Huawei MU509 Series Manuale utente

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means without prior written consent of Huawei Technologies Co., Ltd.

The product described in this manual may include copyrighted software of Huawei

Technologies Co., Ltd and possible licensors. Customers shall not in any manner

reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse

engineer, lease, assign, or sublicense the said software, unless such restrictions

are prohibited by applicable laws or such actions are approved by respective

Trademarks and Permissions

, , and are trademarks or registered trademarks of Huawei

Technologies Co., Ltd.

Other trademarks, product, service and company names mentioned are the

property of their respective owners.

Notice

Some features of the product and its accessories described herein rely on the

software installed, capacities and settings of local network, and may not be

activated or may be limited by local network operators or network service

providers, thus the descriptions herein may not exactly match the product or its

accessories you purchase.

Huawei Technologies Co., Ltd reserves the right to change or modify any

information or specifications contained in this manual without prior notice or

obligation.

NO WARRANTY

THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED

BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR

IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF

MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN

RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL.

TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL

HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL,

INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS,

REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS.

Import and Export Regulations

Customers shall comply with all applicable export or import laws and regulations

and will obtain all necessary governmental permits and licenses in order to export,

re-export or import the product mentioned in this manual including the software

and technical data therein.

Contents

Getting to Know the MU509..................................................................... 1

PCB Design ........................................................................................... 3

Assembly.............................................................................................. 5

Thank you for purchasing HUAWEI MU509-c

HSDPA Module (hereinafter referred to as the

MU509)

Note:

This manual briefly describes the preparation, the process for PCB Design,

Assembly and safety precautions.

You are recommended to read the manual before using the MU509.

Getting to Know the MU509

The package of the LGA module is 116 pin LGA with a dimension of 30 mm × 30

mm × 2.5 mm and the pitch of 1.5 mm. It is applied to the user interface board,

and can be used as a wireless terminal in a network environment.

PCB Design

CB Pad Design

To achieve high efficiency of the production and solder joints of high reliability, it

is recommended that the PCB pad size be designed as follows: the size of the

middle region is the same as the pad size of the product package; other pads are

0.05 mm larger than the unilateral pad of the product package. For details, see

the following figure:

Requirements on PCB Layout

Other devices must be located more than 3 mm away from the LGA module.

It is recommended to be 5 mm. The minimum distance between the LGA

module and the PCB edge is 1.5 mm.

When the PCB layout is double sided, it is recommended that the LGA module

be placed on the second side for assembly.

Design of Solder Mask

The PCB pad design can be solder mask defined (SMD), or non-solder mask

defined (NSMD).

NSMD is recommended. In addition, the solder mask of the NSMD pad design is

larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 um to150 um larger than the pad, that is, the single

side of the solder mask must be 50 um to 75 um larger than the pad. The specific

size depends on the processing capability of the PCB manufacturer.

Assembly

Stencil Design

It is recommended that the stencil for the LGA module be 0.12 mm in thickness.

For the stencil design, see the following figure:

Reflow Profile

For the soldering temperature of the LGA module, see the following figure:

Reflow parameters:

Preheat zone

(40–150°C)

Time: 60–120sec Heating rate: 0.5–2°C/sec

Soak zone

(150-200°C)

Time: 60–120sec Heating rate: <1.0°C/sec

Reflow zone (>

217°C)

Time: 30–90sec Peak reflow temperature:

230–260°C

Cooling zone Cooling rate: 1°C/sec ≤Slope ≤4°C/sec

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