Intel TIGI2U - Carrier Grade Server Manuale utente

Intel®Carrier Grade Server TIGI2U User

Guide

A Guide for Technically Qualified Assemblers of Intel®Identified

Subassemblies/Products

Order Number: D15006-004

Disclaimers

Intel®Carrier Grade Server TIGI2U User Guide

Disclaimer

Information in this document is provided in connection with Intel®products. No license, express or implied, by estoppel or

otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating

to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability,

or infringement of any patent, copyright or other intellectual property right. Intel products are not designed, intended or

authorized for use in any medical, life saving, or life sustaining applications or for any other application in which the failure of

the Intel product could create a situation where personal injury or death may occur. Intel may make changes to

specifications and product descriptions at any time, without notice.

Intel server boards contain a number of high-density VLSI and power delivery components that need adequate airflow for

cooling. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when

the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel

developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow

required for their specific application and environmental conditions. Intel Corporation can not be held responsible if

components fail or the server board does not operate correctly when used outside any of their published operating or non-

operating limits.

Intel, Intel Pentium, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

United States and other countries.

*Other names and brands may be claimed as the property of others.

Preface

Intel®Carrier Grade Server TIGI2U User Guide

iii

Preface

About this Manual

Thank you for purchasing and using the Intel®Carrier Grade Server TIGI2U (Telecom

Industrial Grade Intel®Xeon™ processor 2U Server).

This manual is for system technicians who are responsible for troubleshooting, upgrading,

and repairing this Carrier Grade Server. This document provides a brief overview of the

features of the board/chassis, a list of accessories or other components you may need,

troubleshooting information, and instructions on how to add and replace components on

the Intel®Carrier Grade Server TIGI2U. For the latest version of this manual, refer to

Manual Organization

http://support.intel.com/support/motherboards/server/TIGI2U.

Chapter 1 provides a brief overview of the Carrier Grade Server TIGI2U. In this chapter,

you will find a list of the server board features, chassis features, photos of the product, and

product diagrams to help you identify components and their locations.

Chapter 2 provides instructions on adding and replacing components. Use this chapter for

step-by-step instructions and diagrams for installing or replacing components such as the

memory, processor, front panel board, the battery, and other components.

Chapter 3 provides instructions on using the utilities that are shipped with the board or that

may be required to update the system. This includes how to navigate through the BIOS

(Basic Input/Output System) Setup screens, how to perform a BIOS update, and how to

reset the password or CMOS (Complementary Metal Oxide Semiconductor). Information

about the specific BIOS settings and screens is available in the Intel®Server Board

TIGI2U Technical Product Specification. See “Additional Information and Software” for a

link to the Technical Product Specification.

Chapter 4 provides troubleshooting information. In this chapter, you will find BIOS error

messages and POST (Power-on Self Test) code messages. You will also find suggestions

for performing troubleshooting activities to identify the source of a problem.

Preface

Intel®Carrier Grade Server TIGI2U User Guide

What Your Platform Includes

Your Intel®Carrier Grade Server TIGI2U includes the following components:

One Intel®Server Board SE7502JR2

One 2U rack-mount chassis

Two hard disk drive carriers

One bracket for installing a CD ROM or DVD-ROM drive

One 600 W SSI (Server System Infrastructure) PFC (Power Factor Correction)

Four-fan assembly for cooling the processor, DIMMs (Dual Inline Memory Modules),

PCI slot and other internal components

One processor air duct

Front panel I/O board

Cables and connectors

CD-ROM drive

One IMM Advanced Module

See the Intel®Carrier Grade Server TIGI2U Hardware Reference Guide for initial

installation instructions.

Product Accessories

You may need or want to purchase one or more of the following accessory items for your

server:

One Intel®Xeon™ Processor: 3.2 GHz with an 800 MHz system bus

One processor heat sink

DDR2-400 memory DIMMs

Hard disk drives (HDDs)

PCI (Peripheral Component Interconnect) add-in card

Rack mount kit

Power cord (If not included with the platform. This product ships with a power cord in

North America only.)

For information about the accessories, memory, processors, and third-party hardware that

has been tested and can be used with your board, and for ordering information for Intel

products, see http://support.intel.com/support/motherboards/server/TIGI2U/compat.htm.

Preface

Intel®Carrier Grade Server TIGI2U User Guide v

Additional Information and Software

If you need more information about this product or information about the accessories that

can be used with this Carrier Grade Server, go to

In-depth technical information about the server board included with this Carrier

Grade Server, including BIOS settings and chipset information

http://support.intel.com/support/motherboards/server/TIGI2U/index.htm

The latest product information

Accessories or other Intel server products

Hardware (peripheral boards, adapter cards) and operating systems that have been

tested with this product

DIMMs that have been tested with this product

The power budget for this product

Software to manage your Carrier Grade Server

Diagnostics testing software

Firmware and BIOS updates

System drivers

Safety Information

WARNING

Although you may be using this guide or another resource as a

reference, before working with your server product pay close attention

to the safety instructions. You must adhere to the assembly

instructions in this guide to ensure and maintain compliance with

existing product certifications and approvals. Use only the described,

regulated components specified in this guide. Use of other products /

components will void the UL listing and other regulatory approvals of

the product and will most likely result in noncompliance with product

regulations in the region(s) in which the product is sold.

WARNING

All LAN ports of the equipment are considered Type 2 or Type 4 intra-

building ports as described in NEBS GR-1089-CORE, Issue 4. The

LAN ports are suitable for connection to intra-building or unexposed

wiring or cabling only. The LAN ports of the equipment MUST NOT

be metalically connected to interfaces that connect to the OSP or its

wiring. The addition of primary protectors is not sufficient protection in

order to connect these interfaces metalically to OSP wiring. All LAN

ports must be installed with shielded cabling which must be grounded

at both ends.

Preface

Intel®Carrier Grade Server TIGI2U User Guide

Emissions Disclaimer

To ensure EMC (Electromagnetic Compatibility) compliance with your local regional rules

and regulations, the final configuration of your end system product may require additional

EMC compliance testing. For more information, please contact your local Intel

Representative.

See “Regulatory and Integration Information” for product Safety and EMC regulatory

compliance information. This is an FCC (Federal Communications Commission) Class A

device.

Intended Uses

This product was evaluated as Information Technology Equipment (ITE), which may be

installed in Central Offices, Telecommunication Centers, offices, schools, computer

rooms, and similar commercial type locations where the National Electrical Code (NEC)

applies. The suitability of this product for other product categories and environments

(medical, industrial, OSP telecommunications, residential, alarm systems, test equipment,

etc.), other than an ITE application, may require further evaluation.

WARNING

Anchor the equipment rack: The equipment rack must be anchored to

an unmovable support to prevent it from falling over when one or

more servers are extended in front of the rack on slides. You must

also consider the weight of any other device installed in the rack. A

crush hazard exists should the rack tilt forward which could cause

serious injury.

If AC power supplies are installed:

Mains AC power disconnect: The AC power cord(s) is considered the

mains disconnect for the server and must be readily accessible when

installed. If the individual server power cord(s) will not be readily

accessible for disconnection then you are responsible for installing an

AC power disconnect for the entire rack unit. This main disconnect

must be readily accessible, and it must be labeled as controlling

power to the entire rack, not just to the server(s).

Grounding the rack installation: To avoid the potential for an electrical

shock hazard, you must include a third wire safety ground conductor

with the rack installation. If the server power cord is plugged into an

AC outlet that is part of the rack, then you must provide proper

grounding for the rack itself. If the server power cord is plugged into a

wall AC outlet, the safety ground conductor in the power cord provides

proper grounding only for the server. You must provide additional,

proper grounding for the rack and other devices installed in it.

Preface

Intel®Carrier Grade Server TIGI2U User Guide vii

Overcurrent protection: The server is designed for an AC line voltage

source with up to 20 amperes of overcurrent protection per cord feed.

If the power system for the equipment rack is installed on a branch

circuit with more than 20 amperes of protection, you must provide

supplemental protection for the server. The overall current rating of a

configured server is less than 6 amperes. It is intended that an

external Surge Protective Device (SPD) will be utilized at the AC

power service for the equipment.

If DC power supplies are installed:

Connection with a DC (Direct Current) source should only be

performed by trained service personnel. The server with DC input is to

be installed in a Restricted Access Location in accordance with

articles 110-16, 110-17, and 110-18 of the National Electric Code,

ANSI/NFPA 70. The DC source must be electrically isolated by double

or reinforced insulation from any hazardous AC source. The DC

source must be capable of providing up to 600 Watts of continuous

power per feed pair.

Main DC power disconnect: You are responsible for installing a

properly rated DC power disconnect for the server system. This mains

disconnect must be readily accessible, and it must be labeled as

controlling power to the server. The circuit breaker of a centralized DC

power system may be used as a disconnect device when easily

accessible and should be rated no more than 10 amps.

Grounding the server: To avoid the potential for an electrical shock

hazard, you must reliably connect an earth grounding conductor to the

server. The earth grounding conductor must be a minimum 14AWG

connected to the earth ground stud(s) on the rear of the server. The

safety ground conductor should be connected to the chassis stud with

a Listed closed two-hole crimp terminal having 5/8 inch pitch. The

nuts on the chassis earth ground studs should be installed with a

10 in/lbs torque. The safety ground conductor provides proper

grounding only for the server. You must provide additional, proper

grounding for the rack and other devices installed in it. The battery

return input terminal is designed as an isolated DC return (DC-I) from

the frame earth ground per NEBS GR-1089-CORE.

Overcurrent protection: Overcurrent protection circuit breakers must

be provided as part of each host equipment rack and must be

incorporated in the field wiring between the DC source and the server.

The branch circuit protection shall be rated minimum 75Vdc, 10 A

maximum per feed pair. If the DC power system for the equipment

rack is installed with more than 10 amperes of protection, you must

provide supplemental protection for the server. The overall current

rating of a server configured is 10 amperes.

Preface

Intel®Carrier Grade Server TIGI2U User Guide

viii

WARNING

Do not attempt to modify or use an AC power cordset that is not the

exact type required. You must use a power cordset that meets the

following criteria:

•Rating: In the U.S. and Canada, cords must be UL (Underwriters

Laboratories, Inc.) Listed/CSA (Canadian Standards

Organization) Certified type SJT, 18-3 AWG (American Wire

Gauge). Outside of the U.S. and Canada, cords must be flexible

harmonized (<HAR>) or VDE (Verband Deutscher

Electrotechniker, German Institute of Electrical Engineers)

certified cord with 3 x 0.75 mm conductors rated 250 VAC (Volts

Alternating Current).

•Connector, wall outlet end: Cords must be terminated in

grounding-type male plug designed for use in your region. The

connector must have certification marks showing certification by

an agency acceptable in your region and for U.S. must be Listed

and rated 125% of overall current rating of the server.

•Connector, server end: The connectors that plug into the

AC receptacle on the server must be an approved IEC

(International Electrotechnical Commission) 320, sheet C13, type

female connector.

•Cord length and flexibility: Cords must be less than 4.5 meters

(14.76 feet) long.

CAUTION

Temperature: The temperature, in which the server operates when

installed in an equipment rack, must not go below 5 °C (41 °F) or rise

above 40 °C (104 °F). Extreme fluctuations in temperature can cause

a variety of problems in your server.

Ventilation: The equipment rack must provide sufficient airflow to the

front of the server to maintain proper cooling. The rack must also

include ventilation sufficient to exhaust a maximum of 1023 BTU's

(British Thermal Units) per hour for the server. The rack selected and

the ventilation provided must be suitable to the environment in which

the server will be used.

Preface

Intel®Carrier Grade Server TIGI2U User Guide

Safety Cautions

Read all caution and safety statements in this document before performing any of the

instructions. See also Intel Server Boards and Server Chassis Safety Information on the

Resource CD and/or at

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Wichtige Sicherheitshinweise

Lesen Sie zunächst sämtliche Warn- und Sicherheitshinweise in diesem Dokument, bevor

Sie eine der Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise

zu Intel-Serverplatinen und -Servergehäusen auf der Ressourcen-CD oder unter

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

重要安全指导

在执行任何指令之前，请阅读本文档中的所有注意事项及安全声明。参见 Resource

CD（资源光盘）和/或

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm

上的

Intel Server

Boards and Server Chassis Safety Information

（《Intel

服务器主板与服务器机箱安全信息》）。

Consignes de sécurité

Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce

document avant de suivre toute instruction. Consultez Intel Server Boards and Server

Chassis Safety Information sur le CD Resource CD ou bien rendez-vous sur le site

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Instrucciones de seguridad importantes

Lea todas las declaraciones de seguridad y precaución de este documento antes de

realizar cualquiera de las instrucciones. Vea Intel Server Boards and Server Chassis

Safety Information en el CD Resource y/o en

http://support.intel.com/support/motherboards/server/sb/CS-010770.htm.

Contents

Intel®Carrier Grade Server TIGI2U User Guide

Contents

Preface .................................................................................................................iii

Intel® Carrier Grade Server TIGI2U Features .................................................. 16

Server Platform Components ..............................................................................................19

Server Platform Back Panel ................................................................................................20

Server Platform Front Panel ................................................................................................21

Server Platform Peripherals ................................................................................................22

Server Board Connector and Component Locations............................................................23

Configuration Jumpers ........................................................................................................24

Front Panel IO (FPIO) System Board ..................................................................................25

Features .....................................................................................................................25

FPIO SCSI Subsystem Status LEDs...........................................................................25

Peripheral Bay.....................................................................................................................26

Hard Disk Drives .................................................................................................................26

Interconnect System (SysCon) Board .................................................................................26

Power Supply......................................................................................................................27

System Cooling ...................................................................................................................28

Hardware Requirements .....................................................................................................28

Processor ...................................................................................................................28

Memory ......................................................................................................................29

Platform Installations and Upgrades............................................................... 33

Before You Begin ................................................................................................................33

Tools and Supplies Needed........................................................................................33

System References ....................................................................................................33

Cable Routing Reference ...........................................................................................33

Removing and Installing the Chassis Cover ........................................................................35

Removing the Chassis Cover .....................................................................................35

Installing the Chassis Cover .......................................................................................36

Removing and Installing the Front Bezel .............................................................................37

Removing the Front Bezel ..........................................................................................37

Installing the Front Bezel ............................................................................................38

Removing and Installing the Processor Air Duct..................................................................39

Removing the Processor Air Duct...............................................................................39

Installing the Processor Air Duct.................................................................................40

Installing and Removing Memory DIMMs ............................................................................41

Installing DIMMs .........................................................................................................41

Removing DIMMs .......................................................................................................42

Replacing the Processor .....................................................................................................42

Removing the Processor ............................................................................................43

Installing the Processor ..............................................................................................44

Installing or Removing a Hard Drive ....................................................................................46

Installing a Hard Drive ................................................................................................46

Removing a Hard Drive ..............................................................................................48

Replacing the CD-ROM Drive .............................................................................................48

Removing the CD-ROM / DVD-ROM Drive.................................................................49

Installing the CD-ROM / DVD-ROM Drive...................................................................50

Indice

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