HP 7500 48p 1000BASE-T w/PoE+ SE Mod Istruzioni per l'installazione

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Template Revision B

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 7500 48p 1000BASE-T w/ PoE+ SE Mod(JH213A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 0

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height 0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances 0

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Screw driver 2#

Socket Spanner

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on part 1,and then remove part 1;

2. Unscrew the screws on part 2,and then remove part 2 from PCB 10;

3. Unscrew the screws on part 3,and then remove part 3;

4. Remove the heatsink 4 from PCB 10;

5. Remove the heatsink 5 from PCB 10;

6. Unscrew the hexagonal posts 6 on PCB 7 and 8,and then remove hexagonal posts 6 and PCB 7 and 8;

7. Unscrew the hexagonal posts 9 ,and then remove hexagonal posts 9;

8. Unscrew the screws on PCB 10,and then remove PCB 10 from panel 13;

9. Remove shielding finger 11 from panel 13;

10. Remove film 12 from panel 13.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.3 Material of the facility built

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Facility Components Material Weight(g) Weight

percentage Selective treatment for

materials and

components

Details

1 Fe 48.6 1.64% Fe recycling

2 Zn 23.4 0.79% Zn recycling

3 Fe 116.2 3.91% Fe recycling

4 Al 23.8 0.80% Al recycling

5 Al 64.6 2.17% Al recycling

6 Fe 5.7 0.19% Fe recycling

7 Complex

PCB 46 1.55% The surface lf PCB is

greater than 10 square

centimeters

8 Complex

PCB 46 1.55% The surface lf PCB is

greater than 10 square

centimeters

9 Cu 25.2 0.85% Cu recycling

10 Complex

PCB 1174.5 39.53% The surface lf PCB is

greater than 10 square

centimeters

11 Be-Cu 2.7 0.09% Cu recycling

12 PC 1.5 0.05% Pla recycling

13 Fe 1392.7 46.88% Fe recycling

4. Revised record

Date Version Author Modify content

2015.06.25 V0 Xu Jianbin Initial version

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