HPE Apollo k6000 Istruzioni per il montaggio

MF877-00 Page 1

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HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE Apollo k6000

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sqcm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T10

Torx Driver

T15

Torx Driver

T20

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Battery - locate the battery on the APM board(HP P/N:852417-001). Use fingers to remove the battery and dispose of

properly.

2. Fan - Take the FAN Module out of the Chassis and dispose of properly.

3. Capacitors>2.5 cm - Remove the PSU from the system. With screw driver, remove the screws securing the top cover,

locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment1

Attachment 1 –Battery Location

Attachment 2 –FAN Location

Attachment 3~7–Super Cap Location in PSU

MF877-00 Page 3

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Attachment2

Attachment3

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Attachment4

Attachment5

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Template Revision A

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Attachment6

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Attachment7

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