PCB Piezotronics 088A Manuale utente

Model 088A

Modal punch kit includes modal punch, Model 084A80 extender, Model

Installation and Operating Manual

For assistance with the operation of this product,

contact PCB Piezotronics, Inc.

Toll-free: 800-828-8840

24-hour SensorLine: 716-684-0001

Fax: 716-684-0987

E-mail: [email protected]

Web: www.pcb.com

Manual 21354 Rev E

ECN 50523

Repair and Maintenance

PCB guarantees Total Customer Satisfaction through its

“Lifetime Warranty Plus” on all Platinum Stock Products

sold by PCB and through its limited warranties on all other

PCB Stock, Standard and Special products. Due to the

sophisticated nature of our sensors and associated

instrumentation, field servicing and repair is not

recommended and, if attempted, will void the factory

warranty.

Beyond routine calibration and battery replacements

where applicable, our products require no user

maintenance. Clean electrical connectors, housings, and

mounting surfaces with solutions and techniques that will

not harm the material of construction. Observe caution

when using liquids near devices that are not hermetically

sealed. Such devices should only be wiped with a

dampened cloth—never saturated or submerged.

In the event that equipment becomes damaged or ceases

to operate, our Application Engineers are here to support

your troubleshooting efforts 24 hours a day, 7 days a

week. Call or email with model and serial number as well

as a brief description of the problem.

Calibration

Routine calibration of sensors and associated

instrumentation is necessary to maintain measurement

accuracy. We recommend calibrating on an annual basis,

after exposure to any extreme environmental influence,

or prior to any critical test.

PCB Piezotronics is an ISO-9001 certified company whose

calibration services are accredited by A2LA to ISO/IEC

17025, with full traceability to SI through N.I.S.T. In

addition to our standard calibration services, we also offer

specialized tests, including: sensitivity at elevated or

cryogenic temperatures, phase response, extended high

or low frequency response, extended range, leak testing,

hydrostatic pressure testing, and others. For more

information, contact your local PCB Piezotronics

distributor, sales representative, or factory customer

service representative.

Returning Equipment

If factory repair is required, our representatives will

provide you with a Return Material Authorization (RMA)

number, which we use to reference any information you

have already provided and expedite the repair process.

This number should be clearly marked on the outside of

all returned package(s) and on any packing list(s)

accompanying the shipment.

Contact Information

PCB Piezotronics, Inc.

3425 Walden Ave.

Depew, NY14043 USA

Toll-free: (800) 828-8840

24-hour SensorLine: (716) 684-0001

General inquiries: in[email protected]

Repair inquiries: rma@pcb.com

For a complete list of distributors, global offices and sales

representatives, visit our website, www.pcb.com.

Safety Considerations

This product is intended for use by qualified personnel

who recognize shock hazards and are familiar with the

precautions required to avoid injury. While our equipment

is designed with user safety in mind, the protection

provided by the equipment may be impaired if equipment

is used in a manner not specified by this manual.

Discontinue use and contact our 24-Hour Sensorline if:

Assistance is needed to safely operate equipment

Damage is visible or suspected

Equipment fails or malfunctions

For complete equipment ratings, refer to the enclosed

specification sheet for your product.

Definition of Terms and Symbols

The following symbols may be used in this manual:

DANGER

Indicates an immediate hazardous

situation, which, if not avoided, may

result in death or serious injury.

Manual 21354 Rev E

ECN 50523

CAUTION

Refers to hazards that could damage

the instrument.

NOTE

Indicates tips, recommendations and

important information. The notes

simplify processes and contain

additional information on particular

operating steps.

The following symbols may be found on the equipment

described in this manual:

This symbol on the unit indicates that

high voltage may be present. Use

standard safety precautions to avoid

personal contact with this voltage.

This symbol on the unit indicates that

the user should refer to the operating

instructions located in the manual.

This symbol indicates safety, earth

ground.

Manual 21354 Rev E

ECN 50523

PCB工业监视和测量设备 - 中国RoHS2公布表

PCB Industrial Monitoring and Measuring Equipment - China RoHS 2 Disclosure Table

部件名称

有害物质

铅(Pb)

汞

(Hg)

镉

(Cd)

六价铬(Cr(VI))

多溴联苯 (PBB)

多溴二苯醚(PBDE)

住房

PCB板

电气连接器

压电晶体

环氧

铁氟龙

电子

厚膜基板

电线

电缆

塑料

焊接

铜合金/黄铜

本表格依据 SJ/T 11364 的规定编制。

O：表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下。

X：表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求。

铅是欧洲RoHS指令2011/65/ EU附件三和附件四目前由于允许的豁免。

CHINA RoHS COMPLIANCE

Manual 21354 Rev E

ECN 50523

Component Name

Hazardous Substances

Lead (Pb)

Mercury (Hg)

Cadmium (Cd)

Chromium VI

Compounds

(Cr(VI))

Polybrominated

Biphenyls (PBB)

Polybrominated

Diphenyl Ethers

(PBDE)

Housing

PCB Board

Electrical Connectors

Piezoelectric Crystals

Epoxy

Teflon

Electronics

Thick Film Substrate

Wires

Cables

Plastic

Solder

Copper Alloy/Brass

This table is prepared in accordance with the provisions of SJ/T 11364.

O: Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit

requirement of GB/T 26572.

X: Indicates that said hazardous substance contained in at least one of the homogeneous materials for this part is above the limit

requirement of GB/T 26572.

Lead is present due to allowed exemption in Annex III or Annex IV of the European RoHS Directive 2011/65/EU.

Installation and Operating Manual

Model 088A ICP® Modal Punch

Manual Number 19199

Manual Revision: NR

Contents:

1.0 Introduction …………………………………………… Page 1

2.0 Description ................................………………………. Page 2

3.0 Installation ...............................................……………... Page 2

4.0 Operation .........................................….……………….. Page 3

5.0 Testing ………………………………………………… Page 4

6.0 Calibration……………………………………………... Page 5

7.0 Maintenance ……………………………………………Page 6

8.0 Cautions ……………………………………………….. Page 6

9.0 Customer Service ……………………………………… Page 7

1.0 INTRODUCTION

The PCB® Modal Punch is ideally suited for structural behavior testing. The Modal

Punch allows the user to reach impact locations previously inaccessible by conventional

impulse hammers. Impulse testing the dynamic behavior of mechanical structures

involves positioning the Modal Punch at the desired measurement location on the

structure, then striking the force-instrumented Modal Punch with a standard non-

instrumented hammer and measuring the resultant motion with an accelerometer(s).

Integration of the acceleration signal yields velocity or displacement data for use in

computing classical transfer characteristics such as inertance, compliance, impedance,

and mobility. Structures generally respond as (1) rigid or elastic bodies, (2) finite

elements, lumped constant models, and (3) distributed parameter models conducting

stress-strain (sound) waves.

The impulse generated by the Modal Punch and the user’s standard non-instrumented

hammer consists of a nearly-constant force over a broad frequency range and is therefore

capable of exciting all resonances in that range. The physical properties of the impact

device, including size, weight, material, and velocity at impact determine the amplitude

and frequency content (wave shape) of the force impulse. The impact cap material

generally determines the frequency content. The mass of the Modal Punch and hammer,

along with the velocity at impact, determine the energy content.

The type and size of the required impact device is determined by the test structure. The

Model 088A Modal Punch was designed for use on intermediate size structures such as

automotive axles, gearbox shafts, and machine tools. Large, heavy structures such as

locomotive frames, tanks, and bridges require an instrumented sledge hammer (PCB®

model numbers 086D20 or 086D50). Small structures such as compressor blades or

some electrical circuit boards often require a miniature instrumented hammer (PCB®

model number 086D80). Some very large structures may require a special mechanical

ram instrumented with a force-sensing impact head.

The Modal Punch is instrumented with a precision, quartz, ICP®(low impedance) voltage

mode force sensor. The built-in conditioning electronics allow ease of use and test set-

up, while the naturally-polarized quartz sensing element offers long-term stability and

repeatability.

2.0 Description

The Modal Punch consists of an integral ICP® (Integrated Circuit Piezoelectric), quartz

force sensor mounted on the impact head. The sensing element and built-in, solid state

micro-electronics inside the force sensor function to transfer impact force into a low

impedance analog signal for display and analysis. The cable is connected on the side of

the Modal Punch’s Connector Adaptor model number 070A41 (supplied) just below the

impact surface. An Extension Shaft model 084A80 is also supplied to adjust the Modal

Punch to the desired length. Additional shafts may also be purchased. A foam grip is

supplied to provide a comfortable and secure grip and may be replaced when needed.

The striking end of the Modal Punch’s head has a threaded hole to accept a variety of

impact tips. The tip functions to transfer the force of the impact into the sensor and

protects the sensor face from damage. Tips of different stiffness allow the user to vary

the pulse width and frequency content of the force.

All component parts (impact head, extender, and connector adaptor) are laser-welded and

epoxied at the factory to ensure reliable operation in adverse environmental conditions.

3.0 Installation

To assemble the Modal Punch, choose the number of extenders required to reach the

desired impact location, screw the extender onto the force-instrumented impact head, and

attach the connector adaptor to the extender or the force-instrumented impact head, if an

extender is not being utilized. To ensure a proper mechanical coupling between the parts

of the Modal Punch, each piece should be securely screwed together. Care should be

used not to over-torque the parts, which will cause permanent damage to the interface and

connectors. A firm, hand-tight torque is sufficient to ensure a proper coupling. If

desired, a small amount of silicone grease (DC-4 or equivalent) may be applied between

the interfacing parts for an improved coupling.

Accelerometers install and connect according to the procedures described in the specific

sensor manual. Accelerometers utilized for impact testing include the 353 Series of

single axis accelerometers, and the 356 Series of triaxial accelerometers. For additional

information regarding sensors to meet your impact testing needs, feel free to contact the

PCB®Vibration Division customer service group by calling toll-free in the USA 888-

684-0013 (or outside the USA by calling 716-684-0001).

In general, sensors connect to the ICP®power unit at the jack labeled “XDCR”. The jack

labeled “SCOPE”is connected to the readout device, FFT analyzer, or computer. Please

consult the ICP®power unit operating guide for proper installation and operating

procedures.

4.0 Operation

Follow the below operation instructions:

1). Assemble the Modal Punch to the desired length using the supplied extension (if

required) and connector adaptor. Please reference the above installation procedures.

2). Choose the impact tip which corresponds to your excitation requirements. In general:

A. A stiffer tip is recommended for higher frequency response.

B. A softer tip is recommended for improved low frequency response.

3). Connect the Modal Punch to an ICP®power supply or equivalent with a coaxial cable

(not supplied). The Modal Punch requires a 10-32 microdot connector plug.

4). Connect the corresponding output cable (not supplied) from your ICP® power supply

to your readout device. This step is not necessary if ICP® power is built into your

readout device. Tighten the cable connectors securely by hand to ensure good electrical

contact.

5). Install accelerometer(s) in the desired measurement location(s), referring to the

appropriate operating guides for the accelerometer(s) and power supplies being used.

6). Switch power on and wait a minute for the sensor amplifier to turn on and the

coupling capacitor to fully charge.

7). Check the ICP® power unit meter for normal operation. Normal operation is indicated

when the meter pointer is pointing in the green area. If the meter reads in the red area,

look for a shorted cable or connection. If the meter pointer is pointing in the yellow area,

look for open cables or connections.

8). When all power unit meters indicate normal operation (meter pointer is pointing in the

green area), proceed with tests, following all sensor, power unit, and analyzer operating

instructions.

PCB®’s ICP® constant-current power supply units provide the necessary excitation power

for proper operation of the Modal Punch. These units provide the correct power and have

circuit fault indicating meters and a bias decoupling capability to remove MOSFET turn

on bias voltage from the measurement signal. Power units are available in a variety of

configurations, including battery or AC versions and with additional signal conditioning

features such as gain, filtering, and integration. Some FFT analyzers incorporate the

proper excitation power for direct connection to ICP® sensors. Be certain to confirm that

the excitation from the power supply conforms to the requirements for the specific

sensors being used. The Modal Punch requires 2 to 20 mA constant current and 24 to 27

VDC.

CAUTION: The Modal Punch was designed to operate only with ICP® power supply

units. Do not attempt to troubleshoot the Modal Punch by connecting it to any device,

such as an ohmmeter, which may introduce unregulated voltage, as damage to the

precision internal micro-electronics may occur. If there is any doubt about the

compatibility of a power supply unit or whether a power supply unit is required, feel free

to contact the PCB®Vibration Division customer service group by calling toll-free in the

USA 888-684-0013 (or outside the USA by calling 716-684-0001).

5.0 Testing

To test the behavior of your structure and to tailor the frequency bandwidth of the impact

force, follow the below operation instructions:

1). Position the Modal Punch on the test structure at the desired location. Strike the

punch with a standard non-instrumented hammer and process the results. Always take

several averages to reduce the effects of spurious noises. CAUTION: Never impact

without a tip properly installed on the Modal Punch, as permanent damage of the sensing

element is likely to occur. Also, care should be exercised when striking the punch to

ensure that the impact hammer does not slip and strike the operator’s hand, causing

personal injury.

2). Check the measured results for signal quality (adequate signal-to-noise) and no

overloads (overloads lights or sharp flattening of time history peaks).

3). Analyze the results for frequency content and check to ensure that the reasonably flat

portion of the force spectrum is sufficient to cover the structural resonances of interest

present in the acceleration spectrum. Often, signal energy is sufficient to excite structural

resonances at 20 dB below initial low frequency force levels.

4). Change Modal Punch tips to modify dynamic behavior, if necessary. The following

are general guidelines; the specific test structure plays an integral part in the selection:

A. To obtain higher frequency response, use a stiffer, harder tip and a smaller

hammer mass.

B. To obtain improved low frequency response, use a softer hammer tip and

larger hammer mass.

C. To increase signal energy of impact, increase the impact velocity and/or

hammer mass.

5). Repeat steps 1 through 4 until satisfactory results are obtained.

Generally speaking, the impact tips affect the impulse frequency content, while the mass

of the impact device and velocity of impact affect the signal energy level. Frequency

content and energy level are interrelated. Therefore, both will be affected by different

hammer structures and Modal Punch configurations. Hammer velocity at impact will

also affect both. In general, massive structures with lower stiffness require the use of a

soft impact tip and large mass to adequately excite low frequency resonances.

During testing, occasionally check and tighten the electrical and mechanical connections.

Repeated impacting may loosen connections, which may result in erratic, noisy signals.

Multiple impacts or penetration into the structure may occur when using too heavy a

mass on too light a structure. This will appear as a series of peaks of decreasing

amplitude in the time history data. Reject such data. Careful techniques used in the

impact process can avoid this problem. In particular, if the Modal Punch is held against

the test structure and allowed to freely recoil after impact, the double impact phenomena

will be reduced or eliminated. Some skill and practice may be required to perfect this

technique.

Distortion, undershoot, and oscillation of the analyzer display is caused by ringing of the

analyzer’s anti-aliasing filters. This behavior is normal. To view the correct impulse

waveform, switch the analyzer to a higher frequency range.

6.0 Calibration

Calibration involves testing the functional transfer behavior (sensitivity) of the sensor

under controlled laboratory conditions. Sensitivities to various inputs such as force,

temperature, current, and frequency can be derived by relating the corresponding output

to changes in these inputs. For impact hammers and the Modal Punch, the most

important of these relationships is the sensitivity to the force input. The desired behavior

is linear, since ideal sensors treat output and input amplitudes proportionally. In addition,

the nominal sensitivity should be constant (linear frequency response) within the specific

frequency range, and there should be no induced phase shift in the response (no delay in

the signal).

Different Modal Punch and hammer combinations have different sensitivities because the

structure experiences a force greater than the crystal-sensing elements. The force of

impact on the test structure is a function of the total mass of the Modal Punch and

hammer, while the force on the crystals is a function of the mass behind them. The

impact tip is located in front of the crystal. The differences in mass depend on the ratio

of the tip mass to the mass behind the crystal. This is automatically compensated for

when the Modal Punch is properly calibrated.

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