6.1 Deployment................................................................................................. 57
4.6.2 Technical data.............................................................................................. 57
4.7 322-5FF00 - DO 8xAC 120/230V 2A ............................................................. 59
4.7.1 Parameterization ........................................................................................ 62
4.7.2 Technical data.............................................................................................. 63
4.8 322-1HH00 - DO 16xRelay ............................................................................ 65
4.8.1 Technical data.............................................................................................. 68
5 Digital Input/Output Modules.............................................................................. 71
5.1 323-1BH00 - DIO 16xDC 24V 1A................................................................... 71
5.1.1 Technical data.............................................................................................. 73
5.2 323-1BH01 - DI 8xDC 24V, DO 8xDC 24V 1A............................................... 75
VIPA System 300S Table of contents
HB140 | SM-DIO | | en | Rev. 16-43 3
5.2.1 Technical data.............................................................................................. 77
5.3 323-1BL00 - DI 16xDC 24V, DO 16xDC 24V 1A............................................ 80
5.3.1 Technical data.............................................................................................. 82
6 Digital Modules FAST - SPEED-Bus................................................................... 85
6.1 Addressing at SPEED-Bus............................................................................. 85
6.2 Project engineering......................................................................................... 85
6.2.1 Fast introduction.......................................................................................... 86
6.2.2 Preconditions............................................................................................... 86
6.2.3 Steps of project engineering........................................................................ 87
6.3 321-1BH70 - DI 16xDC 24V........................................................................... 89
6.3.1 Parameterization......................................................................................... 92
6.3.2 Process interrupt......................................................................................... 96
6.3.3 Diagnostic interrupt...................................................................................... 97
6.3.4 Technical data............................................................................................ 100
6.4 322-1BH70 - DO 16xDC 24V 0.5A............................................................... 102
6.4.1 Technical data............................................................................................ 105
6.5 323-1BH70 - DIO 16xDC 24V 0.5A.............................................................. 106
6.5.1 Parameterization....................................................................................... 109
6.5.2 Process interrupt........................................................................................ 114
6.5.3 Diagnostic interrupt.................................................................................... 114
6.5.4 Technical data............................................................................................ 117
VIPA System 300S
Table of contents
HB140 | SM-DIO | | en | Rev. 16-43 4
1 Basics
1.1 Copyright © VIPA GmbH
This document contains proprietary information of VIPA and is not to be disclosed or used
except in accordance with applicable agreements.
This material is protected by the copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to VIPA), except in accord-
ance with applicable agreements, contracts or licensing, without the express written con-
sent of VIPA and the business management owner of the material.
For permission to reproduce or distribute, please contact: VIPA, Gesellschaft für Visuali-
sierung und Prozessautomatisierung mbH Ohmstraße 4, D-91074 Herzogenaurach, Ger-
many
Tel.: +49 9132 744 -0
Fax.: +49 9132 744-1864
EMail: [email protected]
http://www.vipa.com
Every effort has been made to ensure that the information contained in
this document was complete and accurate at the time of publishing. Nev-
ertheless, the authors retain the right to modify the information.
This customer document describes all the hardware units and functions
known at the present time. Descriptions may be included for units which
are not present at the customer site. The exact scope of delivery is
described in the respective purchase contract.
Hereby, VIPA GmbH declares that the products and systems are in compliance with the
essential requirements and other relevant provisions. Conformity is indicated by the CE
marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local VIPA customer service organization.
VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,
System 500S and Commander Compact are registered trademarks of VIPA Gesellschaft
für Visualisierung und Prozessautomatisierung mbH.
SPEED7 is a registered trademark of profichip GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300 and S7-400 are registered trademarks of
Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc., USA.
Portable Document Format (PDF) and Postscript are registered trademarks of Adobe
Systems, Inc.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Contact your local VIPA Customer Service Organization representative if you wish to
report errors or questions regarding the contents of this document. If you are unable to
locate a customer service centre, contact VIPA as follows:
All Rights Reserved
CE Conformity Declaration
Conformity Information
Trademarks
Information product sup-
port
VIPA System 300S Basics
Copyright © VIPA GmbH
HB140 | SM-DIO | | en | Rev. 16-43 5
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Telefax: +49 9132 744-1204
EMail: [email protected]
Contact your local VIPA Customer Service Organization representative if you encounter
problems with the product or have questions regarding the product. If you are unable to
locate a customer service centre, contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Tel.: +49 9132 744-1150 (Hotline)
EMail: [email protected]
1.2 About this manual
The manual is targeted at users who have a background in automation technology.
The manual consists of chapters. Every chapter provides a self-contained description of a
specific topic.
The following guides are available in the manual:
nAn overall table of contents at the beginning of the manual
nReferences with page numbers
The manual is available in:
nprinted form, on paper
nin electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Technical support
Target audience
Structure of the manual
Guide to the document
Availability
Icons Headings
VIPA System 300S
Basics
About this manual
HB140 | SM-DIO | | en | Rev. 16-43 6
1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
–in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
– Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
VIPA System 300S Basics
Safety information
HB140 | SM-DIO | | en | Rev. 16-43 7
2 Assembly and installation guidelines
2.1 Safety information for users
VIPA modules make use of highly integrated components in MOS-Technology. These
components are extremely sensitive to over-voltages that can occur during electrostatic
discharges. The following symbol is attached to modules that can be destroyed by elec-
trostatic discharges.
The Symbol is located on the module, the module rack or on packing material and it indi-
cates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electro-
static sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and altera-
tions on electrostatic sen-
sitive modules
VIPA System 300S
Assembly and installation guidelines
Safety information for users
HB140 | SM-DIO | | en | Rev. 16-43 8
2.2 Overview
While the standard peripheral modules are plugged-in at the right side of the CPU, the
SPEED-Bus peripheral modules are connected via a SPEED-Bus bus connector at the
left side of the CPU. VIPA delivers profile rails with integrated SPEED-Bus for 2, 6 or 10
SPEED-Bus peripheral modules with different lengths.
The single modules are directly installed on a profile rail and connected via the backplane
bus coupler. Before installing the modules you have to clip the backplane bus coupler to
the module from the backside. The backplane bus couplers are included in the delivery of
the peripheral modules.
With SPEED-Bus the bus connection happens via a SPEED-Bus rail integrated in the
profile rail at the left side of the CPU. Due to the parallel SPEED-Bus not all slots must be
occupied in sequence.
At slot (SLOT 1 DCDC) you may plug either a SPEED-Bus module or an additional power
supply.
You may assemble the System 300 horizontally, vertically or lying.
Please regard the allowed environment temperatures:
nhorizontal assembly: from 0 to 60°C
nvertical assembly: from 0 to 40°C
nlying assembly: from 0 to 40°C
2.3 Installation dimensions
1tier width (WxHxD) in mm: 40 x 125 x 120
General
Serial Standard bus
Parallel SPEED-Bus
SLOT 1 for additional
power supply
Assembly possibilities
Dimensions Basic enclo-
sure
VIPA System 300S Assembly and installation guidelines
Installation dimensions
HB140 | SM-DIO | | en | Rev. 16-43 9
Dimensions
Installation dimensions
VIPA System 300S
Assembly and installation guidelines
Installation dimensions
HB140 | SM-DIO | | en | Rev. 16-43 10
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