Texas Instruments TMP1820EVM Manuale utente

EVM User's Guide: TMP1820EVM

TMP1820 Evaluation Module

Description

The TMP1827EVM is designed to provide a quick

setup to evaluate TMP182x devices and gain

familiarity with the devices down to the bit-by-

bit register level. The printed circuit board (PCB)

perforation allows users to separate the TMP1827

from the USB interface. To evaluate TMP1820,

the sensor portion of the TMP1827EVM should be

snapped off, and the TMP1820LPG inserted as

shown.

Get Started

1. Order the TMP1827EVM and TMP1820LPG on

ti.com.

2. Visit TMP1820EVM to launch or download the

GUI software.

Features

• Evaluate TMP182x devices using the provided

software or prototype on standard 0.1-inch

breadboards

• Software powered by GUI Composer runs in

a browser on Windows®, Mac®, and Linux®

operating systems

Applications

•Factory automation and control

•Appliances

•Medical accessories

•CPAP machines

• Battery charger ICs

•EV charging infrastructure

• LED lighting

•Temperature transmitters

• Cold chain

www.ti.com Description

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TMP1820 Evaluation Module 1

1 Evaluation Module Overview

1.1 Hardware Notice

The TMP1820EVM hardware is not available for purchase during TMP1820 product preview. Please order a

TMP1827EVM, a TMP1820 sample, and connect the sample device to the TMP1827EVM. The TMP1820EVM

software described in this document must be used with the modified EVM.

1.2 Introduction

The TMP1827EVM allows users to evaluate the performance of the TMP1820 digital temperature sensor. The

EVM comes in a USB stick form factor, with an onboard MSP430F5528 microcontroller that interfaces with both

the host computer and the TMP1820 device using a 1-Wire interface. The module is designed with perforations

between the sensor and host controller on the EVM board. The perforation allows the user flexibility in their

evaluation:

• The user can connect the TMP1820 to the user's system/host.

• The user can connect the EVM host and software to the user's system with TMP1820 devices.

• Small individual boards allow the user to place sensors in the user's system.

• Hole spacing is compatible with common 0.1" prototyping breadboards

This user's guide describes the characteristics, operation, and use of the TMP1827EVM evaluation board. The

user's guide details how to set up and configure the software, lists the hardware, and reviews various aspects of

the software operation. Throughout this document, the terms evaluation board, evaluation module, and EVM are

synonymous with the TMP1827EVM. This user's guide also provides information on the operating procedure,

input and output connections, an electrical schematic, printed circuit board (PCB) layout drawings, and a parts

list for the EVM.

1.3 Kit Contents

Table 1-1 lists the contents of the EVM kit. Contact the Texas Instruments Product Information Center nearest

you if any components are missing. TI highly recommends that users check the TI website at https://www.ti.com

to verify that the latest versions of the related software is being used.

Table 1-1. Kit Contents

Item Quantity

TMP1827EVM 1

TMP1820LPG 1

1.4 Specification

PARAMETER CONDITIONS MIN TYP MAX UNIT

VUSB 5 V

3P3V, SDQ 3.3 V

3P3V, SDQ S1 = ON 1.7 5.5 V

MCU TMP1820 Temperature

Source

GPIO SDQ

VDD

GND

1.8 V

10 kΩ

0.1 µF

GND

Evaluation Module Overview www.ti.com

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1.5 Device Information

The TMP1820 is 1-Wire®, high-accuracy, digital output temperature-sensor. Each device incorporates a factory-

programmed 64-bit unique identification number used for addressing and allowing NIST traceability. The 1-Wire

interface supports both a standard communication mode enabling legacy applications and an overdrive mode,

with up to 90kbps data rate, enabling faster communication present in modern application. Operating in the

overdrive mode allows lowering the bus power as low as 1.7V. In bus-powered mode, the simplest mode of

operation, the TMP1820 1-Wire interface requires only a single connection and a ground return.

2 Hardware

2.1 Perforations

The perforation between the USB controller board and TMP1820 sensor board is designed to allow separation

of the sensor and controller. The holes support standard 0.1" pitch headers. The pins are labeled with their

functions on both sides. The small sensor board can be placed in-system, or the controller can be used to test a

sensor which is part of another system.

2.2 Subregulator

The switch S1 enables and disables the onboard 3.3-V regulator: U8. When the subregulator is enabled,

the green LED D3 illuminates. The subregulator must be enabled for normal operation of TMP1820EVM. A

possibility is to supply other voltages at the 3P3V pin when the subregulator is disabled.

2.3 Logic Level Translator

The translators U3 and U6 separates the MSP430 UART host from the TMP1820 device. This is not required for

end applications, but the translator is provided on the EVM as a courtesy. When the subregulator is disabled, a

voltage between 1.7 V and 5.5 V can be applied at the 3P3V net, which is the 3.3-V pin on the perforation. This

external voltage illuminates the green LED D3 and power the TMP1820 device.

2.4 Programming Header

The TMP1820EVM comes loaded with firmware that is necessary for the correct operation of the USB interface

and PC GUI software. The unpopulated header, J2, is provided for Spy-Bi-Wire access to the MSP430F5528. TI

does not recommend that users access this header or reprogram the device.

2.5 BSL Button

The TMP1820EVM features push-button SW1 for entering USB BSL mode. This can be used for firmware

updates. The button must be held down while the user plugs in the USB and can be released afterward.

2.6 Status LED

The red LED (D4) indicates status in the USB2ANY firmware. A blinking LED indicates the MSP430F5528 is

waiting for USB connection from the GUI application. At initial power on, or when connected to the GUI, the LED

turns off.

www.ti.com Evaluation Module Overview

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TMP1820 Evaluation Module 3

3 Software

3.1 Software Installation

The PC GUI Software for TMP1820EVM runs on TI's GUI Composer framework. The software is available as a

live version, which runs in a browser, and is available as a download for offline use. The software is compatible

with Windows, Mac, or Linux operating systems.

3.1.1 Live Software on dev.ti.com

The live software currently works on Chrome™, Firefox®, and Safari® browsers. Internet Explorer® is not

supported. Users can access the live version through one of the following actions:

• Click on TMP1820EVM.

• Go to the EVM tool page and click the View button.

• Go to dev.ti.com/gallery, log in with myTI account credentials, and search for TMP1820.

Click the application icon within the gallery to launch the software. Agree to the prompts to install or update the

TI Cloud Agent Bridge browser plug-in. The plug-in is necessary for connection to the USB hardware.

3.1.2 Download from dev.ti.com

Users can access the latest version of the offline software by navigating to the live version as noted above. Look

for the download icon and download both the application and run time for the operating system as shown in

Figure 3-1.

Figure 3-1. Download Pop-Up

Software www.ti.com

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3.2 Home Tab

The Home tab is shown at software launch. The icons on the bottom of this tab are shortcuts to the other

functional tabs of the GUI, and correspond to the icons on the left-hand-side of the GUI.

Figure 3-2. Home

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TMP1820 Evaluation Module 5

3.3 Data Capture Tab

The Data Capture tab reports the temperature from the TMP1820 device included on the TMP1820EVM.

• Temperature data is polled and displayed by default. To disable polling or change the polling rate, use the

Polling Rate drop-down menu under the Chart Controls tile on the right. The CONVERT TEMP command

(0x44) is sent automatically while polling. The polling rate setting on the Data Capture tab is synchronized

with the polling rate setting on the Registers tab.

• Temperature data can be saved to file when received using the Save Start and Save Stop buttons. Note that,

when the online version of the GUI is used, a download begins in your browser. This download is lost if the

GUI is closed. When the offline version of the GUI is used, the file is appended as data is received. In this

case, appended data is not lost if the GUI is closed.

Figure 3-3. Data Capture

Software www.ti.com

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3.4 Registers Tab

The Registers tab interacts with the ScratchPad-1 registers within the TMP1820 device.

The Auto Read drop-down menu configures polling of register contents. When Auto Read is off, click Read

the contents of all registers at once. The Write Register button is grayed and disabled when the drop-down

menu next to the button is set to Immediate. Immediate mode triggers a write operation each time a register is

modified. When Deferred mode is selected, the Write Register button is enabled, and write operations are not

performed unless the Write Register button is clicked. These settings give the user total control over bus activity,

and enable individual transactions to be easily observed with an oscilloscope, logic analyzer, or bus-sniffing

device.

Figure 3-4. Registers

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TMP1820 Evaluation Module 7

4 Hardware Design Files

4.1 Schematic

VBUS

220 ohm

L1 3P3V

3NC 4

OUT 5

GND

TLV70033DCKR

DM VBUS

VBUS

D-

D+

GND

2.2uF

6.2V

BZT52C6V2T-7

100k

1.0k

GND

10uF

GND

6.2V

BZT52C6V2T-7 1.00M

1.50k

GND

10pF

16V

10pF

16V

GND

PUR

GNDGND

Green

GND

D1+

GND 2

D2+ 3

D2- 4

VCC

D1-

TPD4S009DRYR

GNDGND

VCC

110

MP2MP1

MP3 MP4

SW1

GND

0.1uF

10V

GNDGND

BSL

3P3V

VCC

3NC 4

OUT 5

GND

TLV70033DCKR

VCC

VBUS

VCORE VUSB

2.2uF

V18

GND

SBWTCK

10uF

Header_3x1

DNP

GND

SBWTDIO

0.47uF

6.3V

0.47uF

6.3V

0.47uF

6.3V

C10

GND GNDGND GND

GND

VCC

Super Red

1.0k

R13

XT2IN

MSP430F5528IRGCR

P6.0/CB0/A0 1

P6.1/CB1/A1 2

P6.2/CB2/A2 3

P6.3/CB3/A3 4

P6.4/CB4/A4 5

P6.5/CB5/A5 6

P6.6/CB6/A6 7

P6.7/CB7/A7 8

P5.0/A8/VREF+/VEREF+

P5.1/A9/VREF-/VEREF-

AVCC1

P5.4/XIN

P5.5/XOUT

AVSS1 14

DVCC1

15 DVSS1 16

VCORE

P1.0/TA0CLK/ACLK

P1.1/TA0.0

P1.2/TA0.1

P1.3/TA0.2

P1.4/TA0.3

P1.5/TA0.4

P1.6/TA1CLK/CBOUT

P1.7/TA1.0

P2.0/TA1.1 26

P2.1/TA1.2 27

P2.2/TA2CLK/SMCLK 28

P2.3/TA2.0 29

P2.4/TA2.1 30

P2.5/TA2.2 31

P2.6/RTCCLK/DMAE0 32

P2.7/UCB0STE/UCA0CLK 33

P3.0/UCB0SIMO/UCB0SDA

P3.1/UCB0SOMI/UCB0SCL

P3.2/UCB0CLK/UCA0STE

P3.3/UCA0TXD/UCA0SIMO

P3.4/UCA0RXD/UCA0SOMI

DVSS2 39

DVCC2

P4.0/PM_UCB1STE/PM_UCA1CLK 41

P4.1/PM_UCB1SIMO/PM_UCB1SDA 42

P4.2/PM_UCB1SOMI/PM_UCB1SCL 43

P4.3/PM_UCB1CLK/PM_UCA1STE 44

P4.4/PM_UCA1TXD/PM_UCA1SIMO 45

P4.5/PM_UCA1RXD/PM_UCA1SOMI 46

P4.6/PM_NONE 47

P4.7/PM_NONE 48

VSSU 49

PU.0/DP

PUR

PU.1/DM

VBUS

VUSB

V18

AVSS2 56

P5.2/XT2IN

P5.3/XT2OUT

TEST/SBWTCK 59

PJ.0/TDO 60

PJ.1/TDI/TCLK 61

PJ.2/TMS 62

PJ.3/TCK 63

RST/NMI/SBWTDIO 64

QFN PAD 65

XT2OUT

4NC

VCC

33.0k

R14

PUR

SBWTDIOV18

VCORE SBWTCK

VBUS

2200pF

50V

C14

VUSB

VCC

GND

0.1uF

10V

C15

0.1uF

10V

C16

0.1uF

10V

C17

GNDGND GND

VBUS = 5V INPUT

VUSB = 3.3V OUT

VUSB 12mA Max

0.1uF

10V

C13

GND

3P3V

390

VCCA

DIR

5GND 2

VCCB 6

SN74LVC1T45DCKR

MCU_TX

MCU_RX

3P3V

VCC

GND

0.1uF

10V

C18

0.1uF

10V

C19

GNDGND

VCCA

DIR

5GND 2

VCCB 6

SN74LVC1T45DCKR

MCU_TX 2 4

SN74LVC1G07DCKT

U7A

GND 3

VCC

SN74LVC1G07DCKT

U7B

3P3V

SDQ

0.1uF

10V

C20

3P3V

GND GND

340ohm min

connect vdd to gnd for parasitic mode

GNDGND

R10

DNP

SDQ

VDD

1IO0 6

IO1 7

IO2 8

IO3 5

ADDR

SDQ

GND 4

Thermal_Pad 9

TMP1827NGR

GND GND

Figure 4-1. Schematic

Hardware Design Files www.ti.com

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4.2 PCB Layout

Figure 4-2. PCB Top

Figure 4-3. PCB Bottom

www.ti.com Hardware Design Files

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TMP1820 Evaluation Module 9

4.3 Bill of Materials

Table 4-1 lists the bill of materials for TMP1820EVM.

Table 4-1. Bill of Materials

Designator Quantity Value Description Package Reference Part Number Manufacturer

!PCB1 1 Printed Circuit Board SENS091 Any

C1, C6 2 2.2uF CAP, CERM, 2.2 uF, 16 V, +/- 10%, X5R, 0402 0402 GRM155R61C225KE11D MuRata

C14 1 2200 pF CAP, CERM, 2200 pF, 50 V, +/- 5%, X7R, 0402 0402 CL05B222JB5NNNC Samsung Electro-

Mechanics

C2, C7 2 10uF CAP, CERM, 10 uF, 10 V, +/- 20%, X5R, 0603 0603 C1608X5R1A106M080AC TDK

C3, C4 2 10 pF CAP, CERM, 10 pF, 16 V,+/- 10%, C0G, 0402 0402 C0402C100K4GACTU Kemet

C5, C13, C15, C16,

C17, C18, C19,

C20

8 0.1uF CAP, CERM, 0.1 uF, 10 V,+/- 10%, X5R, 0402 0402 LMK105BJ104KV-F Taiyo Yuden

C8, C9, C10 3 0.47uF CAP, CERM, 0.47 uF, 6.3 V, +/- 10%, X7R, 0402 0402 JMK105B7474KVHF Taiyo Yuden

D1, D2 2 6.2V Diode, Zener, 6.2 V, 300 mW, SOD-523 SOD-523 BZT52C6V2T-7 Diodes Inc.

D3 1 Green LED, Green, SMD LED, GREEN, 0603 SML-LX0603GW-TR Lumex

D4 1 Super Red LED, Super Red, SMD LED_0603 150060SS75000 Wurth Elektronik

J1 1 Connector, Plug, USB Type A, R/A, Top Mount

SMT

USB Type A right angle 48037-1000 Molex

J2 0 Header, 2.54 mm, 3x1, Gold, TH Header, 2.54 mm, 3x1, TH GBC03SAAN Sullins Connector

Solutions

L1 1 220 ohm Ferrite Bead, 220 ohm @ 100 MHz, 0.45 A, 0402 0402 BLM15AG221SN1D MuRata

R1, R2 2 22 RES, 22, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ220X Panasonic

R10 0 0 RES, 0, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW04020000Z0ED Vishay-Dale

R14 1 33.0k RES, 33.0 k, 1%, 0.063 W, 0402 0402 RC0402FR-0733KL Yageo America

R3 1 100k RES, 100 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ104X Panasonic

R4, R13 2 1.0k RES, 1.0 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ102X Panasonic

R5 1 1.00Meg RES, 1.00 M, 1%, 0.063 W, AEC-Q200 Grade 0,

0402

0402 RMCF0402FT1M00 Stackpole Electronics

Inc

R6 1 1.50k RES, 1.50 k, 1%, 0.063 W, AEC-Q200 Grade 0,

0402

0402 RMCF0402FT1K50 Stackpole Electronics

Inc

R7 1 47 RES, 47, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ470X Panasonic

R8 1 110 RES, 110, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF1100X Panasonic

Hardware Design Files www.ti.com

10 TMP1820 Evaluation Module SBOU313 – AUGUST 2023

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