HP BladeSystem c7000 Istruzioni per il montaggio

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HP ProLiant BladeSystem c7000

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torx Driver T-15

Philips Driver # 2

Flat Head Screw Driver Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove thumb-screws (4) on the rear chassis assembly (see Attachment 1) and use handles to pull out the rear-

chassis assembly. Midway through pulling out the assembly, be sure to depress the side-latches on the left and right

side of the assembly. (See Attachment 2)

2. Locate the midplane on the rear-chassis assembly, and remove all the screws that connect the air-baffling mask to the

midplane (See Attachment 3). Remove the air-baffling mask.

3. Remove all the screws on the Midplane in order to remove the midplane assembly from the chassis. (See Attachment

4. On the back side of the Midplane Assembly, unscrew the screws for attaching the Fan board PCBs (see Attachment

5). There are two fan boards to remove. (See yellow highlight).

5. Remove all the screws that connect the power board PCB to the bus-bar legs. (See Attachment 6)

6. The Midplane PCB can now be removed as well. Be sure to disconnect any cables attached to the Midplane.

7. Locate the LCD Transition board along the side of the main chassis. (See Attachment 7) Remove the designated

screws.

8. On the front of the main chassis, unscrew the designated screws and remove the panels. This should allow you to

disengage the LCD cable and remove the LCD display for disposal. (See Attachment 8)

9. Locate the screws that secure the panel that houses the LCD transition board. Remove the panel and remove the

LCD transition board PCB. (See Attachment 9)

10. Locate the LCD Paddle Board PCB on the rear cage. Remove the designated screws and remove the PCB. (See

Attachment 10)

11. Locate the Onboard Administrator Tray. Use the latch to remove the entire tray. Then, remove any Onboard

Administrator Modules that are in the tray. (See Attachment 11)

12. Remove the screw that is in the middle of the tray. Remove the corresponding panel, and you should find two PCBs to

remove: an Interposer Board PCB and a Link Board PCB. (See Attachment 12)

13. On the Onboard Administrator Module that was removed, depress the button in the center and remove the top panel.

(See Attachment 13) Remove the PCB and look for the Yellow battery. This battery can be removed from its

corresponding IC by using your fingers. (See Attachment 14)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1 – Removing Rear Chassis Assembly

Attachment 2 – Latches on the side of the Rear Chassis Assembly

Attachment 3 – Removing the Air Baffling Mask

Attachment 4 -- Removing the Midplane Assembly

Attachment 5 – Removing the Fan Board PCBs

Attachment 6 – Removing the Power Board PCB

Attachment 7 – Locating the LCD Transition Board PCB

Attachment 8 – Removing the LCD Module and the LCD cable panels

Attachment 9 – Removing the LCD Transition Board Panel

Attachment 10 – Removing the LCD Paddle board

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