Agilent Technologies HP 83711A Manuale utente

Printed in USA March 2000

Notice

Hewlett-Packard to Agilent Technologies Transition

This documentation supports a product that previously shipped under the Hewlett-

Packard company brand name. The brand name has now been changed to Agilent

Technologies. The two products are functionally identical, only our name has changed. The

document still includes references to Hewlett-Packard products, some of which have been

transitioned to Agilent Technologies.

2Chapter1

Contacting Agilent

By internet, phone, or fax, get assistance with all your test and measurement needs.

Table 1-1 Contacting Agilent

Online assistance: www.agilent.com/find/assist

United States

(tel) 1 800 452 4844 Latin America

(tel) (305) 269 7500

(fax) (305) 269 7599

Canada

(tel) 1 877 894 4414

(fax) (905) 282-6495

Europe

(tel) (+31) 20 547 2323

(fax) (+31) 20 547 2390

New Zealand

(tel) 0 800 738 378

(fax) (+64) 4 495 8950

Japan

(tel) (+81) 426 56 7832

(fax) (+81) 426 56 7840

Australia

(tel) 1 800 629 485

(fax) (+61) 3 9210 5947

Asia Call Center Numbers

Country Phone Number Fax Number

Singapore 1-800-375-8100 (65) 836-0252

Malaysia 1-800-828-848 1-800-801664

Philippines (632) 8426802

1-800-16510170 (PLDT

Subscriber Only)

(632) 8426809

1-800-16510288 (PLDT

Subscriber Only)

Thailand (088) 226-008 (outside Bangkok)

(662) 661-3999 (within Bangkok) (66) 1-661-3714

Hong Kong 800-930-871 (852) 2506 9233

Taiwan 0800-047-866 (886) 2 25456723

People’s Republic

of China 800-810-0189 (preferred)

10800-650-0021 10800-650-0121

India 1-600-11-2929 000-800-650-1101

Service Guide

HP 83711A/12A and HP 83711B/12B

Synthesized CW Generators

SERIAL NUMBERS

This manual applies directly to instruments with serial number prex US3449 and above

ABCDE

HP Part No. 83711-90134

Printed in USA July 1997 Supersedes April 1995

Notice.

The information contained in this document is subject to change without notice

Hewlett-P

ackard makes no warranty of any kind with regard to this material, including

but not limited to, the implied warranties of merchantability and tness for aparticular

purpose

.Hewlett-P

ackard shall not be liable for errors contained herein or for incidental or

consequential damages in connection with the furnishing, performance

,or use of this material.



is prohibited, except as allowed under the copyright laws.

1400 Fountaingrove Parkway, Santa Rosa CA, 95403-1799, USA

Introduction

The HP 83711A/12A and HP 83711B/12B synthesized CW generators have dierent frequency

ranges

.The HP 83711A/11B has afrequency range of 1to20 GHz, and the HP 83712A/12B has

afrequency range of 10 MHz to 20 GHz.

The service information for the HP 83711A/12A and HP 83711B/12B synthesized CW generators

comes in two manuals

The

HP 83711A/12A and HP 83711B/12B Synthesized CW Generators Service Guide

provides

information needed to repair the synthesizer to the assembly level. The

HP 83711A/12A,

HP 83711B/12B

,HP 83731A/32A and HP 83731B/32B Synthesized Signal Generators

Component-Level Information

manual provides component-level information for the repair of

individual instrument assemblies

.The manual contains Component-Level Information P

ackets

(CLIP

s) for selected assemblies. Each CLIP contains component-level schematics, acomponent

parts list, and illustrations for component location by reference designator

Calibration information is in the

HP 83711A/12A, HP 83711B/12B, HP 83731A/32A and

HP 83731B/32B Synthesized Signal Generators Calibration Guide

.The calibration guide

contains the performance tests and adjustments for the synthesizer

The service guide is what you receive when you order Option OBW

,service documentation.

iii

In This Guide

The service guide includes the following chapters:

Chapter 1

,\Troubleshooting," contains the troubleshooting information needed to isolate a

failed major assembly

Chapter 2

,\Block Diagrams

," contains the block diagram that is to be used for the HP

83711A/12A and HP 83731B/32B

Chapter 3

,\Major Assembly and Cable Locations

," contains drawings that show the major

assemblies and cable locations

Chapter 4

,\P

arts List," contains information needed to order assemblies and parts for the

instrument.

Chapter 5

,\Assembly Replacement," contains information needed to remove or replace a

major assembly

Chapter 6

,\P

ost-Repair Procedures

," contains the procedures to be followed after arepair has

been made

Chapter 7

,\Error Messages

," contains alist of all of the error messages that might be

generated during use of the instrument. Each entry in the list contains asequence that can be

followed to recover from the error condition.

Chapter 8

,\Options

," contains adescription of the various options available for use with the

synthesizers

Chapter 9

,\Contacting Hewlett-P

ackard," provides information on how to contact HP as well

as how to package and ship the instrument.

Chapter 10

\Legal and Regulatory Information," contains the information about manual

updates

,operating environment, storage environment, ESD precautions

,safety considerations,

etc

Assumptions About Y

The procedures in this guide assume that you have the tools and equipment to perform each

service task. To nd what tools and equipment belong to each service task, refer to the chapter

containing the task.

Contents

1. Troubleshooting

Introduction . .....................

.......1-1

Prior to Beginning Troubleshooting ...................

.. 1-1

The Service Position ................... .. .. .. ..1-1

Power Supply V

erication .................... ..

.. 1-1

Safety Considerations ..

..................... ..

.1-2

arnings and Cautions ...............

......1-2

Before Applying P

ower ...............

.....1-2

After-Service Safety Checks .................... ....1-3

ESD Precautions ...............................1-3

Recommended T

est Equipment .... .. ..................1-3

Service A

ccessories ........................ .....1-4

TORX



Screwdrivers . ..

...................

. 1-4

Pozidrive Screwdrivers ......................

...1-4

Hardware . .......................

.......1-4

Major Assemblies

arts

,and Cable Locations ................ 1-4

Test P

oint Locations ............................1-4

Service Aids on Printed Circuit Boards .............

......1-5

Other Service Documents .................

........1-5

Cleaning ....................

..............1-5

Cleaning Intervals ...................

..........1-5

Cleaning Solution ..................... ........1-5

12-Month Cleaning ............. ................1-5

After Repair Calibration ............ ...............1-6

Main Troubleshooting .........

.............1-7

Microprocessor Assembly (A3) Troubleshooting .........

..1-9

ABUS Errors ...........

...............1-9

0.5 V/GHz Output Errors . ..

.................. 1-10

LO Synthesizer and Reference Assembly (A6) Troubleshooting ..

......1-11

Data Readback Errors ...... .. .. .. .............

. 1-11

ABUS Errors ..............................1-11

Oscillator Cold Error . . . . . . . . . . . .. .. .. .. .. .. .. .. 1-12

LO Synthesizer and Reference Unlocked/Divide V

oltage Errors ....... 1-13

YO Loop and Oset Synthesizer Assembly (A7) Troubleshooting . . . . . . . . 1-16

Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-16

ABUS Error........................

....... 1-17

Oset Synthesizer Incorrect Frequency/Unlocked Errors . . . . . . . . . . 1-18

YIG Driver Assembly (A9) Troubleshooting .... .. .. .. .. .. .. . 1-20

Data Readback Errors .. .. .. .. .................. 1-20

ABUS Errors .... .. .. .. .. .. .. .. . .. .. .. .. .. . 1-20

MSB Errors .... .. .. .. .. .. .. .. .. .. .. .. . .. .. 1-21

Low/High Band Voltage Errors ...................... 1-23

ALC Assembly (A10) Troubleshooting . . . . . . . . . . . . . . . . . . . . 1-25

Data Readback Errors .. .. .. .. .. .. .. .. .. .. .. .. .. 1-25

ABUS Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25

DAC Errors ............................... 1-26

Contents-1

Integrator Errors . ..

............... .. .. .. 1-27

Integrator Errors (Revision 10.01 and Above Only) ...........

.. 1-27

Leveled Indicator Trip Point Errors ............

.. 1-27

Leveled Indicator Trip Point Errors (Revision 10.01 and Above Only) ....1-27

RF/Reference Detector Errors ..

...............

. 1-27

Input/Output Switching Errors .. ...............

. 1-29

Input/Output Switching Errors (Revision 10.01 and Above Only) ......1-29

Track and Hold Errors ..............

..........1-29

Track and Hold Errors (Revision 10.01 and Above Only) .......... 1-29

Output Module (A8A1) Troubleshooting ................

. 1-30

Combiner/High Band/Low Band Errors ................

.. 1-30

SLPF

A(A8A3) Troubleshooting ............

.......1-31

Input/Output Bias Errors .............

......1-31

OLoop and Oset Synthesizer Assembly (A7) Troubleshooting .......

. 1-34

Sampler (A8T1) Troubleshooting ............... .. .. ...1-41

LO Unlocked Errors ............... .. .. ........1-41

Oset Synthesizer Unlocked Errors .............. .. .. ..1-42

OLoop Unlocked Errors .........

.............1-42

SLPF

A(A8A3) Troubleshooting .......................1-50

Unleveled at Minimum V

ernier Errors ...................1-50

Unleveled at Maximum V

ernier Errors ...........

.....1-51

Divider and Modulation Assembly (A4) Troubleshooting ........... 1-52

Symptom Troubleshooting .........

...............1-56

Checking the P

ower Supply ........ ................1-57

Checking the Front P

anel Display .....

...............1-57

Checking the Hewlett-P

ackard Interface Bus (HP-IB) ......

.......1-58

Checking the Microprocessor ..........

..............1-58

Checking the 10 MHz Output . .......................1-59

Checking the 10 MHz Input ..

.......................1-59

Checking the 0.5V/GHz Output .......................1-60

Checking the Output P

ath .... .....................1-60

oTroubleshoot the Option 1E1 Output Path ...............1-60

oTroubleshoot the Non-Option 1E1 Output Path .............1-61

Checking External ALC ...................

.1-62

2. Block Diagrams

3. Major Assembly and Cable Locations

Introduction ...............

........3-1

4. Parts List

Introduction..........

... . .. .. .. .. .. .. .. .. .. . 4-1

Abbreviations . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. . . 4-1

Replaceable P

arts T

able F

ormat.... .. .. .. .. .. .......... 4-1

Illustrated P

arts Breakdowns . . . . . . . . . . . . . . . . . . .. .. .. . 4-2

Ordering Information .... .. .. . .. .. .. .. .. .. .. .. .. . 4-2

Optional Congurations .... .. .. .. .. . .. .. .. .. ...... 4-3

Parts List Backdating ......................... . .. 4-3

Parts Identication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

Other Documentation .... .. .. .. .. .. .. .. .. .. . .. .. . 4-4

Exchange Assemblies . .. .. .. .. .. . .. .. .. .. .. .. .. .. 4-5

Contents-2

5. Assembly Replacement

Introduction ..

............... .. .. .. .. .. ....5-1

Assembly and P

art Locations .............

...... .. 5-7

Major Assembly and Cable Locations ............... .. .. . 5-7

Service Position ..

...............

...5-7

ools . .. ...............

.........5-7

Special T

echniques ................. .. .. .........5-9

Safety ................... .. .. ............5-9

asteners (Screws and Nuts) ...............

.....5-9

Cable and Connector Identication .................. .. .5-9

Semi-Rigid Coaxial Cables ................... .. ....5-10

Flexible Coaxial Cables .............

..........5-11

SMC Connectors ................ .. .. .........5-11

SMA Connectors ..............

.........5-11

SMB Connectors ................ .. .. .........5-11

Multi-wire Cables ................ .. .. .........5-11

Synthesizer Covers ..............

..........5-13

oRemove the T

op Cover .......

................5-13

oRemove the Bottom Cover ........................5-15

ower Supply (A11) .............................5-17

oDisconnect the P

ower Supply Cables .........

......5-17

oRemove the P

ower Supply ..........

........5-18

Reassembly Tips .........

...................5-19

Fuse ............ .......................

. 5-20

oRemove (and Replace) the Fuse ....

...............5-20

an Assembly ..........

......................5-21

oDisconnect the F

an Cable ........................5-21

oRemove the Fan .........................

...5-22

Reassembly Tips .............................. 5-23

Divider and Modulation Board Assembly (A4) . ................5-23

ccess the Service P

osition . ...................... 5-23

oRemove the Assembly ..

...................... 5-23

Reassembly Tips .......

....................... 5-24

Microprocessor Board Assembly (A3) ..................... 5-26

ccess the Service P

osition .................. .. ...5-26

o Disconnect the Cables ...................

.......5-26

o Remove the Microprocessor Assembly .................. 5-27

Reassembly Tips . ..................... .. .. .. ..5-27

Battery (A3BT1) ............

.......5-29

ccess the Service P

osition .......................5-29

To Remove the P

art ....

........................ 5-29

To Reassemble the Instrument .... .. .. .. .. .. .. .. .. .. . 5-30

Crystal Oscillator (Option 1E5) ............ .. .. .. .. .. .. 5-31

To Disconnect the Oscillator Cables .... .. ............... 5-31

To Remove the Oscillator . . . . . . . . . . . . . . . . . ......... 5-31

Reassembly Tips . . . . . . . . . . . . . . . . . . . . . ......... 5-32

ALC Board Assembly (A10) . . . . . . . . . . . . . . . . . . . . ...... 5-33

To Remove the Assembly . . . . . . . . . . . . . . . . . . . . ...... 5-33

Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33

YIG Driver Board Assembly (A9) .. .. .. .. .. .. .. .. .. .. .. . 5-35

ToAccess the Service Position .... .. .. .. .. .. .. .. .. .. . 5-35

To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36

YO (YIG Oscillator) Loop/Oset Synthesizer Board Assembly (A7) . . . . . . . . 5-38

To Remove the Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38

Reassembly Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38

Contents-3

LO (Local Oscillator) Synthesizer/ Reference Board Assembly (A6) . ......5-40

ccess the Service P

osition ..........

.5-40

o Remove the Assembly .............

.5-41

Reassembly Tips . ..

................. .. .. .. .. ..5-42

Step Attenuator, A8AT1 (Option 1E1) ............. .. .. .. .. 5-44

o Remove the Assembly ...............

.5-44

oReassemble the Instrument ............... .. .. ....5-44

Sampler Microcircuit, A8T1 ...............

.....5-46

oRemove the Subassembly ................. .. .....5-46

oReassemble the Instrument ................. .. ....5-48

YIG Oscillator(s) .................... ..

.........5-49

oRemove the P

art ..........

..................5-49

oReassemble the Instrument ............. .. .. ......5-50

YIG Driver Cable and T

emperature Transducer ........... .. .. .5-53

oRemove the P

art ..........

...... ............5-53

oReassemble the Instrument ............. .. .. ......5-54

Output Module

,SLPF

AModule

,and Coupler Detector ......

.5-55

oRemove the Subassemblies ........... ............5-55

oRemove the Coupler Detector Subassembly ................5-56

oRemove the Output Module and the SLPF

AModule Subassemblies .....5-58

oReassemble the Instrument ............

.......5-58

RF Output Connector/A

dapter

,CP1 ...........

.....5-60

oRemove the Assembly ........ ..................5-60

oReassemble the Instrument ........

...............5-62

HP-IB Cable Interface Replacement .......

.............5-64

oRemove the Assembly ..........................5-64

Reassembly Tips ...........

...................5-65

Front P

anel (A1, A2) . .........................

...5-66

oRemove the Front Panel ......................... 5-66

oRemove the ALC Cable/Connector . ...................5-66

oRemove the Front Frame . ..

.....................5-68

oRemove the Display (A2) . ..

.....................5-69

oRemove the Keyboard (A1) . ..

....................5-69

o Remove the Dress P

anel ...............

........5-69

Reassembly Tips . ..................... .. .. ....5-71

6. Post-Repair Procedures

Introduction ..

...................

....6-1

7. Error Messages

Introduction . . . . . . . . . ........................ 7-1

Error Messages List .... .. .. .. .. .. .. .. .. .. .. .. .. . 7-2

Messages ...........

....................... 7-3

8. Options

Introduction............................ .. .. . 8-1

Electrical Options ......................

........ 8-2

Option 1E1 - A

dd Output Step Attenuator . . . . . . . . . . . . . . . . . . 8-2

Option 1E5 - Add High Stability Timebase . . . . . . . . . . . . . . . . . . 8-2

Option 1E8 - 1 Hz Frequency Resolution .................. 8-2

Option 1E9 - 3.5 mm RF Output Connector ................. 8-2

Mechanical Options .. .. .. .. .. .. .. .. .. .. .. .. .. .. . 8-3

Option 1CM - Rack Mount Kit . . . . . . . . . . . . . . . . . . . . . . . . 8-3

Option 1CP - Rack Mount and Handle Kit .................. 8-3

Option 1CR - Rack Slide Kit .... .. .. .. .. .. .. .. .. .. .. 8-3

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