IWILL LE370 Manuale utente

EC Declaration of Conformity

Iwill Corp.

No. 10, Wu Chuan 3rd Rd.,

Hsin Chuang City, Taipei,

Taiwan, R.O.C.

Declare under sole responsibility that the

LE370 motherboard

Meets the intent of Directive 89/336/ECC for Electromagnetic Compatibility. Compliance was

demonstrated to the following specifications as listed in the official Journal of the European

Communities:

EN 50081-1 Emissions:

EN 55022 Radiated, Class B

EN 55022 Conducted, Class B

EN 60555-2 Power Harmonics

EN 50082-1 Immunity:

IEC 801-2 Electrostatic Discharge

IEC 801-3 RF Radiate

IEC 801-4 Fast Transient

About This Manual

This manual will introduce to the user how this product is consisted. All useful information will be

described in later chapters. Keep this manual for your future upgrade or system re-configuration.

Chapter 0 Overview

The features and specifications of this motherboard

Chapter 1 Quick Installation

The quick reference for experienced users

Chapter 2 Hardware Installation

The detailed information on jumper setting, connection, and hardware installation

Chapter 3 System BIOS Setup

The detail information of the system BIOS setup options

Chapter 4 Software and Tools

The detail information for install software and tools.

This manual contains information protected by copyright law. All rights are reserved. No any part

of this document may be used or reproduced in any forms or by any means, or stored in a database

or retrieval system without prior written permission from Iwill Corp.

This manual is subject to change without notice.

Trademark

Intel / Pentium are trademarks of Intel Corporation.

IWILL and IWILL logo are trademarks of IWILL Corp.

Sound Blaster is a registered trademark of Creative Technology Ltd.

Sound Blaster-LINK and SB-LINK are trademarks of Creative Technology Ltd.

And all other product names are trademarks and registered trademarks of their respective owners.

Warning

Most of the features of this product have passed strict verification and are subject to change at any

time without notice. If any malfunction occurs due to the future technical changes made by the

respective component manufacturers, Iwill assumes no responsibility or liability for it.

Content

CHAPTER 0.................................................................................................5

OVERVIEW.................................................................................................5

0.1 FEATURES ..............................................................................................5

0.2 ENVIRONMENT REQUIREMENTS...............................................................7

0.3 MOTHERBOARD COMPONENTS PLACEMENT.............................................8

0.4 BACK PANEL CONNECTORS...................................................................11

0.5 FORM FACTOR......................................................................................12

CHAPTER 1...............................................................................................13

QUICK INSTALLATION..........................................................................13

CHAPTER 2...............................................................................................16

HARDWARE INSTALLATION ................................................................16

2.1 PREPARATION AND INSPECTION .............................................................16

2.2 UNPACK THE LE370 .............................................................................16

2.3 INSTALLATION PROCEDURES..................................................................16

CHAPTER 3...............................................................................................25

SYSTEM BIOS SETUP..............................................................................25

3.1 INTRODUCTION.....................................................................................25

3.2 MAIN MENU.........................................................................................27

3.3 STANDARD CMOS SETUP ...............................................................27

3.4 BIOS FEATURES SETUP...................................................................30

3.5 CHIPSET FEATURES SETUP ............................................................34

3.6 POWER MANEGEMENT SETUP......................................................37

3.7 PNP/ PCI CONFIGURATION .............................................................41

3.8 INTEGRATED PERIPHERALS ..........................................................43

3.9 LOAD SETUP DEFAULTS.................................................................46

3.10 IWILL SMART SETTING.................................................................46

3.11 SUPERVISOR / USER PASSWORD SETTING.................................47

3.12 IDE HDD AUTODETECTION..........................................................47

3.13 SAVE & EXIT SETUP.......................................................................47

3.14 EXIT WITHOUT SAVING................................................................47

CHAPTER 4...............................................................................................48

SOFTWARE AND TOOLS........................................................................48

4.1 SOFTWARE INSTALLATION.....................................................................48

4.2 HOW TO MAKE DRIVER DISKETTE ..........................................................49

4.3 VIEW DETAILED MANUAL.....................................................................49

4.4 CPU FREQUENCY SELECTION BY BIOS..................................................50

4.5 HOW TO USE THERMAL SENSOR.............................................................51

4.6 HOW TO INSTALL AUREAL A3D SOUND DRIVER.....................................52

Chapter 0

Overview

Thank you for purchasing Iwill LE370 motherboard. This operation manual will instruct you how

to configure and install the system properly. It contains an overview about the engineering design

and features of this product. Also, this manual provides useful information for later on upgrade or

configuration change. Keep this for your future need.

YEAR 2000 issue

The IBM compatible PC utilizes a Motorola MC146818 compatible Real-Time Clock (RTC) chip

to maintain the date and time. Unfortunately, the “century”is not manipulated by the RTC. It uses

8-bit of information to report the year and can only hold the last two digits of a year in packed BCD

format. So 1997 is reported solely as 97. Since the RTC also contains non-volatile memory, IBM

specified a location in the memory to hold “century”information. By combining the century data

with the year data, software can obtain a full 4-digit year. When the Year 2000 occurs, the RTC

reports the year as ’00’and the “century”in RTC memory will contain ’19.’Combining the full 4-

digit year yields 1900, not 2000. Any applications which compares dates, or uses relative dates to

perform functions will see an incorrect dates.

Motherboards contain BIOS, which is one of the key ingredients to check for systems designed to

handle the year 2000. All motherboards currently shipped from Iwill contain BIOS capable of

handling the year 2000 date correctly. The BIOS contains a feature that checks the least two

significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the

date and, if less than `80', updates the century byte to `20'. This feature enables operating systems

and applications using the BIOS date/time services to reliably manipulate the year as a four-digit

value.

Be aware that the BIOS capability alone does not ensure that the system will handle the transition

correctly. Other system components such as the operating system and application software also

need to be able to handle the year 2000 date and recognize the date format from other pieces.

0.1 Features

0.1.1 Processor

Socket 370 processes support

Supports 66 MHz bus speed

0.1.2 Core Logic

Intel 1621 PCI/A.G.P. controller

Integrated DRAM controller

Integrated PCI bus mastering controller

Integrated Accelerated Graphics Port (A.G.P.) bus controller

Intel PCI/ISA/IDE Xcelerator

Multifunction PCI-to-ISA bridge (PCI Rev 2.1 compliant)

Integrated IDE controller with Ultra DMA/33 support

USB host interface with support for two USB ports

Enhanced DMA controller and standard Interrupt controller and Timer function

System Management Bus (SMB) with support for DIMM Serial PD

0.1.3 Main Memory

Three 168-pin DIMM (Dual In Line Memory Module) sockets

Supports up to 768 MB of 3.3 V Unbuffered SDRAM DIMM

Supports up to 384 MB of 3.3 V Extended Data Out (EDO) memory

64-bit data interface with ECC support (SDRAM only)

0.1.4 Multi I/O

Winbond W83977EF super I/O controller

Supports two floppy disk drives (include 3 Mode drive) and / or QIC-80 tape drive

Supports one multi-mode parallel port

Supports two high speed 16550 FIFO serial ports

Integrated keyboard controller

Integrated PS/2 mouse controller

Support Keyboard-Power-On function

Support Power Fail Recovery

0.1.5 Expansion slots

Two ISA slot

Five PCI slot

One A.G.P. slot

0.1.6 Form Factor

Compliance with ATX Version 2.01 specification

Supports ATX power supply connector

Supports the remote on/off switch

Physical dimensions: length: 189 mm / width: 305 mm

0.1.7 Manageability

Winbond W83781 System Hardware Monitor

Wake on LAN header for use with add-in network interface cards (NICs)

0.1.8 Other features

Award BIOS

Using Flash ROM to provide on-board-upgrade ability without changing components

Plug and Play compatible

Supports Advanced Power Management (APM)

Supports Creative SB-LINK to deliver Sound Blaster 16 compatibility

AUREAL 32-bit PCI audio onboard compatibility

0.2 Environment Requirements

Temperature 0-55 degrees C (operating or storage)

5% to 95% non-condensing relative humidity

At least a 250 W power supply

The power supply must comply with the following recommendations found in the spec.:

The potential relation between 3.3 VDC and +5 VDC power rails

The current capability of the +5VSB line

ATX Power supply must comply with ATX spec. 2.01. ( 5VSB >= 1A)

0.3 Motherboard Components Placement

The following figure shows the location of the motherboard components.

VCC

IRRX

GND

IRTX

IRMODE

1--2:Normal

2--3:Clear CMOS

JP1

LID-ON

GND

5VSB

WOL

FAN1

AGP

SOCKET 370

USB

PWR

DIMM0~2

FDC

FAN2

GND

+12V

SENSE

IDE0

IDE1

J43

LPT

J55

PCIx

PWR ON

FAN3

JP5

Game/Midi Port

MIC

Line Out

Line In

J52

RST ALED

SPKR

Cathode-

Anode+

Reset

GND

VCC

Cathode-

Anode+

Buzz

GND

Keylock

GND

NC PLED

ACPI LED

Anode+ Cathode-

ISAx

SB-LINK

GNT#

GND

REQ#

GND

SIRQ

JP44

JP43

JP42

J53

JP45

JP8

Tmp3

Tmp2

Location ScreenPrinting Description

J3 Socket 370 Socket 370 connector

J5--J7 DIMM 0--2 168-pin DIMM Sockets

J11 AGP A.G.P. connector

J12-16 PCI1--5 PCI expansion slots

J21-22 ISA 1-2 ISA expansion slots

J28 IDE 0 Primary IDE connector

J29 IDE 1 Secondary IDE connector

J30 FDC Floppy drive connector

J31 S1 Serial 1 connector

J32 S2 Serial 2 connector

J33 LPT Parallel connector

J34 USB Two USB connectors

J35 MS PS/2 mouse connector

J35 KB PS/2 keyboard connector

J37 PWR ATX power connector

J39 FAN1 Processor fan header

J40 FAN2 System fan header

J41 FAN3 System fan header

J42 PWR ON Power on/off header

J43 J43 Front panel I/O header

ACPI LED (pins 1--2): ACPI LED header

ALED (pins 5--6): IDE LED header

RST (pins 9--10): Reset Switch header

PLED (pins 11--13): Power LED header

KL (pins 14--15): Keylock switch header

SPKR (pins 17--20): Speaker header

J44 SB-LINK Creative SB-LINK header

J45 IR IR (infrared) connector

J46 WOL Wake On LAN header

J49 Tmp1 Temp. sensor header

J50 Tmp2 Temp. sensor header

J51 Tmp3 Temp. sensor header

J52 KB ON Keyboard Power On connector

J53 J53 AUX in

J55 J55 CD in

J56 Game_Audio Audio Port Connector/ Joystick/Midi Connector

JP1 CLRTC Clear CMOS jumper

JP5 JP5 PCI compatibility jumper

JP8 JP8 Audio ON/OFF

JP42 JP42 Keyboard password Power on connector

JP43 JP43 SMBUS Connect

JP44 JP44 Internal Modem Wake up connect.

JP45 JP45 Chassis Intrusion detection header

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